• Title/Summary/Keyword: Lead Free

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Reliability of Fine Pitch Solder Joint with Sn-3.5wt%Ag Lead-Free Solder (Sn-3.5wt%Ag 비납솔더를 이용한 미세피치 솔더접합부의 신뢰성에 관한 연구)

  • 하범용;이준환;신영의;정재필;한현주
    • Journal of Welding and Joining
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    • v.18 no.3
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    • pp.89-96
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    • 2000
  • As solder becomes small and fine, the reliability and solderability of solder joint are the critical issue in present electronic packaging industry. Besides the use of lead(Pb) containing solders for the interconnections of microelectronic subsystem assembly and packaging has enviromental problem. In this study, using Sn/Pb and Sn/Ag eutectic solder paste, in order to obtain decrease of solder joint strength with increasing aging time, initial solder joint strength and aging strength after 1000 hour aging at $100^{\circ}C$ were measured by peel test. And in order to obtain the growth of intermetallic compound(IMC) layer thickness, IMC layer thickness was measured by scanning electron microscope(SEM). As a result, solder joint strength was decreased with increasing aging time. The mean IMC layer thickness was increased linearly with the square root of aging time. The diffusion coefficient(D) of IMC layer was found to $1.29{\times}10^{-13}{\;}cm^2/s$ at using Sn/Pb solder paste, 7.56{\times}10^{-14}{\textrm}{cm}^2/s$ at using Sn/Ag solder paste.

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Prediction of a research vessel manoeuvring using numerical PMM and free running tests

  • Tiwari, Kunal;Hariharan, K.;Rameesha, T.V.;Krishnankutty, P.
    • Ocean Systems Engineering
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    • v.10 no.3
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    • pp.333-357
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    • 2020
  • International Maritime Organisation (IMO) regulations insist on reduced emission of CO2, noxious and other environmentally dangerous gases from ship, which are usually let out while burning fossil fuel for running its propulsive machinery. Contrallability of ship during sailing has a direct implication on its course keeping and changing ability, and tries to have an optimised routing. Bad coursekeeping ability of a ship may lead to frequent use of rudder and resulting changes in the ship's drift angle. Consequently, it increases vessels resistance and also may lead to longer path for its journey due to zigzag movements. These adverse effects on the ship journey obviously lead to the increase in fuel consumption and higher emission. Hence, IMO has made it mandatory to evaluate the manoeuvring qualities of a ship at the designed stage itself. In this paper a numerical horizontal planar motion mechanism is simulated in CFD environment and from the force history, the hydrodynamic derivatives appearing in the manoeuvring equation of motion of a ship are estimated. These derivatives along with propeller thrust and rudder effects are used to simulate different standard manoeuvres of the vessel and check its parameters against the IMO requirements. The present study also simulates these manoeuvres by using numerical free running model for the same ship. The results obtained from both these studies are presented and discussed here.

$Fe_2O_3$ 첨가에 따른 $(Ka,K)NbO_3$ 세라믹스의 유전 및 압전 특성

  • Seo, Byeong-Ho;Ryu, Ju-Hyeon;Kim, In-Seong;Song, Jae-Seong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.95-95
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    • 2009
  • Lead-free $(K_{0.5}Na_{0.5})(Nb_{0.96}Sb_{0.04)O_3$ + 1.2 mol% $K_4CuNb_8O_{23}$ + x mol% $Fe_2O_3$ ceramics were manufactured by a conventional solid state reaction method. And then, their piezoelectric and dielectric properties were investigated. At the 0.2 mol% $Fe_2O_3$ doped ceramics, the values of Kp=0.436 and Qm=696.36 were obtained, respectively, which were suitable for piezoelectric transformer application.

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A Review of Ag Paste Bonding for Automotive Power Device Packaging (자동차용 파워 모듈 패키징의 은 소재를 이용한 접합 기술)

  • Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.15-23
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    • 2015
  • Lead-free bonding has attracted significant attention for automotive power device packaging due to the upcoming environmental regulations. Silver (Ag) is one of the prime candidates for alternative of high Pb soldering owing to its superior electrical and thermal conductivity, low temperature sinterability, and high melting temperature after bonding. In this paper, the bonding technology by Ag paste was introduced. We classified into two Ag paste bonding according to applied pressure, and each bonding described in detail including recent studies.

An Experimental Study on the Vibration Absorber for Vibration Attenuation of Cantilever Beam Structure (외팔보 구조물의 진동감쇠를 위한 동흡진기의 실험적 연구)

  • Kwag, Dong-Gi;Bae, Jae-Sung;Hwang, Jai-Hyuk;Kim, Hun-Soo
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.21 no.11
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    • pp.991-996
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    • 2011
  • This study was carried out vibration attenuation of vibration absorber attached to the cantilever beam structure. Modern tank guns are stabilized to allow fire on the move while traversing uneven terrain. However, as the length of the barrel is extended, to meet required muzzle exit velocities, the terrain induced vibrations lead to increased muzzle pointing errors. Thus, reducing these vibrations should lead to increased accuracy. The vibration absorber includes a compliant energy storage device, such as a spring, and a mass secured to the energy storage device. In this study, it accomplished a research in about gun barrel vibration attenuation using tuned mass damper. The barrel was hung from a bungee cord for free-free condition. It accomplished a vibration experiment for verified attenuation efficiency.

Secondary Electron Emission Properties with Lead and Lead-Free Dielectric in AC-PDP

  • Cha, Myung-Lyoung;Lee, Hye-Jung;Choi, Eun-Ha;Kim, Hyung-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07b
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    • pp.1255-1257
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    • 2005
  • The increase of secondary electron-emitting coefficient is effective to reduce the discharge voltage as well as to improve the luminance efficiency of PDP. We investigated the properties of ${\gamma}$ with composition and different dielectric constants, and the microstructure of dielectric after ion collision. As a result the dielectric of PbO system showed higher ${\gamma}$ compared with Pb-free system. However, there was no difference in ${\gamma}$ when the MgO protective layer was covered.

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Piezoelectric and Electrical properties of KNN ceramics as a function of the Variation of Nb (Nb 변화에 따른 KNN 세라믹스의 압전 및 전기적 특성)

  • Lee, Kba-Soo;Yoo, Ju-Hyun;Kim, In-Sung;Song, Jae-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.302-302
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    • 2010
  • The lead-free piezoelectric ceramics must have high piezoelectric properties and electrical properties for the applications of piezoelectric devices. Therefore, KNN ceramics were investigated as a function of the variation of Nb. The density was increased with the increase of Nb. The density was saturated above 0.8895 mol Nb. The maximum value of electromechanical coupling coefficient(kp) was obtained 0.428 at 0.8895mol Nb. This result can be attributed to the well sintered of specimens. Also, The maximum value of mechanical quality factor(Qm) showed 1554 at 0.8895mol Nb. Therefore, this composition can be used for application of piezoelectric device such as piezoelectric transformer and piezoelectric actuator.

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Piezoelectric and Dielectric Properties of (Na,K)(Nb,Sb)$O_3$ Ceramics According to the Amount of $Bi_2O_3$ Addition ($Bi_2O_3$ 첨가에 따른 (Na,K)(Nb,Sb)$O_3$ 세라믹스의 압전 및 유전 특성)

  • Lee, Sang-Ho;Yoo, Ju-Hyun;Jeong, Yeong-Ho;Park, Yong-Wook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.305-305
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    • 2010
  • In this study, in order to develop excellent lead free piezoelectric ceramics for piezoelectric transformer application (Na,K)(Nb,Sb)$O_3$ ceramics were fabricated using conventional oxides mixed method and their piezoelectric and dielectric characteristics were investigated according to the amount of $Bi_2O_3$ addition.

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Effect of Frit Compositions on Properties of Lead Free Conductor and Resistor Pastes (무연계 도체 및 저항체 페이스트의 특성에 미치는 프릿트 조성의 영향)

  • Kim, Bit-Na;Youm, Mi-Rea;Koo, Bon-Keup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.335-335
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    • 2010
  • $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $ZrO_2$, $Bi_2O_3$를 이용하여 성질이 다른 두 종류의 무연계 프릿트를 제조하여 특성을 표준화 하였고, 이들 무연계 프릿트를 이용하여 Ag계 도체 및 $RuO_2$계 저항페이스트롤 제조하여 특성에 미치는 프릿트 조성의 영향을 연구하였다. $B_2O_3$를 첨가하여 퍼짐특성이 큰 프릿트의 경우 더 우수한 페이스트 특성을 나타내었다.

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Study on the Prediction of Fatigue Life of BGA Typed Solder Joints (BGA 형태 솔더 접합부의 피로 수명 예측에 관한 연구)

  • Kim, Seong-Keol;Kim, Joo-Young
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.1
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    • pp.137-143
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    • 2008
  • Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper describes the life prediction models for SnAgCu and SnPb solder joints, based upon non-linear finite element analysis (FEA). In case of analyses of the SnAgCu solder joints, two kinds of shapes are used. As a result, it is found that the SnAgCu solder has longer fatigue life than the SnPb solder in temperature cycling analyses.