• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.50-53
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• 2003

Most companies use technologies such as stereolithography, selective laser sintering, and fused deposition modeling to make parts for such small consumer products as telephones, heads, and shoes. The largest part that the existing RP systems can make is only 600 mm in length. Because most RP systems build parts by depositing, solidifying, or sintering material point-by-point, making larger objects takes a long time. and in many cases, large objects won't fit the build size. A new effective thick-layered RP process. Transfer type Variable Lamination Manufacturing using expandable polystyrene foam (VLM-ST) has been developed with thick layers and sloped surfaces. In this paper, a scaledown model of F16 Fighter with the length of 800 mm is rapidly fabricated using the VLM-ST process. In order to build a CAD model of F16 larger than 600 mm in length, the approach in VLM-ST is to build larger parts in multiple sub-parts and then glue them together. The fabricated result shows that the VLM-ST process employing thick layers and sloped surfaces is adequate for creating the real-sized large objects in the diverse fields such as automobiles, electric home appliances, electronics. and etc.

• Journal of the Korean Geosynthetics Society
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• v.6 no.1
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• pp.39-43
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• 2007

Geocomposites of needle punched and spunbonded nonwovens having the reinforcement and drainage functions were manufactured by use of thermal bonding method. The physical properties (e.g. tensile, tear and bursting strength, permittivity) of these multi-layered nonwovens were dependent on the processing parameters of temperatures, pressures, bonding periods etc. - in manufacturing by use of thermal bonding method. Therefore, it is very meaningful to optimize the processing parameters and physical properties of the geocomposites by thermal bonding method. In this study, an algorithm has been developed to optimize the process of the geocomposites using an artificial neural network (ANN). Geocomposites were employed to examine the effects of manufacturing methods on the analysis results and the neural network simulations have been applied to predict the changes of the nonwovens performances by varying the processing parameters.

• Journal of the Korea Safety Management & Science
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• v.6 no.4
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• pp.155-170
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• 2004

Among the semiconductor If-chips, unlike memory chips, a majority of Application Specific IC(ASIC) products are produced by customer orders, and meeting the customer specified due date is a critical issue for the case. However, to the one who understands the nature of semiconductor manufacturing, it does not take much effort to realize the difficulty of meeting the given specific production due dates. Due to its multi-layered feature of products, to be completed, a semiconductor product(called device) enters into the fabrication manufacturing process(FAB) repeatedly as many times as the number of the product specified layers, and fabrication processes of individual layers are composed with similar but not identical unit processes. The unit process called photo-lithography is the only process where every layer must pass through. This re-entrant feature of FAB makes predicting and planning of due date of an ordered batch of devices difficult. Parallel machines problem in the photo process, which is bottleneck process, is solved with restricted roll out algorithm. Roll out algorithm is a method of solving the problem by embedding it within a dynamic programming framework. Restricted roll out algorithm Is roll out algorithm that restricted alternative states to decrease the solving time and improve the result. Results of simulation test in condition as same as real FAB facilities show the effectiveness of the developed algorithm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.4
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• pp.355-360
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• 2014

Recently, the use of LED is increasing. This paper presents the new package process of thermal compression bonding using metal layered LED chip for the high power LED device. Effective thermal dissipation, which is required in the high power LED device, is achieved by eutectic/flip chip bonding method using metal bond layer on a LED chip. In this study, the process condition for the LED eutectic die bonder system is proposed by using the analysis program, and some experimental results are compared with those obtained using a DST (Die Shear Tester) to illustrate the reliability of the proposed process condition. The cause of bonding failures in the proposed process is also investigated experimentally.

• Laser Solutions
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• v.11 no.4
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• pp.29-34
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• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.73-82
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• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.3
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• pp.14-19
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• 2007

Rapid prototyping (RP) technology can fabricate any 3D physical model regardless of geometric complexity using the layered manufacturing (LM) process. Stereolithography (SL) is the best-known example of RP technology. In general, the surface quality of a raw SL-generated part is unsatisfactory for industrial purposes due to the step artefact created by the LM process. Despite of the increased number of applications for SL parts, this side effect limits their uses. In order to improve their surface quality, additional post-machining finishing, such as traditional grinding, is required, but post-machining is time consuming and can reduce the geometric accuracy of a part. Therefore, this study proposes a post-machining technology combining coating and grinding processes to improve the surface quality of SL parts. Paraffin wax and pulp are used as the coating and grinding materials. By grinding the coating wax only up to the boundary of the part, the surface smoothness can be improved without damaging the surface. Finally, moulding and casting experiments were performed to confirm the suitability of the SL parts finished using the proposed process with rapid tooling (RT) techniques.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.240-241
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• 2007

In general, high temperature superconducting coated conductors have intermediary buffers layer consisting of seed, diffusion barrier and cap layers. Simplification of the oxide materials buffer architecture in the fabrication of high temperature superconducting coated conductors is required because the deposition of multi-layers buffer architecture leads to a longer manufacturing time and a higher cost process of coated conductors. Thus, single buffer layer deposition seems to be important for practical coated conductor manufacturing process. In this study, a single gradient layered buffer deposition process of YZO for low cost coated conductors has been tried using DC reactive sputtering technique. About several thick YZO gradient single buffer layers deposited by DC co-sputtering process were found to act as a diffusion layer.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.8
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• pp.18-24
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• 2021

Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.1
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• pp.81-86
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• 2010

This paper investigated into process characteristics of AlTiN coated layers for machining to the direction of upper and lower in plastic mold material (KP-4) with the cemented carbide ball endmill with the diameter of 8mm coated AlTiN layers (1~4) step by step using machining center. The material used in experiments was KP-4 that was machined by three types of inclined angles; $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ As estimated mechanical properties of AlTiN coated layers, it was shown the most result in the condition of three layered coating that the coating that the coating depth, the hardness of the coated layer and the surface roughness of the coated layer were $13{\mu}m$, Hv 3027.3 and $0.042{\mu}m$, respectively. The cutting component was better at the condition of upper direction than that of lower direction in all experimental conditions and indicated to be less which the bigger angle of the material was increased the effective diameter of the tool.