Wideband modulation analysis of a packaged semiconductor laser in consideration of the bonding wire effect (실장된 반도체 레이저의 본딩와이어를 고려한 광대역 변조 특성 해석)
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- Journal of the Korean Institute of Telematics and Electronics A
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- v.33A no.2
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- pp.148-162
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- 1996