• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.12
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• pp.2025-2031
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• 1989

In this paper, using optical effect of characteristics of GaAs compound, two potential application of optical controlled GaAs MESFET are demonstrated` detector, microwave amplifier gain control. These lead to the possibility of the interaction with optical devices. The preliminary experiments show the light induced voltage, the increase in the drain currnet and the change in the microwave scattering parameters of GaAs MESFET under optical illumination(He-Ne laser). And imcrowave amplifier gain is round to be varied with changing in intensity of optical illumination.

• Proceedings of the PSK Conference
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• 2002.10a
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• pp.342.2-342.2
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• 2002

The ${\beta}$-turn has been implicated as an important conformation for biological recognition of peptides or proteins. Benzodiazepine classes have been known as one of the non peptide ${\beta}$-turn mimic scaffolds. We have developed an efficient approach for the synthesis and derivatization of a scaffold of hydroxytetrahydrodizepinone class in order to screen compound library in various protein targets for new lead generations as well as for structure activity relationships of the scaffold. (omitted)

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.1-8
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• 2018

In the soldering industry, a variety of lead-free solders have been developed as a part of restricting lead in electronic packaging. Sn-Ag-Cu (SAC) lead-free solder is regarded as one of the most superior candidates, owing to its low melting point and high solderability as well as the mechanical property. On the other hand, the mechanical property of SAC solder is directly influenced by intermetallic compounds (IMCs) in the solder joint. Although IMCs in SAC solder play an important role in bonding solder joints and impart strength to the surrounding solder matrix, a large amount of IMCs may cause poor strength, due to their brittle nature. In other words, the mechanical properties of SAC solder are of some concern because of the formation of large and brittle IMCs. As the IMCs grow, they may cause poor device performance, resulting in the failure of the electronic device. Therefore, new solder technologies which can control the IMC growth are necessary to address these issues satisfactorily. There are an advanced nanotechnology for microstructural refinement that lead to improve mechanical properties of solder alloys with nanoparticle additions, which are defined as nano-reinforced solders. These nano-reinforced solders increase the mechanical strength of the solder due to the dispersion hardening as well as solderability of the solder. This paper introduces the nano-reinforced solders, including its principles, types, and various properties.

• Journal of Soil and Groundwater Environment
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• v.18 no.7
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• pp.1-11
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• 2013

The actively soil pollution by the toxic heavy-metals like the arsenic, cadmium, lead due to the industrialization and economic activity. The uses the electrokinetic remediation of contaminated soil has many researches against the fine soil having a small size in the on going. However, it is the actual condition which the research result that is not effective due to the low surface charge of the particle and high permeability shows in the electrokinetic remediation in comparison with the fine soil in the case of the sandy soil in which the particle size is large. In this research, the electrokinetic remediation and ultrasonic wave fetch strategy is compound applied against the sandy soil polluted by the arsenic, cadmium, and lead removal efficiency of the sandy soil through the comparison with the existing electrokinetic remediation tries to be evaluated. First of all, desorption of contaminants in soil by ultrasonic extraction in the Pre-Test conducted to see desorption effective 5~15%. After that, By conducted Batch-Test results frequency output century 200 Khz, reaction time 30 min, contaminated soil used in experiment was 500 g. Removal efficiency of arsenic, cadmium, lead are 25.55%, 8.01%, 34.90%. But, As, Cd, Pb remediation efficiency less than 1% in EK1(control group).

• The Korean Journal of Pesticide Science
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• v.8 no.3
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• pp.168-174
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• 2004

In a course of the process for a lead optimization of 2-imino-l,3-thiazolines 1 which show a selective in vivo antifungal activity against rice blast, new compounds 2 in which C-5 was substituted by methyl group of the lead compound were synthesized and tested for the biological activity. Bromination of $\beta$-keto ester 7 followed by the reaction with thiourea and hydrolysis gave 2-imino-5-methyl-l,3-thiazoline carboxylic acid 3. Coupling reactions of 3 with aniline derivatives afforded 17 kinds of the corresponding 2-imino-5-methyl-l,3-thiazoline carboxanilides 2. Their in vivo antifungal activity against rice blast was weaker than that of 1, indicating that the in vivo antifungal activity of 2-imino-l,3-thiazolines was affected by the substituent at C-5. These results would be an important data for the molecular design in the lead optimization process of this series.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2006.05a
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• pp.317-324
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• 2006

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, ($CH_{3})_{3}N$) 25wt%-clathrate compound with ethanol($CH_{3}CH_{2}OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5w% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C $ and minimum supercooling is $0.8,\;0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kJ/kgK$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature thermal storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• Korean Journal of Pharmacognosy
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• v.36 no.1 s.140
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• pp.56-59
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• 2005

Urease plays an important role in the urea metabolism and the effect of urease activity on human and environment is enormous. For instance, urease acts as a virulence factor of the urinary and gastrointestinal tracts infections in human and animal, being involved in kidney stone formation, catheter encrusatation, pyelonephritis, ammonia encephalopathy, hepatic coma, and urinary tract infections. Widespread urease activity in soil induces a plant damage due to ammonia toxicity and pH increase. Therefore, urease activity regulation through urease inhibitors would lead to an enhanced efficiency of urea nitrogen uptake in plants and to the improved therapeutic strategies for ureolytic bacterial infections. To search for new inhibitory compounds on urease activity from herbs, MeOH extracts of herbs were screened. Among of them, the MeOH extracts of Areca catechu exhibited an excellent inhibitory effect on urease activity. Two compounds were isolated from the ethyl acetate fraction by the activity guided fractionation. Their chemical structures were identified as (+)-catechin(compound I) and allantoin(compound II) by spectroscopic evidence, respectively. Compound I showed a stronger inhibitory effect on urease activity than compound II.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.23-28
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• 2007

This study aims to find out cooling characteristics of TMA(Tri-Methyl-Amine, $(CH_3)_3N$) 25wt%-water clathrate compound with ethanol($CH_3CH_2OH$) such as supercooling, phase change temperature and specific heat. For this purpose, ethanol is added as per weight concentration and cooling experiment is performed at $-6{\sim}-8^{\circ}C$, cooling heat source temperature, and it leads the following result. (1) Phase change temperature is decreased due to freezing point depression phenomenon. Especially, it is minimized as $3.8^{\circ}C$ according to cooling source temperature in case that 0.5wt% of ethanol is added. (2) If 0.5wt% of ethanol is added, average supercooling degree is $0.9^{\circ}C$ and minimum supercooling is 0.8, $0.7^{\circ}C$ according to cooling heat source temperature. The restraint effect of supercooling is shown. (3) Specific heat shows tendency to decrease if ethanol is added. It is $3.013{\sim}3.048\;kcal/kg^{\circ}C$ according to cooling heat source temperature if 0.5wt% of ethanol is added. Phase change temperature higher than that of water and inhibitory effect against supercooling can be confirmed through experimental study on cooling characteristics of TMA 25wt%-water clathrate compound by adding additive, ethanol. This can lead to shorten refrigerator operation time of low temperature latent heat storage system and improve COP of refrigerator and efficiency of overall system. Therefore energy can be saved and efficiency can be improved much more.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.1-7
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• 2004

Tin plating on component finishes may grow whiskers under certain conditions, which may cause failures in electronics equipment. To protect the environment, 'lead-free' among component finishes is being promoted worldwide. This paper presents the evaluation results of whiskers on two kinds of lead-free plating materials at the plating temperature and under the reliability test. The rising plating temperature caused increasing the size of plating grain and shorting the growth of whisker. The whisker was grown under the temperature cycling the bent type in matt Sn plating and striated type in malt Sn-Bi. The whisker growth in Sn-Bi plating was shorter than that in Sn plating. In FeNi42 leadframe, the $7.0{\~}10.0{\mu}m$ diameter and the $25.0{\~}45.0{\mu}m$ long whisker was grown under 300 cycles. In the 300 cycles of Cu leadframe, only the nodule(nuclear state) grew on the surface, and in the 600 cycles, a $3.0{\~}4.0{\mu}m$ short whisker grew. After 600 cycles, the ${\~}0.34{\mu}m$ thin $Ni_3Sn_4$ formed on the Sn-plated FeNi42. However, we observed the amount of $0.76{\~}1.14{\mu}m$ thick $Cu_6Sn_5$ and ${\~}0.27{\mu}m$ thin $Cu_3Sn$ intermetallics were observed between the Sn and Cu interfaces. Therefore, the main growth factor of a whisker is the intermetallic compound in the Cu leadframe, and the coefficient of thermal expansion mismatch in FeNi42.