• Title/Summary/Keyword: Laser applications

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Pulsed laser surface modification for heat treatment and nano-texturing on biometal surface

  • Jeon, Hojeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.118.1-118.1
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    • 2016
  • The laser surface modification has been reported for its functional applications for improving tribological performance, wear resistance, hardness, and corrosion property. In most of these applications, continuous wave lasers and pulsed lasers were used for surface melting, cladding, alloying. Since flexibility in processing, refinement of microstructure and controlling the surface properties, technology utilizing lasers has been used in a number of fields. Especially, femtosecond laser has great benefits compared with other lasers because its pulsed width is much shorter than characteristic time of thermal diffusion, which leads to diminish heat affected zone. Moreover, laser surface engineering has been highlighted as an effective tool for micro/nano structuring of materials in the bio application field. In this study, we applied femtosecond and nanosecond pulsed laser to treat biometals, such as Mg, Mg alloy, and NiTi alloy, by heating to improve corrosion properties and functionalize their surface controlling cell response as implantable biomedical devices.

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Cu Electrode Fabrication by Acid-assisted Laser Processing of Cu Nanoparticles and Application with Transparent·Flexible Electrode (구리 나노 입자에 산-보조 레이저 공정을 적용한 구리 전극 제작 공정 개발 및 투명·유연 전극으로 활용)

  • Jo, Hyeon-Min;Gwon, Jin-Hyeong;Ha, In-Ho;Go, Seung-Hwan
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.121-121
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    • 2018
  • Copper is a promising electronic material due to low cost and high electrical conductivity. However, the oxidation problem in an ambient condition makes a crucial issue in practical applications. In here, we developed a simple and cost-effective Cu patterning method on a flexible PET film by combining a solution processable Cu nanoparticle patterning and a low temperature post-processing using acetic acid treatment, laser sintering process and acid-assisted laser sintering process. Acid-assisted laser sintering processed Cu electrode showed superior characteristics in electrical, mechanical and chemical stability over other post-processing methods. Finally, the Cu electrode was applied to the flexible electronics applications such as flexible and transparent heaters and touch screen panels.

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Laser Ablation : Fundamentals and applications in Micropatterning and Thin Film Formation

  • J. Heitz;D. Bauerle;E. Arenholz;N. Arnold;J.T. Dickinson
    • Journal of Photoscience
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    • v.6 no.3
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    • pp.103-108
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    • 1999
  • We present recent results on ablation mechanism, single-pulse laser micropatterning , pulsed-laser deposition(PLD) and particulates formation accompanying laser ablation, with special emplasis on polymers, in particular polymide, (PI), and polytetrafluoroethylene, (PTFE). Ablation of polymers is described on the basis of photothermal bond breaking within the bulk material. Here, we assume a first order chemical reaction, which can be described by an Arrhenius law. Ablation starts when the density of broken bonds at the surface reaches a certain critical value. Single-pulse laser ablation of polyimide shows a clear-length dependence of the threshold fluence. This experimental result strongly supports a thermal ablation model. We discuss the various possibilities and drawbacks of PLD and describe the morphology, physical properties and applications of PTFE films.

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Underwater Imaging with a blue-green laser (청록색 레이저를 이용한 수중영상 연구)

  • Lee, S.H.;Kim, G.B.;Lee, K.S.;Kim, D.W.
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.2180-2182
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    • 2000
  • Laser emission, a part of electromagnetic wave, has short propagation length in water, and the underwater applications of laser are limited. The acquisition of underwater imaging is possible only by using a blue-green laser since the blue-green range has relatively small absorption coefficient in water. We introduce the conditions of the laser required for underwater imaging and the attenuation characteristics of a blue-green laser used in water.

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A Study on Rapid Fabrication of Micro Lens Array using 355nm UV Laser Irradiation (355nm UV 레이저를 이용한 마이크로 렌즈 어레이 쾌속 제작에 관한 연구)

  • Je, S.K.;Park, S.H.;Choi, C.K.;Shin, B.S.
    • Transactions of Materials Processing
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    • v.18 no.4
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    • pp.310-316
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    • 2009
  • Micro lens array(MLA) is widely used in information technology(IT) industry fields for various applications such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method having the processes of micro etching, electroplating, micro machining and laser local heating. Laser thermal relaxation method is introduced in marking of microdots on the surface of densified glass. In this paper, we have proposed a new direct fabrication process using UV laser local thermal-expansion(UV-LLTE) and investigated the optimal processing conditions of MLA on the surface of negative photo-resist material. We have also studied the 3D shape of the micro lens obtained by UV laser irradiation and the optimal process conditions. And then, we made chrome mold by electroplating. After that, we made MLA using chrome mold by hot embossing processing. Finally, we have measured the opto-physical properties of micro lens and then have also tested the possibility of MLA applications.

Characteristics of single/poly crystalline silicon etching by$Ar^+$ ion laser for MEMS applications (MEMS 응용을 위한 $Ar^+$ 이온 레이저에 의한 단결정/다결정 실리콘 식각 특성)

  • Lee, Hyun-Ki;Han, Seung-Oh;Park, Jung-Ho;Lee, Cheon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.5
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    • pp.396-401
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    • 1999
  • In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.

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Dual Laser Beam Joining Process for Polymers in Automotive Applications to Reduce Weights (차량경량화를 위한 듀얼 레이저 에너지 플라스틱 접합의 응용)

  • Han, Sang Bae;Choi, Hae Woon
    • Journal of Welding and Joining
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    • v.31 no.4
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    • pp.23-27
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    • 2013
  • Laser heat source was used for automotive interior and exterior parts to reduce weights. Typically, 900's nm wavelength of laser has been widely used for polymer joining, however, the transmittance of the laser beam thorough clear polymers such as PMMA or PC has been an issue to overcome. To solve this issue, 1,940nm laser was applied on the clear polymer for the better absorption and 900nm laser beam was used for main laser for the joining. Conventional Gaussian or Elliptical heat source approximation has limitation in polymer which had deeper skin depth where major laser beam absorbs. To accurately simulate the physical laser beam absorption and joining optical properties were experimentally measured for the computer FEM simulation. The simulation results showed close correlation between theoretical and experimental results. The developed laser process is expected to increase productivity and gap closing which can cause failure of joining in laser material processing.

Development of an Industrial Nd:YAG Laser and its Applications (용접용 Nd:YAG 레이저의 개발과 응용)

  • 김광석
    • Proceedings of the Optical Society of Korea Conference
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    • 1989.02a
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    • pp.32-35
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    • 1989
  • A 150W industrial Nd:YAG laser was developed. The thermal lensing effect was examined and the radius and position of rear mirror were optimized for higher efficiency. The efficiency of 2.5% was achieved. Also, the performance of laser welding in fine thermocouples and between high-temperature-melting dissimilar metals were investigated.

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Wavelength-Tunable, Passively Mode-Locked Erbium-Doped Fiber Master-Oscillator Incorporating a Semiconductor Saturable Absorber Mirror

  • Vazquez-Zuniga, Luis A.;Jeong, Yoonchan
    • Journal of the Optical Society of Korea
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    • v.17 no.2
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    • pp.117-129
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    • 2013
  • We briefly review the recent progress in passively mode-locked fiber lasers (PMLFLs) based on semiconductor saturable absorber mirrors (SESAMs) and discuss the detailed characterization of a SESAM-based, passively mode-locked erbium-doped fiber (EDF) laser operating in the 1.5-${\mu}m$ spectral range for various configurations. A simple and compact design of the laser cavity enables the PMLFL to generate either femtosecond or wavelength-tunable picosecond pulses with high stability as the intra-cavity filtering method is altered. All the cavities investigated in our experiments present self-starting, continuous-wave mode-locking with no Q-switching instabilities. The excellent stability of the source eventually enables the wavelength-tunable PMLFL to be used as a master oscillator for a power-amplifier source based on a large-core EDF, generating picosecond pulses of >10-kW peak power and >100-nJ pulse energy.

Analysis of single/poly crystalline Si etching characteristics using $Ar^+$ ion laser ($Ar^+$ ion laser를 이용한 단결정/다결정 Si 식각 특성 분석)

  • Lee, Hyun-Ki;Park, Jung-Ho;Lee, Cheon
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.1001-1003
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    • 1998
  • In this paper, $Ar^+$ ion laser etching process of single/poly crystalline silicon with $CCl_{2}F_{2}$ gas is studied for MEMS applications. To investigate the effects of process parameters, laser power, gas pressure, scanning speed were varied and multiple scanning was carried out to obtain high aspect ratio. In addition, scanning width was varied to observe the trench profile etched in repeating scanning cycle. From the etching of $2.6{\mu}m$ thick polycrystalline Si deposited on insulator, trench with flat bottom and vertical side wall was obtained and it is possible to apply this results for MEMS applications.

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