Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Control of Glass Infiltration at the Al2O3/Glass/Al2O3 Interface

  • Jo, Tae-Jin (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Yeo, Dong-Hun (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Shin, Hyo-Soon (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Hong, Youn-Woo (Bio-IT Convergence Center, Korea Institute of Ceramic Engineering and Technology) ;
  • Cho, Yong-Soo (Department of Materials Science and Engineering, Yonsei University)
  • Received : 2010.11.05
  • Accepted : 2010.12.30
  • Published : 2011.02.28
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Abstract

A zero-shrinkage sintering process in which the shrinkage of the x-y axis is controlled to be zero is in great demand due to the high integration trend in ceramic modules. Among the zero-shrinkage sintering processes available, the glass infiltration method proposed in the preliminary study with an $Al_2O_3/Glass/Al_2O_3$ structure is one promising method. However, problems exist in regard to the glass infiltration method, including partially incomplete joining between $Al_2O_3$ and glass layers due to the precipitate of Ti-Pb rich phase during the sintering process. Therefore, we wish to solve the de-lamination problems and suggest a mechanism for delamination and the solutions in the zero-shrinkage low temperature co-fired ceramic (LTCC) layers. The de-lamination problems diminished using the Pb-BSi-O glass without $TiO_2$ in Pb-B-Ti-Si-O glass and produced a very dense zero-shrinkage LTCC.

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References

  1. B. Schwartz, Am. Ceram. Soc. Bull. 56, 433 (1977).
  2. Y. Imanaka, Multilayered Low Temperature Cofired Ceramics (LTCC) Technology (Springer, New York, 2005), p. 1-5.
  3. K. R. Mikeska and R. C. Mason, 6th International SAMPE Electronics Conference (Baltimore, MD 1992) p. 22-25.
  4. S. D. Park and H. K. Kang, J. Microelectron. Packag. Soc. 6, 25 (1999).
  5. K. R. Mikeska, D. T. Schaefer, and R. H. Jensen, Method for Reducing Shrinkage During Firing of Green Sheet Bodies. U.S. patent no. 5 085 720 (1992).
  6. F. P. Lautzenhiser, E. M. Amaya, and J. Thomas, Methods for Making and Using Self-Constrained Low Temperature Glass-Ceramic Unfired Tape for Microelectrics. U.S. patent no. 6 949 156 (2005).
  7. F. P. Lautzenhiser, E. M. Amaya, and J. T. Hochheimer, Methods for Making and Using Self-Constrained Low Temperature Glass-Ceramic Unfired Tape for Microelectronics. U.S. patent no. 2004/0159390 A1 (2004).
  8. J. H. You, D. H. Yeo, H. S. Shin, J. H. Kim, and H. G. Yoon, J. Electroceram. 23, 367 (2009) [DOI: 10.1007/s10832-008-9469-3].
  9. D. H. Yeo, J. H. You, H. S. Shin, and J. H. Kim, Mater. Sci. Forum 534-536, 1497 (2007). https://doi.org/10.4028/www.scientific.net/MSF.534-536.1497

Cited by

  1. Control of De-Lamination Phenomena in LTCC Zero-Shrinkage by Glass Infiltration Method vol.13, pp.1, 2012, https://doi.org/10.4313/TEEM.2012.13.1.23