• Current Applied Physics
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• v.18 no.12
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• pp.1523-1527
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• 2018

The thermal stability, magnetic and magnetocaloric properties of $Gd_{55}Co_{35}M_{10}$ (M = Si, Zr and Nb) melts-pun ribbons were studied. The relatively high reduced glass transition temperature ($T_{x1}/T_m$ > 0.60) and low melting point ($T_m$) resulted in excellent glass forming ability (GFA). The Curie temperatures ($T_C$) of melt-spun amorphous ribbons $Gd_{55}Co_{35}M_{10}$ for M = Si, Zr and Nb were 166, 148 and 173 K, respectively. For a magnetic field change of 2 T, the values of maximum magnetic entropy change $(-{\Delta}S_M)^{max}$ for $Gd_{55}Co_{35}Si_{10}$, $Gd_{55}Co_{35}Zr_{10}$ and $Gd_{55}Co_{35}Nb_{10}$ were found to be 2.86, 4.28 and $4.05J\;kg^{-1}K^{-1}$, while the refrigeration capacity (RC) values were 154, 274 and $174J\;kg^{-1}$, respectively. The $RC_{FWHM}$ values of amorphous alloys $Gd_{55}Co_{35}M_{10}$ (M = Si, Zr and Nb) are comparable to or larger than that of $LaFe_{11.6}Si_{1.4}$ crystalline alloy. Large values of $(-{\Delta}S_M)^{max}$ and RC along with good thermal stability make $Gd_{55}Co_{35}M_{10}$ (M = Si, Zr and Nb) amorphous alloys be potential materials for magnetic cooling operating in a wide temperature range from 150 to 175 K, e.g., as part of a gas liquefaction process.

• Journal of the Korean Ceramic Society
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• v.31 no.7
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• pp.695-702
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• 1994

Current study was undertaken to explain the structural evolution and corresponding changes in the properties of calcium aluminate glasses with the variation of SiO2 doping concentration. Calcium aluminate glasses in the compositional ranges of (100-x)(0.6CaO+0.4Al2O3)+xSiO2(where x=0~60) were fabricated. DTA analysis confirmed an anomalous behavior in glass transition temperature (Tg) with the maximum of 887$^{\circ}C$ and minimum of 859$^{\circ}C$ when x=5 and 50, respectively. densities and refractive indices monotonically decreased with increasing SiO2 content and IR transmitting cutoff shifted to shorter wavelength side when the amount of added SiO2 exceeded 5 mole%. IR fundamental vibration absorption peaks showed the change that NBOs were inclined to SiO4 tetrahedron in the low-silica region and NBO per SiO4 tetrahedra changed from 2 to 0 with increasing silica content. Based on the analysis of IR fundamental vibration absorption peaks, the model of the structural change can be proposed in three step: 1) SiO4 scavenged the NBOs located at AlO4-tetrahedra, which resulted in the increased of Tg values, 2) NBOs located in the main network again with a decrease in Tg, and 3) dominated by the decrease in the relative amount of NBOs in the glass system, where Tg re-increased.

• Composites Research
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• v.31 no.2
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• pp.63-68
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• 2018

Thermoplastic composite has been limitedly used in high performance aerospace industry due to relatively low mechanical properties even though it has various advantages. But, thermoplastic aromatic polymer composite has recently been researched and utilized much. In this study, PEEK and PPS neat resin film as representative thermoplastic aromatic polymer were processed through continuous heating, cooling and reheating cycle. Property change such as glass transition temperature and melting temperature were identified and crystallinity variation by different cooling rate were evaluated. In the first (heating) run, polymer specimens were kept for 5 minutes at higher temperature than melting point to remove previous thermal history, and crystallization reaction was controlled by adjusting cooling rate to 2, 5, 10, 20 and $40^{\circ}C/minute$ in the second (cooling) run. In the third (heating) run, specimen crystallinity were verified by measuring the melting enthalpy. The initial specimens containing high portion of amorphous structure exhibited cold crystallization and clear glass transition in the first run whereas they did not show in the third run due to the increase of crystalline structure portion. As cooling rate decreases through the second cooling run, the crystallinity of the specimen increased. PEEK polymer had 21.9~39.3% crystallinity depending on cooling rate change whereas PPS polymer showed 29.1~31.2%.

• Polymer(Korea)
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• v.28 no.2
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• pp.135-142
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• 2004

Poly(vinyl acetate) (PVAc) prepared by emulsion polymerization has broad applications for additives such as paint binder, adhesive for wood and paper due to its low glass transition temperature which help to plasticize substrate resins. Since emulsion polymerization has a disadvantage that surfactant and ionic initiator degrade properties of the product polymer, poly(vinyl acetate-co-butyl acrylate) (VVc-BA) was synthesized using potassium persulfate as catalyst and poly(vinyl alcohol) (PVA) as protective colloid to prevent the degradation. The copolymer latex product was internally plasticized and has enhanced colloid stability, adhesion, tensile strength and elongation. During VAc-BA emulsion polymerization, no coagulation and complete conversion occur with the reactant mixture of 0.7wt% potassium persulfate, 15wt% poly(vinyl alcohol) (PVA-217), and the balanced monomer that the weight ratio of vinyl acetate to butyl acrylate is 19. As the concentrations of PVA increase, the copolymerization becomes faster and polymer particles are more stable, resulting in enhanced mechanical stability of the VAc-BA copolymer. However, the size of the polymer particles decreases with increasing PVA contents. Properties of the VAc-BA copolymer, such as minimum film formation temperature, glass transition temperature, surface morphology, molecular weight and molecular weight distribution, tensile strength and elongation, were characterized using differential scanning calorimeter, transmission electron microscope and other instruments.

• Applied Chemistry for Engineering
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• v.25 no.2
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• pp.121-133
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• 2014

Block copolymers including ABA triblock architectures are useful as thermoplastic elastomers and toughened plastics depending on the relative glassy and rubbery content. These materials can be blended with other polymers and utilized as additives, toughening agents, and compatibilizers. Most of commercially available block copolymers are derived from petroleum. Renewable alternatives are attractive considering the finite supply of fossil resources on earth and the overall economic and environmental expenses involved in the recovery and use of oil. Furthermore, tomorrow's sustainable materials are demanding the design and implementation with programmed end-of-life. The present review focuses on the preparation and evaluation of new classes of renewable ABA triblock copolymers and also emphasizes on the use of carbohydrate-derived poly(lactide) or plant-based poly(olefins) having a high glass transition temperature and/or high melting temperature for the hard phase in addition to the use of bio-based amorphous hydrocarbon polymers with a low glass transition temperature for the soft components. The combination of multiple controlled polymerizations has proven to be a powerful approach. Precision-controlled synthesis of these hybrid macromolecules has led to the development of new elastomers and tough plastics offering renewability, biodegradability, and high performance.

• Fibers and Polymers
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• v.2 no.3
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• pp.122-128
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• 2001

UV-curable polyurethane acrylate prepolymers were prepared from diisocyanates [isophorone diisocyanate (IPDI), 2,4-toluene diisocyanate (TDI), or 4,4'-dicyclohexylmethane diisocyanate (H$_{12}$MDI)], diols [ethylene glycol (EG), 1,4-butane diol (BD), or 1,6-hexane diol (HD)], polypropylene glycol as a polyol. UY-curable mixtures were formulated from the prepolymer (90 wt%), reactive diluent monomer trimethylol propane triacrylate (10 wt%). and photoinitiator 1-hydroxycy-clohexyl ketone (3 wt% based on prepolymer/diluent). The effects of different diisocyanates/low molecular weigh dial on the dynamic mechanical thermal properties and elastic recovery of UV-cured polyurethane acrylate films were examined. The tensile storage modulus increased a little in the order of EG > BD > HD at the same diisocyanate. Two loss modulus peaks for all samples are observed owing to the glads transition of softs segments ($T_gh$) and the glass transition temperature of hard segments ($T_gh$). For the same diisocyanate, $T_gh$, decreased, however, $T_gh$ increased, in the order of HD > BD > EG. The elastic recovery also increased in the order of HD > BD > EG at the same diisocyanate. In case of same diols, $T_gh$ increased in the order of $H_12$MDl > TDI > IPDI significantly. The ultimate elongation and elastic recovery increased in the order of TDI > IPDI > $H_12$MDl at the same diol.l.

• Applied Chemistry for Engineering
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• v.26 no.4
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• pp.445-451
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• 2015

Semi-flexible liquid crystalline polymers containing a mesogenic group and an octamethylene flexible spacer in the main chain were synthesized by solution polycondensation. The mesogenic group in the polymer consists of four aromatic rings connected by ester and ketone, ether, sulfide, methylene, sulfone, or isopropylidene linkage groups. This paper discusses effects of the central linker of the mesogenic group on polymer properties. The structures and properties of synthesized polymers were investigated by $^1H$-NMR, FT-IR, differential scanning calorimeter (DSC), thermogravimetric analyzer (TGA), X-ray diffractometer (XRD), and polarizing optical microscope (POM). Polymers having bent linkage groups exhibited low thermal transition temperatures, narrow mesophase temperature ranges, low liquid crystallinity, and good solubilities in organic solvents, while those having bulky linkage groups were amorphous and exhibited high glass transition temperatures.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.19-25
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• 2011

The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.288-289
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• 2011

Indium Tin Oxide (ITO) is a typical highly Transparent Conductive Oxide (TCO) currently used as a transparent electrode material. Most widely used deposition method is the sputtering process for ITO film deposition because it has a high deposition rate, allows accurate control of the film thickness and easy deposition process and high electrical/optical properties. However, to apply high quality ITO thin film in a flexible microelectronic device using a plastic substrate, conventional DC magnetron sputtering (DMS) processed ITO thin film is not suitable because it needs a high temperature thermal annealing process to obtain high optical transmittance and low resistivity, while the generally plastic substrates has low glass transition temperatures. In the room temperature sputtering process, the electrical property degradation of ITO thin film is caused by negative oxygen ions effect. This high energy negative oxygen ions(about over 100eV) can be critical physical bombardment damages against the formation of the ITO thin film, and this damage does not recover in the room temperature process that does not offer thermal annealing. Hence new ITO deposition process that can provide the high electrical/optical properties of the ITO film at room temperature is needed. To solve these limitations we develop the Magnetic Field Shielded Sputtering (MFSS) system. The MFSS is based on DMS and it has the plasma limiter, which compose the permanent magnet array (Fig.1). During the ITO thin film deposition in the MFSS process, the electrons in the plasma are trapped by the magnetic field at the plasma limiters. The plasma limiter, which has a negative potential in the MFSS process, prevents to the damage by negative oxygen ions bombardment, and increases the heat(-) up effect by the Ar ions in the bulk plasma. Fig. 2. shows the electrical properties of the MFSS ITO thin film and DMS ITO thin film at room temperature. With the increase of the sputtering pressure, the resistivity of DMS ITO increases. On the other hand, the resistivity of the MFSS ITO slightly increases and becomes lower than that of the DMS ITO at all sputtering pressures. The lowest resistivity of the DMS ITO is $1.0{\times}10-3{\Omega}{\cdot}cm$ and that of the MFSS ITO is $4.5{\times}10-4{\Omega}{\cdot}cm$. This resistivity difference is caused by the carrier mobility. The carrier mobility of the MFSS ITO is 40 $cm^2/V{\cdot}s$, which is significantly higher than that of the DMS ITO (10 $cm^2/V{\cdot}s$). The low resistivity and high carrier mobility of the MFSS ITO are due to the magnetic field shielded effect. In addition, although not shown in this paper, the roughness of the MFSS ITO thin film is lower than that of the DMS ITO thin film, and TEM, XRD and XPS analysis of the MFSS ITO show the nano-crystalline structure. As a result, the MFSS process can effectively prevent to the high energy negative oxygen ions bombardment and supply activation energies by accelerating Ar ions in the plasma; therefore, high quality ITO can be deposited at room temperature.

• Journal of the Korean Electrochemical Society
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• v.24 no.3
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• pp.52-64
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• 2021

The effect of Fe and BO₃ doping on structure, thermal, and electrical properties of Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y (x = 0.2, 0.5)-based glass and glass ceramics was investigated. In addition, their crystallization behavior during sintering and ionic conductivity were also investigated in terms of sintering temperature. FT-IR and XPS results indicated that Fe²⁺ and Fe³⁺ ions in Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y glass worked as a network modifier (FeO₆ octahedra) and also as a network former (FeO₄ tetrahedra). In the case of the glass with low substitution of BO₃, boron formed (PB)O₄ network structure, while boron preferred BO₃ triangles or B₃O₃ boroxol rings with increasing the BO₃ content owing to boic oxide anomaly, which can result in an increased non-bridging oxygen. The glass transition temperature (GTT) and crystallization temperature (CT) was lowered as the BO₃ substitution was increased, while Fe²⁺ lowered the GTT and raised the CT. The ionic conductivity of Li_1+xFe_xTi_2-x(PO₄)_3-y(BO₃)_y glass ceramics were 8.85×10^-4 and 1.38×10^-4S/cm for x = 0.2 and 0.5, respectively. The oxidation state of doped Fe and boric oxide anomaly were due to the enhanced lithium ion conductivity of glass ceramics.