• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.185-192
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• 2012

p-n junction temperature and thermal resistance of Light Emitting Diode (LED) package are affected by the chip size due to the change of the thermal density and the external quantum efficiency considering the heat dissipation through conduction. In this study, forward voltage was measured for two different size LED chips, 24 mil and 40 mil, which consist constitute 16-chip package. p-n junction temperature and thermal resistance were determined by thermal transient analysis, which were discussed in connection with the electrical characteristics of the LED chip and the structure of the LED package.

• Journal of Satellite, Information and Communications
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• v.8 no.2
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• pp.44-49
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• 2013

LED communication is a wireless communication technology to transmit information using visible light coming out from the LED(Light Emitting Diode). It is a technique that can overcome RF(Radio Frequency) communication problems that are frequency allocations, human body hazards, security vulnerabilities, and interference between electronic devices. As a technique that can be used as lighting and communications with using LED, LED communication is suitable for ubiquitous environment. This paper introduces the process of data transmission algorithm for LED communication systems algorithm using LED, PD(Photodiode), and MCU(Micro Controller Unit).

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.22-26
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• 2013

The author analyzes the luminous efficiency of the phosphor-conversion white light-emitting diode (LED) that consists of a blue LED chip and a yellow phosphor. A theoretical model is derived to find the relation between luminous efficiency (LE) of a white LED, wall-plug efficiency (WPE) of a blue LED chip, and the phosphor absorption ratio of blue light. The presented model enables to obtain the theoretical limit of LE and the lower bound of WPE. When the efficiency model is applied to the measured results of a phosphor-conversion white LED, the limit theoretical value of LE is obtained to be 261 lm/W. In addition, for LE of 88 lm/W at 350 mA, the lower bound of WPE in the blue LED chip is found to be ~34%. The phosphor absorption ratio of blue light was found to have an important role in optimizing the luminous efficiency and colorimetric properties of phosphor-conversion white LEDs.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.46 no.5
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• pp.571-574
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• 2013

To determine an efficient growth system for algal cultivation and to develop adequate culture system utilizing LED light, we investigated the effects of fluorescent and light emitting diode (LED) light source on the growth of Ulva pertusa. U. pertusa was cultured at $17^{\circ}C$ under a light intensity of 35 ${\mu}mol$ photons $m^{-2}s^{-1}$ and a 10L:14D photoperiod using either fluorescent or LED lamps. After 1 week of incubation under the same environmental condition, the length and width of Ulva pertusa grown under LED light were 1.5- and 1.9-fold greater, respectively, than the length and width of algae grown under fluorescent light. After two weeks, length and width were 2.6- and 2.0-fold greater, respectively, in algae grown under LED light. Total length and width of Ulva pertusa after three weeks of incubation were 1.7- and 1.2-fold greater in algae grown under LED light than those grown under fluorescent light. Therefore, the LED light induced significantly higher growth of Ulva pertusa than fluorescent light.

• Journal of the Korean Electrochemical Society
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• v.3 no.1
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• pp.39-43
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• 2000

The light emitting diode (LED) was fabricated from n-type porous silicon. We investigated both the current-voltage characteristics of the LED with various electrode materials and changes of electroluminescence with applied current density. Also we probed changes in electroluminescence as a function of operation time at a given current. In order to Improve the contact area between the electrode material and porous silicon layer, we deposited indium on porous silicon layer by electroplating and investigated the electric characteristics of the LED and changes of electroluminescence.

• Journal of Applied Biological Chemistry
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• v.57 no.3
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• pp.255-257
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• 2014

This study was conducted to determine the attractive effects of Plutella xylostella adults to light emitting diode (LED) trap in greenhouse and compared with those of no light trap and black-light which is typically used in commercial luring lamp. The green LED trap captured more P. xylostella when compared with black-light trap, whereas the no light trap was a little attractive to P. xylostella adults. These results indicated that the green LED traps could be used for environmental insect pest control.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1347-1348
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• 2008

The efficacy and its degradation of light emitting diode(LED) are related to its PN junction's temperature(Tj). Currently efficacy in certain temperature and thermo-resistant are defined for the depending. However, the definitions are quite inconvenient for lighting application. The paper focuses on the issue and presents a method to evaluate the thermal characteristics of LED efficay.

• Journal of Power Electronics
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• v.16 no.2
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• pp.815-822
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• 2016

The efficiency of light-emitting diode (LED) devices is a significant factor that reflects the capability of these devices to convert electrical power into optical power. In this study, a method for estimating the efficiency of LED devices is proposed. An efficiency model and a heat power model are established as convenient tools for LED performance evaluation. Such models can aid in the design of LED drivers and in the reliability evaluation of LED devices. The proposed estimation method for the efficiency and heat power of LED devices is verified by experimentally testing two types of commercial LED devices.

• Journal of Plant Biotechnology
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• v.46 no.4
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• pp.291-296
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• 2019

This study was conducted to determine the effect of a light-emitting diode (LED) on in vitro shoot growth and rooting in teak (Tectona grandis L.). In the experiments with apical bud explants, the greatest shoot elongation (3.2 cm) occurred when they were cultured on DKW medium under 50% blue and 50% red LED mixture (BR), whereas no differences in growth were observed in different light sources (florescent light [F] or BR) or media (MS or DKW). The highest number of shoot multiplication (2.4/explant) or elongation (4.94 cm) was achieved with 0.5 or 1.0 mg/L 6-Benzyladenine (BA) treatment under BR. In addition, the best rooting rate (93.8%) or root length (1.3 cm) was recorded with 0.5 mg/L indole-3-butyric acid (IBA) treatment under BR, and the highest root induction (3.1/explant) was observed in 0.2 mg/L IBA under BR. The in vitro rooted plantlets were hardened and survived well on soil.

• The korean journal of orthodontics
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• v.34 no.4 s.105
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• pp.333-342
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• 2004

The purpose of this study was to evaluate the clinical effectiveness of a plasma arc light and light emitting diode (LED), compared with shear bond strength and the failure pattern of brackets bonded with visible light in direct bonding. Brackets were bonded with Transbond XT to 60 human premolars embedded in the resin blocks according to different light-curing methods. Then, the shear bond strength of each group was measured using a universal testing machine (Instron) and the adhesive failure pattern after debonding was visually examined by light microscope. The results were as follows: 1. The shear bond strength showed no significant difference between the visible light and light emitting diode, but the plasma arc light exhibited a significantly lower shear bond strength compared with the visible light and light emitting diode. 2. In the visible light and light emitting diode, adhesive failure patterns were similar. Bond failure occurred more frequently at the enamel-adhesive interface. 3. The bonding failure of brackets bonded with plasma arc light occurred more frequently at the bracket-adhesive interface. The results of this study suggest that plasma arc light, light emitting diode and visible light are all clinically useful in the direct bonding of orthodontic brackets.