• Journal of Welding and Joining
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• v.28 no.4
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• pp.61-66
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• 2010

Silicon nitride is widely used as an engineering ceramics because it has high strength, abrasion resistance and corrosion resistance even at high temperature. However, machining of silicon nitride is difficult due to its high hardness and brittleness. Laser assisted machining(LAM) allows effective cutting using CBN tool by locally heating the cutting part to the softening temperature of YSiAlON using the laser beam. The effect of preheating depending on process parameters were studied to find out the oxidation mechanism. If silicon nitride is sufficiently preheated, the surface is oxidized and $N_2$ gas is formed and escapes from the material, thereby making the cutting process more advantageous. During laser preheating process before machining, high temperature results in strong oxidation which makes the bloating, silicate layers and micro cracks. Using the results of these experiments, preheating characteristics and oxidation behavior were found out.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1475-1480
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• 2007

In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.517-518
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• 2006

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.1
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• pp.37-42
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• 2005

The localization of manufacturing technique development is actualizing for low cost with supplies of display devices. We need more high cutting technique because consumers want flat glasses of various sizes. Recently, most general two methods are normal wheel cutting and laser cutting, but both of them have some faults. First, the wheel cutting has cracks and sharp edges of sections. Second, it is easy for laser cutting to cut curved lines. however, it has thermal damage and low traverse speed. I suggest a new cutting method by high-wave frequency vibration wheel cutting(HFVC), which is good for quality improvement. Vertical cracks and crack depth is observed, after HFVC. When the average of the crack depth is $30{\mu}m$ and the average of the wallner liner depth is $200{\mu}m$, it has the most high quality of the sections in this experiment. As a result, when we consider between the normal wheel cutting method and the HFVC method, the latter has low cracks and good quality.

• Journal of Korean Tunnelling and Underground Space Association
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• v.15 no.5
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• pp.469-481
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• 2013

The monitoring of a free surface generated by waterjet cutting technology is very important for an efficient construction process. In this study, experiments using a laser sensor were performed to provide a data processing method and to determine optimized parameters. The experimental parameters here are the angular resolution, measurement distance, and free surface cutting shape. The results show that the monitoring resolution increases with a decrease in the angular resolution and the horizontal measurement distance and with an increase in the cutting (free surface) width. This laser monitoring method can be applied during the measurement of free surface shapes and depths in situ.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.1-6
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• 2002

This study is about optimization of Laser Repair Condition in EDS Line to improve AC and DC characteristic of high speed DRAM. The margin of AC parameter can be improved by forcing the proper DC generator levels and also improved by cutting the optional fuse about characteristics.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.5
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• pp.419-424
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• 2002

After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1994.10a
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• pp.156-160
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• 1994

Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2000.11a
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• pp.7-9
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• 2000

• Proceedings of the Korean Society of Laser Processing Conference
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• 1999.05a
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• pp.5-8
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• 1999