• 제목/요약/키워드: Laser Cutting machine

검색결과 70건 처리시간 0.022초

Al 6061의 초정밀 절삭특성 (Ultra Precision cutting Characteristics for Al 6061)

  • 박상진
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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    • pp.591-596
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    • 2000
  • The needs of ultra precision machined parts is increase every days. But the experimental data of nonferrous metal is insufficient. The cutting behavior in micro cutting area is different from that of traditional cutting because of the size effect. Al6061 is widely used as optical parts such as LASER reflector's mirror or multimedia instrument. Al6061 opper is machined by ultra precision machine with natural diamond tool. From the experiment and discussion on the cutting force and worked surface roughness as the variable spindle speed, feed rate and depth of cut. As a result, the cutting force increases as the increasing depth of cut, but the worked surface roughness does not increase so much. The surface roughness is good when spindle sped is above 1200rpm, and feed rate is small. The influence of depth of cut is very small.

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서까래 가공기 개발 및 시뮬레이션 검증 (Development of Rafter Processing Machine and Simulation Verification)

  • 홍성민;;이건수;박강
    • 한국CDE학회논문집
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    • 제18권2호
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    • pp.148-154
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    • 2013
  • Han-ok (the Korean traditional house) is famous for its beauty and healthful aspects. However, its construction cost is too high because of the manual process of parts such as rafter, timber, etc. These days, many people want to build a modernized Korean traditional house at a low cost. In order to do so, the rafter machining process is required to be automatized using a CNC machine. It is also observed that, generally the timber does not have a uniform shape. Therefore, it is also needed to examine the timber shape before starting its processing. This paper presents the concept design of the rafter processing CNC machine, and a 3D laser scanning system. The laser scanner is developed to acquire 3D details of the timber shape. Furthermore, the results of simulated experiments are presented to investigate surface roughness during the machining process of the timber. Since cutting parameters largely influence on surface roughness and cusps formation, it is needed to achieve optimal machining parameters. Several experiments were carried out changing cutting parameters such as cutting tool diameter, feed-rate, and spindle speed.

저탄소 강판의 레이저 절단에서 자동 초점거리 추적이 절단 품질에 미치는 영향 (Effects of an Auto-tracking of the Focal Distance on the Quality of the Cut Part in the Laser Cutting of a Low Carbon Sheet)

  • 안동규;변경원;유영태
    • 한국공작기계학회논문집
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    • 제16권4호
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    • pp.101-107
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    • 2007
  • The objective of this research work is to investigate into effects of an auto tracking of the focal distance on the quality of the cut part in the cutting of a low carbon sheet using a high-power CW Nd:YAG laser. An auto-tracking system with a capacitance based distance control loop has been employed to perform a real control of the focal distance. In order to examine the influence of the auto-tracking of a focal distance on the optimum focal distance, the kerfwidth, surface roughness and the formation of the cut section, several linear cutting tests have been carried out using the auto-tracking system. The results of experiments have been shown that the optimum focal distance is 0.9mm. In addition, it has been shown that the variation of kerfwidth and the surface roughness of the cut part with control of the focal distance are reduced 40-80% and 30-55% in comparison with those of the cut part without tracking of the focal distance. From the results of the experiments, it has been found that the real time tracking of the focal distance can improve the part quality.

질화규소의 Laser-Assisted Machining 공정에 관한 연구 (A Study on Laser-Assisted Machining Process of Silicon Nitride)

  • 임세환;이제훈;신동식;김종도;김주현
    • 한국정밀공학회지
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    • 제26권5호
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    • pp.48-56
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    • 2009
  • In this paper, laser-assisted machining(LAM) has been employed to machine hot isostatically pressed (HIPed) Si3N4 work pieces. Due to little residual flaws and porosity, HIPed $Si_3N_4$ work pieces are more difficult to machine compared to normally sintered $Si_3N_4$ workpieces. In LAM, the intense energy of laser was used to enhance machinability by locally heating the workpiece and thus reducing yield strength. In experiments, the laser power ranges from 200W to 800W and the diameter of work pieces is 16mm. While machining, the surface temperature was kept nearly constant by laser heating except for a short period of rise time of max. 58 seconds. Results showed as feed rate increases the surface temperature of $Si_3N_4$ workpieces decreases slightly, whereas the effect of depth of cut is disregardable. With a laser power of 800W, achievable maximal depth of cut as 0.7mm and feed rate was 0.03mm/rev.

Nd : YAG레이저의 가공 파라메터가 절단 성능에 미치는 영향에 관한 연구 (The Effects on Cutting Performance by Machining Parameters of Nd : YAG Laser)

  • 한응교;박두원;이범성;이명호;임흥순
    • 대한기계학회논문집
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    • 제16권1호
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    • pp.1-12
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    • 1992
  • 본 연구에서는 가공기 자체의 파라메터와 성능에 관한 연구로서 출력 에너지 가 서로 다른 가공기를 사용하여 SUS 304 스테인리스 시험편을 관통, 절단하면서 출력 에너지와 최대 출력을 비교하여 보고, 시험편 관통시 주파수와 출력 에너지와의 관계, 시험편 관통시 응융 금속 제거량에 의한 절단 속도의 예측, 서로 다른 출력의 가공에 있어서 슬릿 절단 폭, 커프 폭, 드로스 길이, 절단면의 표면 거칠기 등을 비교하여 출 력차에 따른 가공 특성을 고찰하였다.

High Lead Ball Screw를 사용한 고속이송계의 특성 (The Characteristics of High Speed Feed Drive System using High Lean Screw)

  • 고해주;박성호;정윤교
    • 한국공작기계학회논문집
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    • 제10권4호
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    • pp.97-103
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    • 2001
  • The study on the high-speed machine tool is very important for the improvement of productivity since it can shortens cutting and non-cutting time. Especially, high speed of feed drive system is the major research field. In the industries of the advanced countries, the feed drive systems at the speed of 60 m/min have been already developed based on the high lead ball screws. In this study, a high speed feed drive system at the speed of 60 m/ min has been developed, and its movements characteris-tics are investigated. As the movement characteristics, positioning accuracy, angular accuracy, straightness and micro step-response are measured. Thermal characteristics of the system is also discussed. For measuring the movement characteris-tics, a laser interferometer, a memory-based Hi-coder and a cooling device are used. The experimental results confirm that the movement characteristics and the thermal behavior of the system are satisfactory in the aspect of accuracy and stability.

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질화규소 세라믹의 레이저 예열선삭에 관한 연구 (IV) - 질화규소 세라믹의 레이저예열선삭 메커니즘 및 적용 - (A Study on Laser Assisted Machining for Silicon Nitride Ceramics (IV) - Mechanism and Application of LAM for Silicon Nitride Ceramics -)

  • 김종도;이수진;박서정;이제훈
    • Journal of Welding and Joining
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    • 제28권6호
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    • pp.40-44
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    • 2010
  • Laser assisted machining (LAM) has been researched in order to machine the silicon nitride ceramics economically and effectively. LAM is an effective machining method by local heating of the cutting part to the softening temperature of the silicon nitride using laser beam. When silicon nitride ceramics is heated using a laser beam, the surface of silicon nitride ceramic is softened, oxidized and decomposed. And then surface hardness is decreased. Through machining in low viscosity and hardness conditions, silicon nitride was machined effectively and the life span of tool was increased. The plastic deformation was occurred due to softening of amorphous YSiAlON above $ 1,000^{\circ}C$. Transgranular fracture of ${\beta}-Si_3N_4$ was occurred when YSiAlON was not softened, but mostly intergranular fracture was occurred by the plastic deformation of softened YSiAlON.

레이저 융합된 Co-Cr 합금의 물리적 성질에 관한 연구 (MECHANICAL PROPERTIES OF LASER WELDED Co-Cr ALLOY)

  • 배기창;우이형;이성복
    • 대한치과보철학회지
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    • 제41권4호
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    • pp.440-450
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    • 2003
  • Statement of problem : The joints of removable partial denture alloys have failed frequently after routine usage. Purpose : The purpose of this study was to evaluate the mechanical properties of the laser welded Co-Cr alloys. Material and method : For this study 20 Co-Cr specimens were casted and 10 of them were seperated on the middle area and laser welded with Alpha laser welding machine(Siro Lasertec, Pforzheim, Germany). Rest of them which were as cast, were used as a control group. For the section of the experimental specimens, wire cutting machine was used to make a even gap of the all specimens. Laser welding was done with manufacturer's instrunction and tested each specimen by Instron Machine. Tensile strength, 0.2% yield strength and % elongations were recorded. Fractured surfaces were investigated with SEM. Results : The results were as follows : 1. The tensile strength of the laser welded group(617.7MPa) was about 75% of the as cast group(820.4MPa). It had stastically significant differences(p<0.05). 2. The % elongation of the experimental group was 6.6 which was lower than the control group(14.3). 3. Fracture of the experimental group occured in the welded surface and showed many voids. In contrast, the fracture surface of the control group was showed rough surfaces without any voids. Conclusion : The tensile strengths of the as-cast joints were higher than those for the laser welded joints, and the % elongation of the experimental group was lower than the control group. Porosity was found in laser-welded joints.

습식워터젯을 채용한 초정밀 절삭 가공시스템의 특허동향조사에 관한 연구 (Research for Patent Application Tendency in the Super Fine Machining System Using the Wet Waterjet)

  • 김성민;고준빈;박희상
    • 한국공작기계학회논문집
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    • 제18권1호
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    • pp.1-12
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    • 2009
  • Presently, the semiconductor industry has the chronic problem. In the semiconductor industry, it has the semiconductor wafer, a package, the optical filter cut by using the saw blade, the mold, a laser etc. The cutting technique has the difficulty due to the rising of the production cost by the wearing of mold, the poor quality problem due to generated heat at the moment of cutting procedure and curve cutting etc. The goal of this time of national research and development project is develop the apparatus for solving the problem that the existing cutting technique has. The technology is so called waterjet abrasive method. This technology will be mainly applied to cut a semiconductor package and a wafer. Two important things to be considered are ripple effect(in other words, the scale of a market) and simplicity of an application.