• Proceedings of the KSME Conference
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• 2003.04a
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• pp.774-779
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• 2003

Arc-shaped line array slits have been used for the laser generation of focused Lamb waves. The spatially expanded Nd:YAG pulse laser was illuminated through the arc-shaped line array slit on the surface of a sample plate to generate the Lamb waves of the same pattern as the slit. Then the generated Lamb waves were focused at the point of which distance from the slit position is dependent on the curvature of slit arc. The proposed method showed better spatial resolution than the conventional linear array slit in the detection of laser machined linear defect and drill machined circular defect on aluminum plates of 1mm thickness.

• Proceedings of the Optical Society of Korea Conference
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• 1997.08a
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• pp.85-85
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• 1997

Czochralski 방법에 의해 육성된 Nd:YAG 단결정으로부터 CW mode의 1064nm laser를 발진시켰다. 육성된 단결정은 직경 50mm, 길이 120mm 이었으며, Nd 이온 농도는 O.2~0.9at% 이었다. 육성된 단결정 boule로 부터 결정학적 결함부위인 core 및 facet가 없는 양질의 단결정 부위를 Twyman-Green interferometer로 선빌하였다. 추출핀 부위는 절단, 가공, 연마공정 및 코팅 공정을 통해 직경 6.35mm, 길이 lOOmm의 laser rod를 제작하였다. 절단은 core drill, 또는 원통 연삭기를 사용하여 rod 형태로 가공하였으며, 상$\cdot$하면 polishing은 평행도 10", 직각도 5', 평활도 $\lambda$/10 수준까지 실험실에서 자체 가공하여 일반적인 laser 발진용 rod의 spec.을 만족시킬 수 있었다.

• Journal of the Korean Society for Nondestructive Testing
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• v.22 no.6
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• pp.637-642
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• 2002

An arc-shaped line array slit has been used for the laser generation of focused Lamb waves. The spatially expanded Nd:YAG pulse laser was illuminated through the arc-shaped line array slit on the surface of a sample plate to generate the Lamb waves of the same pattern as the slit. Then the generated Lamb waves were focused at the focal point of which distance from the slit position is dependent on the curvature of slit arc. The proposed method showed better spatial resolution than the conventional linear array slit in the detection of laser machined linear defect and drill machined circular defect on aluminum plates of 2mm thickness. Using the focused waves, we could detect the linear defect and the circular defect with the improvement of spatial resolution. The method can also be combined with the scanning mechanism to get an image just like by the scanning acoustic microscope(SAM).

• Journal of the Korean Society for Precision Engineering
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• v.27 no.10
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• pp.40-44
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• 2010

Laser drilling is an enabling technology for Through Silicon Via (TSV) interconnect applications. Recent advances in picoseconds laser drilling of blind, micron sized vias in silicon is presented here highlighting some of the attractive features of this approach such as excellent sidewall quality. In this study, we dealt with comparison of heat affection around drilled hole between a picosecond laser and a nanosecond laser process under the UV wavelength. Points which special attention should be paid are that picosecond laser process lowered experimentally recast layer, surface debris and micro-crack around hole in comparison with nanosecond laser process. These finding suggests that laser TSV process has possibility to drill under $10{\mu}m$ via. Finally, the laser drilling platform was constructed successfully.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.6
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• pp.638-643
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• 2013

Laser beam machining (LBM) is fast, contactless and able to machine various materials. So it is used to cut metal, drill holes, weld or pattern the imprinted surface. However, after LBM, there still leave burrs and recast layers around the machined area. In order to remove these unwanted parts, LBM process often uses electrochemical etching (ECE). But, the total thickness of workpiece is reduced because the etching process removes not only burrs and recast layers, but also the entire surface. In this paper, surface coating was performed using enamel after LBM on metal. The recast layer can be selectively removed without decreasing total thickness. Comparing with LBM process only, the surface quality of enamel coating process was better than that. And edge shape was also maintained after ECE.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.32-38
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• 2010

Hybrid material(ceramic+metal) processes were developed for micro filter using ceramics coating at metal filter surface by thermal spray method, micro hole drilling at ceramic coated filter surface by femtosecond laser, and fiber laser direct welding of ceramic and metal (SUS304, SM45C) by capillary effect. Thermal spray process was used for ceramic powders and metal filters. The used ceramic powders were $Al_2O_3+40TiO_2$(Metco 131VF) powder of maximum particle size $5{\mu}m$ and ${Al_2O_3}99+$(Metco 54NS) power of maximum particle size 45m. Ceramic coated filters using thermal spray method had a great influence on powder material, particle size and coating thickness but had a fine performance as a micro filter. CW fiber laser was used to drill the top ceramic layer and melt the bottom metal layer for joining applications.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.13-19
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• 2010

Due to the rapid spread of mobile handheld devices, industrial demands for micro-scale holes with a diameter of even smaller than $10{\mu}m$ in sapphire/silicon wafers have been increasing. Holes in sapphire wafers are for heat dissipation from LEDs; and those in silicon wafers for interlayer communication in three-dimensional integrated circuit (IC). We have developed a sapphire wafer driller equipped with a 532nm laser in which a cooling chuck is employed to minimize local heat accumulation in wafer. Through the optimization of process parameters (pulse energy, repetition rate, number of pulses), quality holes with a diameter of $30{\mu}m$ and a depth of $100{\mu}m$ can be drilled at a rate of 30holes/sec. We also have developed a silicon wafer driller equipped with a 355nm laser. It is able to drill quality through-holes of $15{\mu}m$ in diameter and $150{\mu}m$ in depth at a rate of 100holes/sec.

• Journal of Korean Dental Science
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• v.10 no.2
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• pp.66-73
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• 2017

Purpose: To evaluate the effect of different-sized drill tips and laser irradiation times on the initial stability of orthodontic miniscrews placed in Er,Cr:YSGG-laser pre-drilled holes in an animal model. Materials and Methods: Laser pre-drilled holes were made in dog mandibular bone with an Er,Cr:YSGG laser using irradiation times of 5, 7, 9, 11, and 13 seconds, and tip diameters of 0.4 and 0.6 mm. The maximum diameter and depth of the pre-drilled holes was measured with micro computed tomography. The maximum insertion torque was measured during placement the miniscrew. Result: Laser pre-drilled holes were conical shaped. The maximum diameter of pre-drilled holes increased with longer laser irradiation times (P>0.05) and larger tip diameters (P<0.05). The depth of pre-drilled holes increased with longer laser irradiation times and larger tip diameters (P<0.05). When the 0.4 mm tip, but not the 0.6 mm tip, was used, the insertion torque decreased significantly with longer laser irradiation times (P<0.05). Conclusion: Tip diameter impacted insertion torque more than irradiation time. It takes at least 9 seconds using a 0.6 mm tip to create a 0.8 mm diameter and 1.0 mm depth hole in thick cortical bone.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.357-358
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• 2008

• The Journal of Advanced Prosthodontics
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• v.5 no.4
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• pp.457-463
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• 2013

PURPOSE. The purpose of this study was to compare the effect of a diode laser and traditional irrigants on the bond strength of self-adhesive cement. MATERIALS AND METHODS. Fifty-five incisors extracted due to periodontal problems were used. All teeth were instrumented using a set of rotary root canal instruments. The post spaces were enlarged for a No.14 (diameter, 1.4 mm) Snowlight (Abrasive technology, OH, USA) glass fiber reinforced composite post with matching drill. The teeth were randomly divided into 5 experimental groups of 11 teeth each. The post spaces were treated with the followings: Group 1: 5 mL 0.9% physiological saline; Group 2: 5 mL 5.25% sodium hypochlorite; Group 3: 5 mL 17% ethylene diamine tetra acetic acid (EDTA), Group 4: 37% orthophosphoric acid and Group 5: Photodynamic diode laser irradiation for 1 minute after application of light-active dye solution. Snowlight posts were luted with self-adhesive resin cement. Each root was sectioned perpendicular to its long axis to create 1 mm thick specimens. The push-out bond strength test method was used to measure bond strength. One tooth from each group was processed for scanning electron microscopic analysis. RESULTS. Bond strength values were as follow: Group 1 = 4.15 MPa; Group 2 = 3.00 MPa; Group 3 = 4.45 MPa; Group 4 = 6.96 MPa; and Group 5 = 8.93 MPa. These values were analysed using one-way ANOVA and Tukey honestly significant difference test (P<.05). Significantly higher bond strength values were obtained with the diode laser and orthophosphoric acid (P<.05). There were no differences found between the other groups (P> .05). CONCLUSION. Orthophosphoric acid and EDTA were more effective methods for removing the smear layer than the diode laser. However, the diode laser and orthophosphoric acid were more effective at the cement dentin interface than the EDTA, Therefore, modifying the smear layer may be more effective when a self-adhesive system is used.