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http://dx.doi.org/10.4313/TEEM.2011.12.1.32

Control of Glass Infiltration at the Al2O3/Glass/Al2O3 Interface  

Jo, Tae-Jin (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Yeo, Dong-Hun (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Shin, Hyo-Soon (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Hong, Youn-Woo (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology)
Cho, Yong-Soo (Department of Materials Science and Engineering, Yonsei University)
Publication Information
Transactions on Electrical and Electronic Materials / v.12, no.1, 2011 , pp. 32-34 More about this Journal
Abstract
A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.
Keywords
Zero shrinkage; Glass infiltration; $Al_2O_3/Glass/Al_2O_3$; De-lamination; Low temperature co-fired ceramic;
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1 F. P. Lautzenhiser, E. M. Amaya, and J. Thomas, Methods for Making and Using Self-Constrained Low Temperature Glass-Ceramic Unfired Tape for Microelectrics. U.S. patent no. 6 949 156 (2005).
2 F. P. Lautzenhiser, E. M. Amaya, and J. T. Hochheimer, Methods for Making and Using Self-Constrained Low Temperature Glass-Ceramic Unfired Tape for Microelectronics. U.S. patent no. 2004/0159390 A1 (2004).
3 J. H. You, D. H. Yeo, H. S. Shin, J. H. Kim, and H. G. Yoon, J. Electroceram. 23, 367 (2009) [DOI: 10.1007/s10832-008-9469-3].   DOI
4 D. H. Yeo, J. H. You, H. S. Shin, and J. H. Kim, Mater. Sci. Forum 534-536, 1497 (2007).   DOI
5 B. Schwartz, Am. Ceram. Soc. Bull. 56, 433 (1977).
6 Y. Imanaka, Multilayered Low Temperature Cofired Ceramics (LTCC) Technology (Springer, New York, 2005), p. 1-5.
7 K. R. Mikeska and R. C. Mason, 6th International SAMPE Electronics Conference (Baltimore, MD 1992) p. 22-25.
8 S. D. Park and H. K. Kang, J. Microelectron. Packag. Soc. 6, 25 (1999).
9 K. R. Mikeska, D. T. Schaefer, and R. H. Jensen, Method for Reducing Shrinkage During Firing of Green Sheet Bodies. U.S. patent no. 5 085 720 (1992).