• 한국재료학회지
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• 제26권11호
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• pp.644-648
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• 2016

In order to examine how the solid-liquid interface responds to temperature variation depending on the materials characteristics, i.e. faceted phase or nonfaceted phase, the moving solid-liquid interface of transparent organic material, as a model substance for metallic materials (pivalic acid, camphene, salol, and camphor-50wt% naphthalene) was observed in-situ. Plots of the interface movement distance against time were obtained. The solid-liquid interface of the nonfaceted phase is atomically rough; it migrates in continuous mode, giving smooth curves of the distance-time plot. This is the case for pivalic acid and camphene. It was expected that the faceted phases would show different types of curves of the distance-time plot because of the atomically smooth solid-liquid interface. However, salol (faceted phase) shows a curve of the distance-time plot as smooth as that of the nonfaceted phases. This indicates that the solid-liquid interface of salol migrates as continuously as that of the nonfaceted phases. This is in contrast with the case of naphthalene, one of the faceted phases, for which the solid-liquid interface migrates in "stop and go" mode, giving a stepwise curve of the distance-time plot.

• 대한기계학회논문집
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• 제19권9호
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• pp.2249-2260
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• 1995

An experiment of close contact melting of phase-change medium partially filled in an isothermally heated horizontal cylinder is performed which involves the volume expansion of liquid induced by the solid-liquid density difference. The solid-liquid interface motion and the free surface behavior of liquid were reported photographically. The experimental results show that the curvature of upper solid-liquid interface varied to flat as melting progresses. In addition to the varying interface shape, the melting rate increases with the lower initial height of solid and the free surface height of liquid increases linearly. The experimental results of molten mass fraction were expressed in a function of dimensionless time Fo.Ste$^{3}$4/ and agreed well with the analytical solutions.

• 대한기계학회논문집
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• 제19권4호
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• pp.1095-1101
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• 1995

Numerical analysis of vertical solidification process allowing solid-liquid density change is performed by a hybrid method between a winite volume method (FVM) and a finite element method (FEM). The investigation focuses on the influence of solid-liquid density change and cooling rates on the motion of solid-liquid interface, solidified mass fraction, temperatures and thermal stresses in the solid region. Due to the density change of pure aluminium, solid-liquid interface moves more slowly but the solidified mass fraction is larger. The cooling rate of the wall is shown to have a significant influence on the phase change heat transfer and thermal stresses, while the density change has a small influence on the motion of the interface, solidified mass fraction, temperature distributions and thermal stresses. As the cooling rate increases, the thermal stresses become higher at the early stage of a solidification process, but it has small influence on the final stresses as the steady state is reached.

• 한국재료학회지
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• 제11권9호
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• pp.721-726
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• 2001

Directional solidification experiments have been carried out at the solidification rates from 0.5 to 50$\mu\textrm{m}$/s in Mar M-247LC superalloy in which several important liquid properties were estimated by analyzing the interface stability and temperature gradient at the solid/liquid interface. The diffusion coefficient in the liquid was estimated by employing the constitutional supercooling criterion. The temperature gradients changed with solidification rates and latent heat of solidification. The thermal conductivities of solid and liquid could be estimated by heat flux balance at the solid liquid interface.

• 한국재료학회지
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• 제9권11호
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• pp.1108-1111
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• 1999

결정성장 도중 전류에 의해 고/액 계면에서 발생하는 Peltier 열을 이용하면 온도구배의 증가와 이에 따른 성장속도의 증가 및 결정성의 향상에 기여할 것이라 예상되어, 고/액 계면에서 복합적으로 발생하는 Peltier 효과를 조사하였다. 전류 밀도, 극성 및 온도구배의 변화에 따른 고상과 액상 및 그 계면에서의 온도변화로부터 이론적 추론에 의해 Peltier 열, Thomson 열 및 Joule 열만의 영향으로 분류할 수 있었고, 고상/액상 계에 대한 Peltier 계수 및 Thomson 계수도 구할 수 있었다.

• 한국전산유체공학회지
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• 제17권3호
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• pp.99-107
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• 2012

In this paper, the shock waves in compressible solids and liquids are simulated using a six-equation diffuse interface multiphase flow model that is extended to the Cochran and Chan equation of state. A pressure relaxation method based on a volume fraction function and a pressure-correction equation are newly implemented to the six-equation model. The developed code has been validated by a shock tube problem with liquid nitromethane and an impact problem of a copper plate on a solid explosive. In addition, a new problem, an impact of a copper plate on liquid nitromethane, has been solved. The present code well shows the wave structures in compressible solids and liquids without any numerical oscillations and overshoots. After the impact of a solid copper plate on liquid, two shock waves (one propagates into liquid and the other into solid) are generated and a material interface moves to the impacting direction. The computational results show that the shock velocity inside the liquid linearly increases with the impact velocity.

• 대한기계학회논문집B
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• 제23권2호
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• pp.185-197
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• 1999

Heat transfer and solidification of liquid silicon in von-$K{\acute{a}}rm{\acute{a}}n$ swirling flow is investigated. The moving boundary is fixed for all times by a coordinate transformation, and finite difference method Is used to obtain the instantaneous location of the solid-liquid Interface and the heat transfer from the surfaces of solid and liquid. For small Stefan number or low wall temperature, the transient heat transfer from the surface of solid(QS(t)) is much larger than that from the liquid side of solid-liquid interface(QL(t)) and QL(t) reaches its quasi-steady-state value much faster than QS(t).

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 학술대회
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• pp.221-226
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• 2008

Numerical simulation is performed for microdroplet deposition on a pre-patterned micro-structure. The level-set method for tracking the liquid-gas interface is extended to treat the immersed (or irregular-shaped) solid surface. The no-slip condition at the fluid-solid interface as well as the matching conditions at the liquid-gas interface is accurately imposed by incorporating the ghost fluid approach based on a sharp-interface representation. The method is further extended to treat the contact angle condition at an immersed solid surface. The present computation of a patterning process using microdroplet ejection demonstrates that the multiphase characteristics between the liquid-gas-solid phases can be used to improve the patterning accuracy.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년 추계학술대회논문집
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• pp.221-226
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• 2008

Numerical simulation is performed for microdroplet deposition on a pre-patterned micro-structure. The level-set method for tracking the liquid-gas interface is extended to treat the immersed (or irregular-shaped) solid surface. The no-slip condition at the fluid-solid interface as well as the matching conditions at the liquid-gas interface is accurately imposed by incorporating the ghost fluid approach based on a sharp-interface representation. The method is further extended to treat the contact angle condition at an immersed solid surface. The present computation of a patterning process using microdroplet ejection demonstrates that the multiphase characteristics between the liquid-gas-solid phases can be used to improve the patterning accuracy.

• 한국주조공학회지
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• 제9권1호
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• pp.73-79
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• 1989

Microstructural characteristics of Al-3.63wt.%Pb hyper-monotectic alloy rapidly-solidified by melt spinning were examined. Possibility of forming a planar liquid -solid interface during rapid solidification of this alloy was also considered with a morphological stability theory, and a mechanism of forming banded structure observed at the bottom parts of melt-spinned specimens was considered as well. Application of the absolute stability criterion predicts the liquid-solid interface of the primary aluminium phase to be able to maintain a planar interface during the early stage of rapid solidification. Formation of banded structure was supposed to be resulted from the release of latent heat during solidification, which affect the stability of a planar liquid-solid interface.