• Title/Summary/Keyword: Laser Scribing

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R&D activities of a-Si:H thin film solar cells by LG Electronics

  • Lee, Don-Hui
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.04a
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    • pp.19-19
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    • 2007
  • Recently, we have developed p-i-n hydrogenated amorphous silicon (a-Si:H) single junction (SJ) thin film solar cells with RF (13,56MHz) plasma enhanced chemical vapor deposition (PECVD) systems, and also successfully fabricated the mini-modules (>300$cm^2$), using laser scribing technique to form an integrated series connection, The efficiency of a mini-module was 7.4% (Area=305$cm^2$, $I_{SC}$=0.25A, $V_{OC}$=14.74V, FF=62%).

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Analysis of a micro-processed sample surface using SCM and AFM (공초점현미경과 원자현미경을 이용한 초정밀 가공된 시료 표면의 영상측정)

  • Kim Jong-Bae;Bae Han-Sung;Kim Kyeong-Ho;Nam Gi-Jung;Kwon Nam-Ic
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.577-580
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    • 2005
  • Surface quality of a micro-processed sample with laser has been investigated by using of scanning confocal microscope(SCM) and atomic force microscope(AFM). Samples are bump electrodes and ITO glass of LCD module used in a mobile phone and a wafer surface scribed by UV laser. A image of $140\times120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a x-axis and y-axis are 1kHz and 1Hz, respectively. AFM is able to measure correctly hight and width of ITO and scribing depth and width of a wafer with a resolution less than 300 . However, the scan speed is slow and it is difficult to distinguish a surface composed of different nm kinds of materials. Results show that SCM is preferable to obtain a image of a sample composed of different kinds of material than AFM because the intensity of a reflected light from surface is different from each material.

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Analysis of a processed sample surface using SCM and AFM (공초점현미경과 원자현미경을 이용한 가공된 시료 표면의 형상측정)

  • Bae Han-Sung;Kim Kyeong-Ho;Moon Seong-Wook;Nam Gi-Jung;Kwon Nam-Ic;Kim Jong-Bae
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.4 s.181
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    • pp.52-59
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    • 2006
  • Surface qualities of a micro-processed sample with a pulse laser have been investigated by making use of scanning confocal microscope(SCM) and atomic force microscope(AFM). Samples are bump electrodes and ITO glass of LCD module used in a mobile phone and a wafer surface scribed by UV laser. A image of $140{\times}120{\mu}m^2$ is obtained within 1 second by SCM because scan speed of a x-axis and y-axis are 1kHz and 1Hz, respectively. AFM is able to correctly measure the hight and width of ITO, and scribing depth and width of a wafer with a resolution less than 300nm. However, the scan speed is slow and it is difficult to distinguish a surface composed of different kinds of materials. Results show that SCM is preferable to obtain a image of a sample composed of different kinds of material than AFM because the intensity of a reflected light from the surface is different for each material.

RF High Power Amplifier Module using AlN Substrate (AlN 기판을 이용한 RF 고전력 증폭기 모듈)

  • Kim, Seung-Yong;Nam, Choong-Mo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.10
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    • pp.826-831
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    • 2009
  • In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

Linear Electric Motors in Machining Processes

  • Gieras, Jacek F.
    • Journal of international Conference on Electrical Machines and Systems
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    • v.2 no.4
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    • pp.380-389
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    • 2013
  • Application of linear electric motors to automation of manufacturing processes, gantry robots, machining processes, machining centers, additive manufacturing and laser scribing has been discussed. The paper focuses on replacement of ball lead screw mechanisms with linear electric motors, linear motor driven positioning stages, linear motor driven gantries, machining centers, machining of large objects and industrial lasers. The best linear electric motors for application to machining processes are permanent magnet (PM) linear synchronous motors (LSMs), especially those without PMs in the reaction tail, e.g., high thrust density linear (HDL) LSMs and PM flux switching (FS) LSMs.

Design of a miniature electron beam irradiation apparatus for domain refining grain oriented electrical steel with electron beams (전자빔 조사에 의한 방향성 전기강판의 철손 감소를 위한 소형 전자빔 조사장치 설계)

  • 조경재
    • Proceedings of the KIPE Conference
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    • 2000.07a
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    • pp.18-21
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    • 2000
  • A nonconstact technique for reducing the core loss of a grain oriented silicon steel has been developed by the use of mechanical scribing Q-switched laser plasma jet or electron beam irradiation. Among these methods electron beam irradiation has advantages of domain refining without any deformation or damage of insulating film on the surface of a grain criented Si-Fe. Over the past years this processing was performed in vaccum of 10-4 Torr or below causing the problem of high cost and difficulty of continuous works. In this paper a miniature electron permeable window through which electron beam energy 4-80keV and average current 0.1-2mA. were obtained for electron beam irradiating on air was designed and manufactured.

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Simulation of Shingled String Characteristics Depending on Cell Strips Type for High Power Photovoltaic Modules (고출력 태양광 모듈을 위한 분할 셀 종류에 따른 슁글드 스트링 특성 시뮬레이션)

  • Park, Ji Su;Oh, Won Je;Lee, Jae Hyeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.1
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    • pp.10-15
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    • 2020
  • Recently, with the increase in the use of urban solar power, solar modules are required to produce high power in limited areas. In this report, we proposed the fabrication of a high-power photovoltaic module using shingles technology, and developed accurate string characteristic simulations based on circuit modeling. By comparing the resistance components between the interconnected cells and the cell strips, the ECA resistance was determined to be 0.003 Ω. Based on the equivalent circuit of the modeled shingled string, string simulation was performed according to the type of cell strip. As a result, it was determined that the cell efficiency of the 4-cell strip was the highest at 19.66%, but the efficiency of the string simulated with the 6-cell strip was the highest at 20.48% in the string unit.

Progress in R&D of coated conductor in M-PACC project

  • Izumi, T.;Ibi, A.;Nakaoka, K.;Taneda, T.;Yoshida, T.;Takagi, Y.;Nakamura, T.;Machi, T.;Katayama, K.;Sakai, N.;Yoshizumi, M.;Koizumi, T.;Kimura, K.;Kato, T.;Kiss, T.;Shiohara, Y.
    • Progress in Superconductivity and Cryogenics
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    • v.16 no.2
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    • pp.1-6
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    • 2014
  • The five-year national project in Japan for R&D of coated conductors and applications, named as the Materials and Power Applications of Coated Conductors (M-PACC) project, was finished at the end of FY2013. The project consists of four sub-themes as cable, transformer, SMES and coated conductors. In the theme of coated conductors, the fabrication process had been developed to satisfy the requirements from the applications such as in-field $I_c$ performance, low AC loss in the long tapes etc. Through the project, the remarkable progress was achieved as follows; a high in-field minimum $I_c$ value over 54A/cm-width under 3T at 77K was realized in a 200m long EuBCO tape with artificial pinning centers of $BaHfO_3$ by the pulsed laser deposition (PLD) technique on the IBAD template. On the other hand, the AC loss reduction was confirmed in the tapes fabricated by both PLD and the metal organic deposition (MOD) techniques by scribing 100m tapes into 10-filamments. Additionally, the mechanism of the delamination phenomenon was systematically investigated and the strength was improved by eliminating the origins of the weak points in the films. Through the development, all targeted goals were accomplished and the several results were appreciated as a world champion data.

Study on Shingled String Interconnection for High Power Solar Module (고출력 슁글드 태양광 모듈 제작을 위한 스트링 연결에 관한 연구)

  • Kim, Juhwi;Kim, Junghoon;Jeong, Chaehwan;Choi, Wonyoung;Lee, Jaehyeong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.34 no.6
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    • pp.449-453
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    • 2021
  • Interest and investment in renewable energy have increased worldwide, highlighting the need for renewable energy. Solar energy was the most promising energy of all renewable energy sources, and it has the highest investment value. Because photovoltaics require a certain amount of area for installation, high density and high output performance are required. Shingled module is a promising technology in that they are featured by higher density and higher output compared to the conventional modules. Shingled technology uses a laser scribing to divide solar cells that are to be bonded with electrically conductive adhesive (ECA) to produce and connect strings, which has a higher output in the same area than the conventional modules. In the process of producing solar modules, metal ribbons are used to interconnect cells, but they are also needed for string connections in shingled solar cells. Accordingly, in this study, we researched the interconnection that best suits the connector that joins the string to the string. The module outputs produced under the conditions of the string interconnection were compared and analyzed.