• Title/Summary/Keyword: Lead Frame

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A numerical deformation analysis of micro elements by stamping orders (스탬핑 순서가 미치는 미세요소 변형 수치해석)

  • Lee, Chang-Hee;Kim, Yong-Yun
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.12 s.177
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    • pp.156-162
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    • 2005
  • In this paper, we study the mechanism of lead deformation by numerically simulating the stamping process by means of a commercial finite element code. It is very important to analyze effects that the lead shape makes on the lead deformation, because the lead shape is often modified in order to minimize the deformation or to increase the buckling critical load of the punch. Therefore the stamping process, first, numerically simulated by considering as a quasi-static problem. Second, the effect on the lead deformation due to the lead shape variation, a linear lead geometry and a bent lead, was numerically analyzed and discussed. Finally, the punching order was optimized fur multi-lead generating stamping process. The results show that the bent lead is little bit more shifted than the linear lead after the punching process. But the bent lead is vertically less deformed than the linear lead. The punching order to successively generate the lead is good to keep the lead space uniform. The results will be very effectively applied for the design of the blanking or punching dies in industry.

Study on the Casting Technology and Restoration of "Sangpyong Tongbo" (상평통보 주조와 복원기술연구)

  • Yun, Yong-hyun;Cho, Nam-chul;Jeong, Yeong-sang;Lim, In-ho
    • Korean Journal of Heritage: History & Science
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    • v.47 no.4
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    • pp.224-243
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    • 2014
  • This study examined the materials and casting technology(cast, alloy, etc.) used in the manufacturing of bronze artifacts based on old literature such as Yongjae Chonghwa, Cheongong Geamul, and The Korea Review. In the casting experiment for restoration of Sangpyong Tongbo, a bronze and brass mother coin mold was made using the sand mold casting method described in The Korea Review. The cast was comprised of the original mold plate frame, wooden frame, and molding sand. Depending on the material of the outer frame, which contains the molding sand, the original mold plate frame can be either a wooden frame or steel frame. For the molding sand, light yellow-colored sand of the Jeonbuk Iri region was used. Next, the composition of the mother alloy used in the restoration of Sangpyong Tongbo was studied. In consideration of the evaporation of tin and lead during actual restoration, the composition of Cu 60%, Zn 30%, and Pb 10% for brass as stated in The Korea Review was modified to Cu 60%, Zn 35%, and Pb 15%. For bronze, based on the composition of Cu 80%, Sn 6%, and Pb 14% used for Haedong Tongbo, the composition was set as Cu 80%, Sn 11%, and Pb 19%. The mother coin mold was restored by first creating a wooden father coin, making a cast from the wooden frame and basic steel frame, alloying, casting, and making a mother coin. Component analysis was conducted on the mother alloy of the restored Sangpyong Tongbo, and its primary and secondary casts. The bronze mother alloy saw a 5% increase in copper and 4% reduction in lead. The brass parent alloy had a 5% increase in copper, but a 4% and 12% decrease in lead and tin respectively. Analysis of the primary and secondary mother coin molds using an energy dispersive spectrometer showed that the bronze mother coin mold had a reduced amount of lead, while the brass mother coin mold had less tin. This can be explained by the evaporation of lead and tin in the melting of the primary mother coin mold. In addition, the ${\alpha}$-phase and lead particles were found in the mother alloy of bronze and brass, as well as the microstructure of the primary and secondary coin molds. Impurities such as Al and Si were observed only in the brass mother coin mold.

Design and Construction of 35 kWh Class Superconductor Flywheel Energy Storage System Main Frame (35 kWh급 초전도 플라이휠 에너지 저장 시스템 프레임 설계 및 제작)

  • Jung, S.Y.;Han, Y.H.;Park, B.J.;Han, S.C.
    • Progress in Superconductivity
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    • v.13 no.1
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    • pp.52-57
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    • 2011
  • A superconductor flywheel energy storage system (SFES) is an electro-mechanical battery which transforms electrical energy into mechanical energy for storage, and vice versa. The 35 kWh class SFES is composed of a main frame, superconductor bearings, electro-magnetic dampers, a motor/generator, and a composite flywheel. The energy storing capacity of the SFES can be limited by the operational speed range of the system. The operational speed range is limited by many factors, especially the resonant frequency of the main frame and flywheel. In this study, a steel frame has been designed and constructed for a 35 kWh class SFES. All the main parts, their housings, and the flywheel are aligned and assembled on to the main frame. While in operation, the flywheel excites the main frame, as well as all the parts assembled to it, causing the system to vibrate at the rotating speed. If the main frame is excited at its resonant frequency, the system will resonate, which may lead to unstable levitation at the superconductor bearings and electro-magnetic dampers. The main frame for the 35 kWh class SFES has been designed and constructed to improve stiffness for the stable operation of the system within the operational speed range.

Chip Pin Parasitic Extraction by Using TDR and NA (TDR 및 NA를 이용한 Chip Pin Parasitic 추출)

  • 이현배;박홍준
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.899-902
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    • 2003
  • Chip Pin Parasitic은 실제 Chip Pad에서부터 Bonding Wire를 통한 Package Lead Frame까지를 의미한다. 여기서, Lead Frame 및 Bonding Wire에서 Inductance 및 작은 저항이 보이고, Chip Pad에서의 Capacitance, 그리고 Pad 부터 Ground까지의 Return Path에서 발생하는 저항이 보인다. 이들을 모두 합하면 L, R, C의 Series로 나타낼 수 있다. 본 논문에서는 이런 Chip Pin Parasitic을 추출 하기 위해서 TDR(Time Domain Reflectometer)과 NA(Network Analyzer)를 사용하였는데, TDR의 경우 PCB를 제작하여 Chip을 Board위에 붙인 후 Time Domain에서 측정 하였고 NA의 경우 Pico Probe를 이용하여 Chip pin에 직접 Probing해서 Smith Chart를 통하여 Extraction 값을 추출했다. 이 경우, NA를 이용한 측정이 좀 더 정확한 Parasitic 값을 추출할 수 있으리라 예상되겠지만, 실제로 Chip이 구동하기 위해서는 Board위에 있을 때의 상황도 고려해야 하기 때문에 TDR 추출 값과 NA 추출 값을 모두 비교하였다.

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Press and Die Deformation for a Precise Semiconductor Lead Frame (반도체 산업의 정밀리드프레임에 대한 프레스 및 금형 변형 예측)

  • Hong, S.;Yoon, Y.;Eom, S.;Hwang, J.;Lee, D.
    • Transactions of Materials Processing
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    • v.23 no.4
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    • pp.206-210
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    • 2014
  • The metal lead frame, a semiconductor component, has product tolerances in micro units as compared to products made with a larger size mold. Therefore, small deflections of the mold and of the press as well as the press molding process itself have a strong influence on accuracy of the product. Hence, it is necessary for the process design to consider the structural response of the mold and the press during deformation. In the current study, the mold deflection and pressure on the punch is examined using the finite element modeling (FEM) program ABAQUS. The results from the simulation were verified with the dynamic deformation measurement equipment using digital image correlation (DIC).

Analysis of the effect on the whisker growth as grain size of plating and base metal (Plating 및 Base metal의 Grain size에 따른 Whisker 성장 영향 분석)

  • Kim, Su-Jin;Chang, Mi-Soon;Kwack, Kae-Dal
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1337-1342
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    • 2008
  • The whisker grows at the plating of a lead frame so that it causes the serious problem like the short. To prove this case, many people have studied the cause and influence of the tin whisker growth. This study explains the grain size affects the growth of the whisker in the lead frame. By these studies about the whisker, the whisker growth is discovered by stresses generated by the intermetallic compound and CTE mismatch in both plating and base metal. The stresses or lattice defect generated in the plating process changes grain structure of plating. Consequently, these various stresses are stabilized by forming unspecified whiskers through lots of grain boundaries. Because the grain boundary is the path of the whisker growth, the smaller grain size exists, the more whiskers grow.

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Reflectivity of Sn-3.5Ag Solder for LED lead frame (LED 리드프레임을 위한 Sn-3.5Ag 솔더의 반사율)

  • Gi, Se-Ho;Xu, Zengfeng;Choe, Jeong-Beom;Kim, Won-Jung;Jeong, Jae-Pil
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.192-192
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    • 2011
  • 본 연구에서는 LED lead frame을 위한 Sn-3.5Ag 솔더의 젖음 특성과 반사율에 관하여 조사하였다. 금속기판과 액체금속간의 젖음성은 wetting balance tester를 이용하여 평가하였으며, 최대인출력, 최대인출시간 등을 측정하고 표면장력을 계산하였다. Sn-3.5Ag 솔더를 $250{\sim}290^{\circ}C$의 온도에서 젖음성을 측정하였는데 온도가 증가함에 따라 젖음성이 향상되는 것을 확인할 수 있었다. 또한 솔더가 도금된 Cu-coupon의 반사율을 측정하였는데 $270^{\circ}C$에서 가장 높은 반사율을 나타냈다.

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Seismic performance of secondary systems housed in isolated and non-isolated building

  • Kumar, Pardeep;Petwal, Sandeep
    • Earthquakes and Structures
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    • v.16 no.4
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    • pp.401-413
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    • 2019
  • The concept of base isolation for equipment is well known. Its application in buildings and structures is rather challenging. Introduction of horizontal flexibility at the base helps in proper energy dissipation at the base level thus reducing the seismic demand of the super structure to be considered during design. The present study shows the results of a series of numerical simulation studies on seismic responses of secondary system (SS) housed in non-isolated and base-isolated primary structures (PS) including equipment-structure interactions. For this study the primary structure consists of two similar single bay three-store reinforced cement concrete (RCC) Frame building, one non-isolated with conventional foundation and another base isolated with Lead plug bearings (LPB) constructed at IIT Guwahati, while the secondary system is modeled as a steel frame. Time period of the base isolated building is higher than the fixed building. Due to the presence of isolator, Acceleration response is significantly reduced in both (X and Y) direction of Building. It have been found that when compared to fixed base building, the base isolated building gives better performance in high seismic prone areas.

Synergetics based damage detection of frame structures using piezoceramic patches

  • Hong, Xiaobin;Ruan, Jiaobiao;Liu, Guixiong;Wang, Tao;Li, Youyong;Song, Gangbing
    • Smart Structures and Systems
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    • v.17 no.2
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    • pp.167-194
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    • 2016
  • This paper investigates the Synergetics based Damage Detection Method (SDDM) for frame structures by using surface-bonded PZT (Lead Zirconate Titanate) patches. After analyzing the mechanism of pattern recognition from Synergetics, the operating framework with cooperation-competition-update process of SDDM was proposed. First, the dynamic identification equation of structural conditions was established and the adjoint vector (AV) set of original vector (OV) set was obtained by Generalized Inverse Matrix (GIM).Then, the order parameter equation and its evolution process were deduced through the strict mathematics ratiocination. Moreover, in order to complete online structural condition update feature, the iterative update algorithm was presented. Subsequently, the pathway in which SDDM was realized through the modified Synergetic Neural Network (SNN) was introduced and its assessment indices were confirmed. Finally, the experimental platform with a two-story frame structure was set up. The performances of the proposed methodology were tested for damage identifications by loosening various screw nuts group scenarios. The experiments were conducted in different damage degrees, the disturbance environment and the noisy environment, respectively. The results show the feasibility of SDDM using piezoceramic sensors and actuators, and demonstrate a strong ability of anti-disturbance and anti-noise in frame structure applications. This proposed approach can be extended to the similar structures for damage identification.