• 산업경영시스템학회지
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• 제26권3호
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• pp.67-73
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• 2003

Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication t hat has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.

• Journal of Welding and Joining
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• 제20권3호
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• pp.16-23
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• 2002

• Elastomers and Composites
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• 제57권2호
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• pp.48-54
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• 2022

A polymeric adhesion promoter was synthesized to improve the adhesive strength of the Ni lead frame/epoxy composite. Poly(itaconic acid-co-acrylamide) (IAcAAM) was prepared by copolymerizing itaconic acid and acrylamide. We compared the adhesive strength between the Ni lead frame and epoxy composite according to the molecular weight of IAcAAM. The molecular weight of IAcAAM was controlled using an initiator, which made it possible to use IAcAAM in the epoxy molding compound (EMC) manufacturing process by modulating the melting temperature. The adhesive strength of Ni lead frame/epoxy composite increased with the addition of IAcAAM to the epoxy composite. In addition, as the molecular weight of IAcAAM increased, the adhesive strength of the Ni lead frame/epoxy composite slightly increased. We confirmed that IAcAAM with an appropriate molecular weight can be used in the EMC manufacturing process and increase the adhesive strength of the Ni lead frame/epoxy composite.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.335-336
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• 2006

Compound semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study, we design data acquisition system of compound semiconductor fabrication that has monitoring and control of process. The developed DAS is consisted of key-in system inputted by operator and automatic acquisition system by GEM protocol. And we implemented them in the actual compound semiconductor. It is expected that using developed system would offer precise process information to buyer, reduce a lead-time, and obey a due-dates and so on.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1337-1342
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• 2008

The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

• 한국경영과학회:학술대회논문집
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• 한국경영과학회/대한산업공학회 2003년도 춘계공동학술대회
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• pp.1042-1047
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• 2003

Due to the Importance of lead time demand in the design of Inventory management systems. researchers and practitioners have paid continuous attention and a few analytic models using the compound distribution approach have been reported. However, since the nature or compound distributions is hardly amenable. the analytic models have been done by non-recognition of the compound nature or some components to reduce the analytic task. This study concerns some of the important aspects in the analytic models. Through the theoretic examination of the analytic model approach and the comparison with the rigid compound stochastic process approach. this study clarifies the assumptions implicitly made by the analytic models and provides some precautions in using the analytic models.

• Bulletin of the Korean Chemical Society
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• 제35권4호
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• pp.1154-1158
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• 2014

Hsp90 is an ubiquitous molecular chaperone protein, which plays an important role in regulating maturation and stabilization of many oncogenic proteins. Due to its potential to simultaneously disable multiple signaling pathways, Hsp90 represents great promise as a therapeutic target of cancer. In this study, we synthesized flavokawain analogues and evaluated their biological activities against drug-resistant cancer cells. The study indicated that compound 1i impaired the growth of gefitinib-resistant non-small cell lung cancer (H1975), down-regulated the expression of Hsp90 client proteins including EGFR, Her2, Met, Akt and Cdk4, and upregulated the expression of Hsp70. The result strongly suggested that compound 1i inhibited the proliferation of cancer cells through Hsp90 inhibition. Overall, compound 1i could serve as a potential lead compound to overcome the drug resistance in cancer chemotherapy.

• Archives of Pharmacal Research
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• 제23권1호
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• pp.31-34
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• 2000

An efficient procedure for the preparation of 7,8-dichloro-6-nitro-1H-1,5-benzodiazepine-2,4-(3H, 5H)-dione(7) as a potential lead compound for the NMDA receptor glycine binding site antagonist, starting from readily available 4,5-dichloro-2-nitroaniline(8), is described. The key step in the synthesis involves the cyclization of malonic ester amide 10 to compound 11.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.37-44
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• 2013

유연 솔더가 실장된 패키지와 무연 솔더가 실장된 패키지의 온도에 따른 변형 거동은 솔더 자체의 물성치 뿐만 아니라 패키지를 구성하는 재료의 물성치에도 큰 영향을 받는다고 알려져 있다. 본 논문에서는 스트레인 게이지의 온도특성을 이용하여 미지 재료의 열팽창계수를 결정하는 방법을 정립하고, 반도체 패키지 몰딩 화합물의 열팽창계수를 실험적으로 구하였다. 탄소강과 알루미늄 시편을 기준 시편으로 사용하고 스트레인 게이지 측정을 통하여 온도에 따른 유연 솔더용 몰딩 화합물과 무연 솔더용 몰딩 화합물의 열팽창계수를 구하고, 무아레 간섭계를 이용하여 비접촉적으로 열팽창 계수를 측정하여 결과를 비교하였다. 기준 시편에 따른 두 가지 스트레인 게이지 실험 결과와 무아레 실험 결과가 잘 일치하여서 실험방법에 신뢰성이 있는 것을 보였다. 유연 솔더용 몰딩 화합물의 경우에는 열팽창계수가 온도에 관계없이 약 $15.8ppm/^{\circ}C$로 측정되었고, 무연 솔더용의 경우에는 $100^{\circ}C$이하의 온도에서 몰딩 화합물의 열팽창계수는 약 $9.9ppm/^{\circ}C$이었으나 $100^{\circ}C$이상에서는 온도가 증가함에 따라 열팽창계수가 급격하게 증가되어 $130^{\circ}C$에서는 $15.0ppm/^{\circ}C$의 값을 가졌다.

• 대한약학회:학술대회논문집
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• 대한약학회 2002년도 Proceedings of the Convention of the Pharmaceutical Society of Korea Vol.2
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• pp.181-182
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• 2002

Recentadvancesin '-omics ' technologies enable us to discover more diverse disease- relevant target proteins, which encourages us to find out more target-specific novel lead compounds as new drug candidates. Therefore, high-throughput screening (HTS) becomes an essential tool in this area. Among many HTS tools, in silico HTS is a very fast and cost-effective tool to try to derive a new lead compound for any new targets, especially when the target protein structures are known or readily modeled. (omitted)