• 대한전자공학회논문지
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• 제26권12호
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• pp.2025-2031
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• 1989

In this paper, using optical effect of characteristics of GaAs compound, two potential application of optical controlled GaAs MESFET are demonstrated` detector, microwave amplifier gain control. These lead to the possibility of the interaction with optical devices. The preliminary experiments show the light induced voltage, the increase in the drain currnet and the change in the microwave scattering parameters of GaAs MESFET under optical illumination(He-Ne laser). And imcrowave amplifier gain is round to be varied with changing in intensity of optical illumination.

• 대한약학회:학술대회논문집
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• 대한약학회 2002년도 Proceedings of the Convention of the Pharmaceutical Society of Korea Vol.2
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• pp.342.2-342.2
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• 2002

The ${\beta}$-turn has been implicated as an important conformation for biological recognition of peptides or proteins. Benzodiazepine classes have been known as one of the non peptide ${\beta}$-turn mimic scaffolds. We have developed an efficient approach for the synthesis and derivatization of a scaffold of hydroxytetrahydrodizepinone class in order to screen compound library in various protein targets for new lead generations as well as for structure activity relationships of the scaffold. (omitted)

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• 한국지하수토양환경학회지:지하수토양환경
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• 제18권7호
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• pp.1-11
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• 2013

The actively soil pollution by the toxic heavy-metals like the arsenic, cadmium, lead due to the industrialization and economic activity. The uses the electrokinetic remediation of contaminated soil has many researches against the fine soil having a small size in the on going. However, it is the actual condition which the research result that is not effective due to the low surface charge of the particle and high permeability shows in the electrokinetic remediation in comparison with the fine soil in the case of the sandy soil in which the particle size is large. In this research, the electrokinetic remediation and ultrasonic wave fetch strategy is compound applied against the sandy soil polluted by the arsenic, cadmium, and lead removal efficiency of the sandy soil through the comparison with the existing electrokinetic remediation tries to be evaluated. First of all, desorption of contaminants in soil by ultrasonic extraction in the Pre-Test conducted to see desorption effective 5~15%. After that, By conducted Batch-Test results frequency output century 200 Khz, reaction time 30 min, contaminated soil used in experiment was 500 g. Removal efficiency of arsenic, cadmium, lead are 25.55%, 8.01%, 34.90%. But, As, Cd, Pb remediation efficiency less than 1% in EK1(control group).

• 농약과학회지
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• 제8권3호
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• pp.168-174
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• 2004

벼 도열병에 대하여 선택적으로 방제효과가 있는 2-이미노-1,3-티아졸린 유도체 1의 최적화 과정 중의 하나로서, 선도물질의 C-5 위치에 메틸기가 도입된 새로운 화합물 교를 합성하고 생물활성을 시험하였다. $\beta$-케토 에스터 7을 브롬화한 다음 thiourea와 반응시키고 가수분해하여 2-아미노-5-메틸-1,3-티아졸린 카르복실산 3을 얻었다. 이것을 아닐린 유도체와 각각 반응시켜 17종의 상응하는 2-이미노-5-메틸-1,3-티아졸린 카르복스 아닐리드 유도체 2를 합성하였다. 벼 도열병에 대한 화합물 2의 방제효과는 화합물 1보다 미약하였다. 2-이미노-1,3-티아졸린 유도체의 벼 도열병에 대한 방제효과는 C-5 위치의 치환체에 의하여 매우 큰 영향을 받았으며, 이것은 이 계열 화합물의 선도물질 최적화 과정에서 분자설계를 위한 중요한 자료가 된다.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2006년도 에너지.가스.기후변화학회 연합춘계학술대회 및 특별심포지움
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• pp.317-324
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• 2006

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, ($CH_{3})_{3}N$) 25wt%-clathrate compound with ethanol($CH_{3}CH_{2}OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5w% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C $ and minimum supercooling is $0.8,\;0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kJ/kgK$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature thermal storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• 생약학회지
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• 제36권1호통권140호
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• pp.56-59
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• 2005

Urease plays an important role in the urea metabolism and the effect of urease activity on human and environment is enormous. For instance, urease acts as a virulence factor of the urinary and gastrointestinal tracts infections in human and animal, being involved in kidney stone formation, catheter encrusatation, pyelonephritis, ammonia encephalopathy, hepatic coma, and urinary tract infections. Widespread urease activity in soil induces a plant damage due to ammonia toxicity and pH increase. Therefore, urease activity regulation through urease inhibitors would lead to an enhanced efficiency of urea nitrogen uptake in plants and to the improved therapeutic strategies for ureolytic bacterial infections. To search for new inhibitory compounds on urease activity from herbs, MeOH extracts of herbs were screened. Among of them, the MeOH extracts of Areca catechu exhibited an excellent inhibitory effect on urease activity. Two compounds were isolated from the ethyl acetate fraction by the activity guided fractionation. Their chemical structures were identified as (+)-catechin(compound I) and allantoin(compound II) by spectroscopic evidence, respectively. Compound I showed a stronger inhibitory effect on urease activity than compound II.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• 한국자동차공학회논문집
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• 제15권1호
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• pp.23-28
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• 2007

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, $(CH_3)_3N$) 25wt%-water clathrate compound with ethanol($CH_3CH_2OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5wt% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C$ and minimum supercooling is 0.8, $0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kcal/kg^{\circ}C$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature latent heat storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.1-7
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• 2004

주석 도금은 특정 환경하에서 위스커를 발생시키며, 이는 전자부품의 불량을 초래한다. 최근 세계곳곳에서는 환경보호를 위해 "무연"의 사용을 권고하고 있다. 본 논문에서는 두 종류 무연 도금 재료에서 도금 온도와 신뢰성시험 하에서 성장하는 위스커를 평가하였다. 도금 온도가 높아질수록 표면에 형성되는 도금 입자의 크기는 커지고, 위스커의 성장은 작아진다. 또한 온도 순환시험에서 성장한 위스커는 무광택 Sn 도금은 굽은 모양을, 무광택 Sn-Bi에서는 줄무의 모양이 관찰되었고, Sn 도금에 비해 Sn-Bi에서 위스커가 작게 성장하였다. 무광택 Sn 도금된 FeNi42 리드프레임은 TC 300 사이클에서 직경이 $7.0{\~}10.0{\mu}m$이고, 길이가 $25.0{\~}45.0{\mu}m$인 위스커가 성장하였다. 또한 Cu는 300 사이클에서는 표면에 노듈(핵 상태)만이 관찰되었고, 600 사이클에서 길이가 $3.0{\~}4.0{\mu}m$의 위스커로 성장하였다. TC 600 사이클 후 FeNi42는 계면에서 ${\~}0.34{\mu}m$의 얇은 $Ni_3Sn_4$가, Cu에서는 두께가 $0.76{\~}l.14{\mu}m$인 $Cu_6Sn_5$와 ${\~}0.27{\mu}m$의 $Cu_3Sn$ 화합물들이 두껍게 성장하였다. 따라서 FeNi42 리드프레임은 열팽창계수의 차이, Cu에서는 금속간 화합물의 형성이 위스커의 성장에 영향을 미치는 주요 인자이다.