• Applied Microscopy
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• v.15 no.1
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• pp.13-30
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• 1985

This study was undertaken to investigate the effect of lead on organisms. Mice received 15mg or 30mg of lead acetate per kg body weight every day for 1, 2 or 3 weeks, and the livers and kidneys were removed 24h after repeated injections. The livers and kidneys were used as sources for measurement of enzyme activities and for observation of alterations in ultrastructure. It was observed that body weights of mice treated with lead acetate were decreased when compared with those before treatment. This decrease in body weight was proportional to dose. The enzyme activities of succinate and malate dehydrogenases of experimental group that was treated with lead acetate for 1 week were nearly unchanged when compared with controls, but the enzyme activities of experimental group that was treated with lead acetate for 2 or 3 weeks were lower than those of controls. Changes in the enzyme activities were dependent on, but were not proportional to dose. Histologic examination of livers and kidneys after lead treatment showed that lead compound was accumulated and damaged in nucleus and mitochondria mainly. It was also observed that intranuclear inclusion bodies were formed only in epithelial cell of kidney proximal tubule after lead treatment. The overall changes in the ultrastructure were much greater in the livers than in the kidneys. From the above results, it nay be possible to conclude that the lead results in the decrease in body weight, reduction in the succinate dehydrogenate and malate dehydrogenase activities, and damages in the ultrastructure of kidney and liver in mouse. The presence of intranuclear inclusion bodies only in the kidney implies that these bodies protect the kidney from lead toxicity to some extent.

• Advances in materials Research
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• v.7 no.1
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• pp.17-28
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• 2018

Niobium is a candidate base for new alloys devoted to applications at especially elevated temperatures. Elaborating and shaping niobium-based alloys by conventional foundry may lead to mechanically interesting microstructures. In this work a series of charges constituted of pure elements were subjected to high frequency induction melting in cold crucible to try obtaining cast highly refractory Nb-xCr and Nb-xCr-0.4 wt.%Calloys(x=27, 34 and 37 wt.%). Melting and solidification were successfully achieved. The as-cast microstructures of the obtained alloys were characterized by electron microscopy and X-ray diffraction and their hardness were specified by Vickers macro-indentation. The obtained as-cast microstructures are composed of a body centered cubic (bcc) niobium dendritic matrix and of an interdendritic eutectic compound involving the bcc Nb phase and a $NbCr_2$ Laves phase. The obtained alloys are hard to cut and particularly brittle at room temperature. Hardness is of a high level (higher than 600Hv) and is directly driven by the chromium content or the amount of {bcc Nb - $NbCr_2$} eutectic compound. Adding 0.4 wt.% of carbon did not lead to carbides but tends to increase hardness.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.27-31
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• 2009

Sn whiskers can grow from the pure Sn and high Sn-based finish and cause the electrical shorts and failures. Even with the wealth of information on whiskers, we have neither the clear understanding of whisker growth nor methods for its prevention. In this study, the whisker grain roots which connected with intermetallic layer were analyzed by high-resolution transmission electron microscopy (HR-TEM). In the Sn-Cu plated leadframe (LF) that was stored at ambient condition for 540 days, filament-shaped whiskers were grown on the Sn-plated surface and ${\eta}'-Cu_6Sn_5$ precipitates were widely distributed along the grain boundaries at the Sn matrix. The measured of the lattice fringes at the ${\eta}'-Cu_6Sn_5$ was $4.71{\AA}$ at the coarse grain and $2.91{\AA}$ at the fine grain. The $Cu_3Sn$ which generates the tensile stresses was not observed. The formation of $Cu_6Sn_5$ precipitates and intermetallic layer were strongly related to whisker growth, but, the whisker growth tendency does not closely relate with the geometric morphology of irregularly grown intermetallic compound (lMC).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.859-862
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• 2001

This study describes a selective Ag etching solution for use with pattern on the surface of copper. This etching solution uses potassium iodide and potassium sulfate as the ligand that coordinates to the metal ions and ferricyanide as the oxidant. The etching rate was depended on the concentration of co-ligands and time. But the etching rate wasn't depended on the pH(2∼6), and oxidant(K$_3$Fe(CN)$\_$6/). Complete etching of silver can be achieved rapidly within 90sec for 4.46${\mu}$m thick metal films when aqueous solutions containing K$_3$Fe(CN)$\_$6/, K$_2$S$_2$O$\_$8/ and KI was used. This etching solution was characteristic of anisotropic etching.

• Journal of Drive and Control
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• v.17 no.1
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• pp.1-12
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• 2020

This study was to develop a simulation model of a compound planetary gear reducer for the final driving shaft using a gear analysis software (KISSsoft, Version 2017, KISSsoft AG, Switzerland). The aim of this study is to analyze transmission error and the tooth load distribution through micro-geometry using the simulation model. The tip and root relief were modified with Micro-geometry in the profile direction, and crowning was modified with Micro-geometry in the lead direction. The transmission error was analyzed using the PPTE (Peak to Peak Transmission Error) value, and the tooth load distribution was analyzed for the concentrated stress on the tooth surface. As a result of modifying tip and relief in the profile direction, the transmission error was reduced up to 40.7%. In the case of modifying crowning in the lead direction, the tooth load was more evenly distributed than before and decreased the stress on the tooth surface. After modifying the profile direction for the 1st and 2nd planetary gear train, the bending and contact safety factors were increased by 31.7% and 17%, and 18.3% and 12.5% respectively. Moreover, the bending and safety factors after modifying lead direction were increased by 59.5% and 32.7%, respectively for the 1st planetary gear train, and 59.6% and 43.6%, respectively for the 2nd planetary gear train. In future studies, the optimal design of a compound planetary gear reducer for the final driving shaft is needed considering both the transmission error and tooth load distribution.

• 한국태양에너지학회:학술대회논문집
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• 2009.04a
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• pp.296-301
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• 2009

The ice storage system uses water for low temperature latent heat storage. However, a refrigerator capacity is increased and COP is decreased due to supercooling of water in the course of phase change from solid to liquid. This study investigates the cooling characteristics of the TMA-water clathrate compound including TMA (Tri-methyl-amine, $(CH_3)_3N)$ of $20{\sim}25wt%$ as a low temperature latent heat storage material. The results showed that the phase change temperature and the specific heat is increased and the supercooling degree is decreased as the weight concentration of TMA increased. Especially, the clathrate compound containing TMA 25wt% has the average phase change temperature of $5.8^{\circ}C$, the supercooling degree of $8.0^{\circ}C$ and the specific heat of 3.499 kJ/kgK in the cooling process. This can lead to reduction of operation time of refrigerator in low temperature latent heat storage system and efficiency improvement of refrigerator COP and overall system. Therefore, energy saving and improvement of utilization efficiency are expected.

• International Journal of Air-Conditioning and Refrigeration
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• v.17 no.1
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• pp.32-36
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• 2009

The ice storage system uses water for low temperature latent heat storage. However, a refrigerator capacity is increased and COP is decreased due to supercooling of water in the course of phase change from solid to liquid. This study investigates the cooling characteristics of the TMA-water clathrate compound including TMA (Tri-methyl-amine, $(CH_3)_3N$) of $20{\sim}25wt%$ as a low temperature latent heat storage material. The results showed that the phase change temperature and the specific heat is increased and the supercooling degree is decreased as the weight concentration of TMA increased. Especially, the clathrate compound containing TMA 25 wt% has the average phase change tempera ture of $5.8^{\circ}C$, the supercooling degree of $8.0^{\circ}C$ and the specific heat of 3.499 kJ/kgK in the cooling process. This can lead to reduction of operation time of refrigerator in low temperature latent heat storage system and efficiency improvement of refrigerator COP and overall system. Therefore, energy saving and improvement of utilization efficiency are expected.

• Journal of Sensor Science and Technology
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• v.3 no.2
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• pp.33-39
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• 1994

A quartz crystal microbalance (QCM) sensor system for the detection of odorants, especially environmental pollutant, has been constructed by depositing various phospholipids, activated carbon and lead compound pigment onto the surface of the QCM. The characteristics of a QCM operating at 9 MHz deposited with phosphatidyl- choline were analysed. An explanation is given for different odorant affinities based on the monolayer properties of phospholipids. The identification of odorants is discussed in terms of a comparison of their normalized resonant frequency shift patterns and relative response intensities calculated from the response areas. Applying the lead compound pigment coated QCM, it was possible to detect sulfur compound specifically. Using a number of different lipid-coated QCMs, odorants could be identified by comparing the response patterns.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.25-31
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• 2010

In this study, we investigated the morphology and thermal stability of interfacial phases in joint between lead free solder(Sn-3.0Ag-0.5Cu) and electroless Ni-W-P under bump metallizations(UBM) with different tungsten contents as a function of thermal aging. Content of phosphorus of each deposits was fixed at 8 wt.%, and content of tungsten was variated each 0, 3, 6 and 9 wt.%. Specimens were prepared by reflowing at $255^{\circ}C$, aging range was $200^{\circ}C$ and up to 2 weeks. After reflow process, in the electroless Ni(W)-P/solder joint, the interfacial intermetallic compound(IMC) was showed both $(Cu,Ni)_6Sn_5$ and $(Ni,Cu)_3Sn_4$. UBM and generated IMC at the interface of lead free solder was proportionally increased with aging time. The thickness of IMC was increased because the generation rate of $Ni(W)_3P$ decreased with increasing contents of W.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.