• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2012년도 춘계학술논문집 2부
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• pp.537-540
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• 2012

기존 2차 전지 내부저항 측정 또는 잔존 용량 측정 등의 2차전지의 수명을 예측 방법들이 있으나 이 방법은 여러 가지 사용 환경에 따른 측정 오류 발생으로 의해 잔존 수명 예측을 정확하게 판단하기는 어려운 실정이다. 따라서 본 논문은 2치전지의 전해액 비중을 이용한 수명 예측 알고리즘을 개발하고 LabVIEW프로그램을 활용한 2차 전지 상태 감시와 잔존 수명을 예측하는 프로그램을 제작하여, 2차 전지의 상태와 교체 시점에 대한 신뢰도를 높일 수 있는 방안을 제시하고자 한다.

• Communications for Statistical Applications and Methods
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• 제6권2호
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• pp.443-456
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• 1999

The estimation of mean lifetimes in presence of interval censoring with mixed replacement procedure are examined when the distribution s of lifetimes are exponential. it is assumed that due to physical restrictions and/or economic constraints the number of failures is investigated only at several inspection times during the lifetime test; thus there is interval censoring. Comparisons of mixed replacement designs are made with those with and without replacement The maximum likelihood estimator is found in an implicit form. The Cramer-Rao lower bound which is the asymptotic variance of the estimator is derived. The test conditions for minimizing the Cramer-Rao lower bound and minimizing the test costs within a desired width of the Cramer-Rao bound have been studied.

• International Journal of Reliability and Applications
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• 제17권1호
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• pp.1-19
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• 2016

The Exponentiated Quasi Lindley (EQL) distribution which is an extension of the quasi Lindley Distribution is introduced and its properties are explored. This new distribution represents a more flexible model for the lifetime data. Some statistical properties of the proposed distribution including the shapes of the density and hazard rate functions, the moments and moment generating function, the distribution of the order statistics are given. The maximum likelihood estimation technique is used to estimate the model parameters and finally an application of the model with a real data set is presented for the illustration of the usefulness of the proposed distribution.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 2000년도 춘계공동학술대회 논문집
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• pp.381-384
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• 2000

This paper proposes a method of estimating the lifetime distribution at use condition for constant stress accelerated lift tests when extrinsic failure mode as well as intrinsic one exists. A mixture of two log-normal distributions is introduced to describe these failure modes and it is assumed that a linear relation exists between the location parameter and stress. An estimation procedure using the expectation and maximization algorithm is proposed and a numerical example is given.

• International Journal of Reliability and Applications
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• 제12권1호
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• pp.1-14
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• 2011

This paper discusses the stochastic analysis and the statistical inference of a quadratic failure rate semi-Markov reliability model. Maximum likelihood procedure will be used to obtain the estimators of the parameters included in this reliability model. Based on the assumption that the lifetime and repair time of the system units are random variables with quadratic failure rate, the reliability function of this system is obtained. Also, the distribution of the first passage time of this system is derived. Many important special cases are discussed.

• Communications for Statistical Applications and Methods
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• 제24권1호
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• pp.43-65
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• 2017

We propose a flexible cure rate survival model by assuming that the number of competing causes of the event of interest has the Poisson distribution and the time for the event follows the gamma-G family of distributions. The extended family of gamma-G failure-time models with long-term survivors is flexible enough to include many commonly used failure-time distributions as special cases. We consider a frequentist analysis for parameter estimation and derive appropriate matrices to assess local influence on the parameters. Further, various simulations are performed for different parameter settings, sample sizes and censoring percentages. We illustrate the performance of the proposed regression model by means of a data set from the medical area (gastric cancer).

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1265-1270
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• 2008

Electromigration is a one of a critical failure mechanism in microelectronic devices. Minimizing the thin film interconnections in microelectronic devices make high current densities at electrrical line. Under high current densities, an electromigration becomes critical problems in a microelectronic device. This phenomena under DC conditions was investigated with high temperature. The current density of 1.5MA/cm2 was stressed in interconnections under DC condition, and temperature condition $150^{\circ}C,\;175^{\circ}C,\;200^{\circ}C$. By increasing of thin film interconections, microelectronic devices durability is decreased and it gets more restriction by temperature. Electromigration makes electronic open by void induced, and hillock induced makes electronic short state.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1343-1348
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• 2008

LEDs which have many merits are widely used in the field of light devices, and have rapidly replaced old light devices such as incandescent or fluorescent lamps. Long life, on the order of 50,000 to 100,000 hours, is one of the key features of light emitting diodes(LEDs) that has attracted the lighting community to this technology. High Power white LEDs have yet to demonstrate this capability. This paper planed accelerated life test that has two factor(temperature, current) and two levels. Finally, using ALTA programs, we estimated the common shape parameter of Weibull distribution, life-stress relationship, B10 life and accelerating factors.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1259-1264
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• 2008

This paper presents an accelerated life test for burn out of tungsten filament of automotive halogen lamp. There are many failure modes and failure factors that associated with tungsten filament. But in this explain the dominant failure mode of tungsten filament is the bumout of the filament failure. At first, over voltage, high temperature, inrush current and vibration are selected as stress factors by using of two stage Quality Function Deploymeng(QFD). And we planed accelerated life test that has one factor(voltage) and three levels. By experiment it has absorbed that over voltage has an effect on the life of halogen lamp. Using ALTA programs, we estimated the common shpae parament of Weibull distribution, life-stress relationship and $B_{100p}$ life.