Reliability Improvement of Cu/Low K Flip-chip Packaging Using Underfill Materials
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Hong, Seok-Yoon
(Samsung Electro-Mechanics)
Jin, Se-Min (Samsung Electro-Mechanics) Yi, Jae-Won (Samsung Electro-Mechanics) Cho, Seong-Hwan (Samsung Electro-Mechanics) Doh, Jae-Cheon (Samsung Electro-Mechanics) Lee, Hai-Young (Department of Electrical Engineering, Ajou University) |
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