• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 춘계학술대회 논문집
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• pp.92-96
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• 1993

Modern NC machine tools require a more and more exact monitoring and control of cutting process. A very important parameter is tool wear used to optimize cutting data and to change tools at the right time. In this study, a real-time multi-tool fracture method is proposed for measuring crater from fringe patterns generated by uni-shadow-moire. An optical technique using laser for non-contact measurement of tool fracture is presented. The technology in which the tool is illuminated by a beam of He-Ne laser and then the image of tool fracture CCD camera.

• 한국생산제조학회지
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• 제8권2호
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• pp.100-107
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• 1999

End milling experiments are conducted to investigate characteristics of laser beam signals due to tool fracture. The laser beam signals are obtained with adapt focusing of tool. Tool states are identified wit h scanning electron microscopy and optical microscopy. It is demonstrated that the laser beam signals provide reliable informations about the cutting processes and tool states. Moreover, tool fracture can be detected successfully using coefficient of variation.

• 한국정밀공학회지
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• 제4권3호
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• pp.60-68
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• 1987

An optoelectronical method for in process monitoring of flank wear of cutting tools is presented. The method is based upon real-time vision technology in which the tool is illuminated by a beam of laser and then the image of wear zone is taken by a vidicon camera. The image is converted to a series of digital pixel data and processed through an algorithm specially developed for measurement of the wear land width. Detailed aspects of the prototype measurement system byilt for experiment are described, and test results are discussed. As conclusions, it is proved that the methods are effec- tive especially for-in situ application with a measuring accuracy of 0.01mm.

• 한국터널지하공간학회 논문집
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• 제15권5호
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• pp.469-481
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• 2013

워터젯 절삭기술을 이용한 자유면 생성에 있어서, 생성된 자유면 내부의 모니터링은 효율적인 작업 진행을 위해서 매우 중요하다. 본 연구에서는 레이저 센서를 이용하여 자유면 측정 실험을 수행하고 실질적 현장적용을 위한 변수의 영향 정도와 최적변수 범위를 제시하였다. 영향을 미치는 변수를 레이저의 분해각(angular resolution), 측정 이격거리(measurement distance), 그리고 자유면의 절삭형상(cutting shape)으로 나누어 실험 수행 및 결과 분석을 하였다. 그 결과 분해각과 측정 이격거리가 감소할수록 그리고 절삭 폭이 증가할수록 보다 정밀한 모니터링이 가능함을 확인할 수 있었다. 본 레이저 측정 시스템을 이용하면 자유면 형상과 깊이의 측정이 실제 현장에서 충분히 적용 가능할 것으로 판단된다.

• Journal of Advanced Marine Engineering and Technology
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• 제33권2호
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• pp.322-329
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• 2009

Machinability of LAM(Laser Assisted Machining) has been studied for ceramics such as $Al_2O_3$, $Si_3_N4$ and $ZrO_2$ by $CO_2$ laser. It was possible to remove ceramics by PCBN tool because material became softening and deterioration by local laser beam irradiation. The advantage of LAM is the ability to produce larger material removal rates and tool life. But, for cutting of $Al_2O_3$ and $ZrO_2$, stage of laser power control was needed owing to thermal shock with high temperature of workpiece by laser power. And when $Si_3N_4$ was machined by LAM, $N_2$ gas spouted from surface of one cause of high temperature. Characteristics of LAM were analyzed using pyrometer, dynamometer, SEM and EDS to measure temperature of workpiece surface, cutting force, variation of machining surface and structure of lattice respectively. As the result of this study, it was found that machinability of LAM for ceramics in $CO_2$ laser and mechanism of LAM was different according to the kind of ceramics because of properties of materials.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

• 한국공작기계학회논문집
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• 제16권4호
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• pp.101-107
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• 2007

The objective of this research work is to investigate into effects of an auto tracking of the focal distance on the quality of the cut part in the cutting of a low carbon sheet using a high-power CW Nd:YAG laser. An auto-tracking system with a capacitance based distance control loop has been employed to perform a real control of the focal distance. In order to examine the influence of the auto-tracking of a focal distance on the optimum focal distance, the kerfwidth, surface roughness and the formation of the cut section, several linear cutting tests have been carried out using the auto-tracking system. The results of experiments have been shown that the optimum focal distance is 0.9mm. In addition, it has been shown that the variation of kerfwidth and the surface roughness of the cut part with control of the focal distance are reduced 40-80% and 30-55% in comparison with those of the cut part without tracking of the focal distance. From the results of the experiments, it has been found that the real time tracking of the focal distance can improve the part quality.

• International Journal of Precision Engineering and Manufacturing-Green Technology
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• 제5권5호
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• pp.583-591
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• 2018

Tool-chip adhesion impacts on cutting performance significantly, especially in finish cutting process. To promote cutting tools' anti-adhesion property, the concave micro-grooves texture (MGT) and convex volcano-like texture (VLT) were fabricated separately on lathe tools' rake faces by laser surface texturing (LST). Various orientations of MGT and different area densities (9% and 48%) and regions (partial and full) of VLT were considered in textured patterns designing. The following orthogonal cutting experiments, machining of aluminum alloy 5038, analyzed tools' performances including cutting force, cutting stability, chip shape, rake face adhesion and abrasion. It indicated that under dry finish cutting conditions, MGT contributed to cutting stability and low cutting forces, meanwhile friction and normal force reduced by around 15% and 10%, respectively with a weak correlation to the grooves' orientation. High density VLT tools, on the other hand, presented an obvious anti-adhesion property. A $5{\mu}m$ reduction of crater wear's depth can be observed on textured rake faces after long length cutting and textured rake faces presented half size of BUE regions comparing to the flat tool, however, once the texture morphologies were filled or worn, the anti-adhesion effect could be invalid. The bearing ratio curve was employed to analysis tool-chip contact and durability of textured surfaces contributing to a better understanding of anti-adhesion and enhanced durability of the textured tools.

• 산업진흥연구
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• 제4권2호
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• pp.1-8
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• 2019

본 연구는 분전반 또는 배전반에 설치되는 부스바(busbar)의 절연 피복을 절단하는 커팅기에 관한 기술로써, 연구 결과, 첫째, 커팅기 상부와 하부에 각각 레이저기가 부착된 하우징을 포함하는 커팅유닛 및 프레임의 상부에 설치되고, 부스바의 피복 커팅거리를 조절하는 스토퍼로 구성된 것이 특징인 부스바 피복 레이저 커팅기이다. 둘째, 프레임은, 테이블의 후방 측 단부에 위치하도록 상부에 길이 방향으로 가이드 바가 놓여 설치되고 상부 중간 부분에서 전방과 후방에 각각 수직 상으로 포스트가 설치되며, 전방 포스트의 외측부에 위치하도록 테이블에 커팅 홀이 형성된 것이 특징이다. 셋째, 서포터는, 프레임에 배치된 가이드 바의 상부에 고정 설치되고, 실린더와 지지 판으로 구성된 것이 특징이다. 본 연구의 의미는 작업자의 안전사고를 방지하며, 커팅 작업의 효율성을 높이고, 부스바의 표면에 흠집이 발생하는 것을 방지하는 효과가 있다는데 연구의 의미를 찾을 수 있었다.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.1-12
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• 2009

Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.