• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.3
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• pp.215-218
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• 2011

A novel design of gas sensor using Ga-doped ZnO (GZO) thin films which are deposited on low temperature co-fired ceramic (LTCC) substrates is presented. The LTCC substrates with thickness of 400 ${\mu}m$ are fabricated by laminating 12 green tapes which consist of alumina and glass particle in an organic binder. The GZO thin films with different thickness are deposited on LTCC substrates, by RF magnetron sputtering method. The microstructure and sensing properties of GZO gas sensing films are analyzed as a function of the film thickness. The films are well crystallized in the hexagonal (wurzite) structure with increasing thickness. The maximum sensitivity of 3.49 is obtained at 100 nm film thickness and the fastest 90% response time of 27.2 sec is obtained at 50 nm film thickness for the operating temperature of $400^{\circ}C$ to the $NO_2$ gas.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.32-34
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• 2011

A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.7A
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• pp.563-568
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106${\mu}{\textrm}{m}$ thick LTCC layers and its size is 5.24mm x 4.3mm x 0.53 mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200MHz, insertion loss of 2.326dB and return loss of 13.679dB. In addition, the attenuation is 28.052dB at 4.7GHz.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.28 no.8A
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• pp.607-612
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• 2003

In this paper, a miniaturized parallel coupled bandpass filter using multi-layered LTCC(Low Temperature Co-fired Ceramics) substrate for SOP(System-On-Package) is proposed for applications to wireless communication systems. The fabricated BPF is composed of five 106$\mu\textrm{m}$ thick LTCC layers and its size is 5.24mm ${\times}$ 4.3mm${\times}$ 0.53mm. The measured characteristics of the BPF show the center frequency of 5.8GHz, bandwidth of 200㎒, insertion loss of 2.326㏈ and return loss of 13.679㏈. In addition, the attenuation is 28.052㏈ at 4.7GHz.

• ETRI Journal
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• v.41 no.6
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• pp.811-819
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• 2019

We propose a substrate with high thermal conductivity, manufactured by the low-temperature co-fired ceramic (LTCC) multilayer circuit process technology, as a new DC/DC converter platform for power electronics applications. We compare the reliability and power conversion efficiency of a converter using the LTCC substrate with the one using a conventional printed circuit board (PCB) substrate, to demonstrate the superior characteristics of the LTCC substrates. The power conversion efficiencies of the LTCC- and PCB-based synchronous buck converters are 95.5% and 94.5%, respectively, while those of nonsynchronous buck converters are 92.5% and 91.3%, respectively, at an output power of 100 W. To verify the reliability of the LTCC-based converter, two types of tests were conducted. Storage temperature tests were conducted at -20 ℃ and 85 ℃ for 100 h each. The variation in efficiency after the tests was less than 0.3%. A working temperature test was conducted for 60 min, and the temperature of the converter was saturated at 58.2 ℃ without a decrease in efficiency. These results demonstrate the applicability of LTCC as a substrate for power conversion systems.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.9
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• pp.872-879
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• 2004

The TX/RX broadband L-type circular polarization antenna using LTCC(Low Temperature Co-fired Ceramic) for satellite communication at K, Ka band(20～21 GHz/30～31 GHz) has been presented. This antenna has been analyzed in compensation for LTCC with relative permittivity 5.2 and could have been integrated with RF component. Also antennas on LTCC enable :o reduce loss of RF system due to integrate with RF circuits and to light weight, and thus, generally one can reduce size of the RF system. As the geometry of this antenna presented is made simple by L type of monopole antenna, it is easily manufactured by LTCC progress and enables to reduce loss.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.2A
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• pp.214-217
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• 2004

In this paper, a Ka-band LTCC (low temperature co-fired ceramic) narrow bandpass filter (BPF) is firstly presented. This BPF shows very narrow 3dB fractional bandwidth of 4.5 ％ centered at 28.7㎓. The advantages of multi-layered LTCC technology such as high integration and vertical stacking capabilities were employed to design three-dimensional interdigital end-coupled embedded microstrip narrow BPF. The difficulties in controlling the precise distance between two adjacent resonators in LTCC end-coupled BPF were overcome by locating the resonators on different layers. The measured insertion loss is 3dB at 28.7㎓, pass band is from 27.9 ㎓ to 29.2 ㎓, and the return loss in the pass band is less than 10 dB.

• Journal of IKEEE
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• v.16 no.2
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• pp.121-126
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• 2012

In this paper, a push-push VCDRO (Voltage Controlled Dielectric Resonator Oscillator) with a modified frequency tuning structure is investigated. The push-push VCDRO designed at 16GHz is manufactured using a LTCC (Low Temperature Co-fired Ceramic) technology to reduce the circuit size. The frequency tuning structure is embedded in intermediate layer of A6 substrate by an advantage of LTCC process. Experimental results show that the fundamental frequency suppression is above 30dBc, the frequency tuning range is 0.43MHz over control voltage of 0 to 12V, and phase noise of push-push VCDRO presents a good performance of -103dBc/Hz at 100KHz offset frequency from carrier.

• Journal of information and communication convergence engineering
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• v.13 no.2
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• pp.139-143
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• 2015

A push-push voltage controlled dielectric resonator oscillator (VCDRO) with a modified frequency tuning structure using broadside couplers is investigated. The push-push VCDRO designed at 16 GHz is manufactured using a low temperature co-fired ceramic (LTCC) technology to reduce the circuit size. The frequency tuning structure using a broadside coupler is embedded in a layer of the A6 substrate by using the LTCC process. Experimental results show that the fundamental and third harmonics are suppressed above 15 dBc and 30 dBc, respectively, and the phase noise of push-push VCDRO is -97.5 dBc/Hz at an offset frequency of 100 kHz from the carrier. The proposed frequency tuning structure has a tuning range of 4.46 MHz over a control voltage of 1-11 V. This push-push VCDRO has a miniature size of 15 mm×15 mm. The proposed design and fabrication techniques for a push-push oscillator seem to be applicable in many space and commercial VCDRO products.