• 소성∙가공
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• 제14권3호
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• 소성∙가공
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• 제16권5호통권95호
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• 한국전자파학회논문지
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• 제19권12호
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• pp.1402-1409
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• 2008

본 논문에서는 상대 유전율이 큰 low temperature co-fired ceramic 기판을 이용한 안테나의 복사 성능을 높이고, 대역폭을 개선하기 위하여 low temperature co-fired ceramic cavity backed 안테나가 제안된다. Low temperature co-fired ceramic cavity는 각 층의 접지면을 다수의 비어로 연결하여 만들어진다. 그리고, cavity의 크기가 안테나의 복사 성능과 대역폭 성능에 미치는 영향을 보여준다. 제안된 $2{\times}4$ low temperature co-fired ceramic cavity backed 안테나의 크기는 $10{\times}20\;mm^2$이며, $57{\sim}64\;GHz$ 대역에서 이득 $11.8{\sim}14.1\;dBi$, 대역폭 13 %(7.9 GHz)을 가진다. 측정 결과는 시뮬레이션 결과와 매우 잘 일치함을 보여준다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.101-106
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• 2003

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole quality is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene Terephthalate) one. In this paper we found the correlation between hole quality and process condition such as ceramic thickness, and tool size. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 소성∙가공
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• 제13권1호
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• pp.65-71
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• 2004

Recent electronic equipment becomes smaller, more functional, and more complex. According to these trends, LTCC(low temperature co-fired ceramic) has been emerged as a promising technology in packaging industry. It consists of multi-layer ceramic sheet, and the circuit has 3D structure. In this technology via hole formation plays an important role because it provides an electric path for the packaging interconnection network. Therefore via hole qualify is very important for ensuring performance of LTCC product. Via holes are formed on the green sheet that consists of ceramic(before sintering) layer and PET(polyethylene terephthalate) one. In this paper we found the correlation between hole quality and process condition such as PET thickness and ceramic thickness. The shear behavior of double layer sheet by micro hole punching which is different from that of single layer one was also discussed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.507-511
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• 2008

LTCC (Low Temperature Co-fired Ceramic) has been successfully applied to ceramic substrates for circuits and micro-fluidic systems and has proven its superior performance in a variety of applications. The prediction of shrinkage in LTCC process is an important for dimensional control of micro LTCC products which has influences on electronic characteristics. For avoiding the unpredictable shrinkage of LTCC during the sintering which makes accurate placement of the circuit devices difficult, pre-processes such as WIP (Warm Isostatic Pressing) and lamination must be modified. The objective of the present investigation is to establish a proper WIP conditions for near net shape fabrication of LTCC products. This paper discusses the influence of WIP conditions on the dimensional change of LTCC sheet. In the investigation, it is shown that the shrinkage values of sheets depend on WIP conditions and sheet directions. This work is a quantitative evaluation of the effect of WIP pressure on shrinkage of LTCC sheet. Additionally, the results show anisotropic shrinkage behaviour of sheet during LTCC process.

• 전기학회논문지
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• 제56권7호
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• pp.1288-1293
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• 2007

In this paper, a compact triplexer has been implemented for Cellular/GPS/USPCS applications. In order to realize the proposed triplexer, we use a low-temperature co-fired ceramic (LTCC) substrate to enable a fully compact integrated module using a multi-layer high-density architecture, and conjugate-match the channels instead of the open matching technique. The three dimensional design capability of LTCC substrates can reduce the overall size of the triplexer, resulting in dimensions on the order of $3.2\;mm\;{\times}\;2.5\;mm\;{\times}\;1\;mm$. The measured result shows that the triplexer has, in Cellular/GPS/USPCS bands, the insertion loss of less than 0.5dB, less than 1.7dB, and less than 0.9dB in order. Also, the triplexer has an isolation of more than 15dB in the cellular and USPCS bands and an isolation of more than 20dB in the GPS band.

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.256-259
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• 2003

In this paper, a design of multi-layered BPF(bandpass filter) using LTCC(Low Temperature Co-fired Ceramic) process by a lumped-elements is proposed for SOP(system-on-a-chip) of wireless communication systems. The proposed BPF improved a characteristic of rejection band to build an attenuation pole caused by structurally adjacent co-inductance and coupling. The simulation data shows a bandwidth of 90MHz from a center frequency of 2.4GHz, a return loss of 27dB, an insertion loss of 3.2dB, and an attenuation of at least 20dBc at $f_0{\pm}250MHz$. Simulations have used serenade circuit simulation and HFSS EM simulation.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2002년도 추계총회 및 연구발표회 초록집
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• pp.88.1-88
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• 2002