• Journal of the Korea Society of Computer and Information
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• v.12 no.2 s.46
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• pp.209-220
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• 2007

Mobile devices become a pak of our daily life due to their versatility, such as the wireless phone calls, the wireless accessibility to Internet, the display of multimedia content, and the communication with nearby mobile devices. Third generation telecommunication service provides an easy access to the Internet for nubile devices. Mobile users pay a fee charged by the telecommunication provider based on the amount of data transferred. This paper introduces a special ad hoc network in which mobile devices cooperate each other to download an interesting content from the Internet in order to reduce the telecommunication cost. The mobile devices, called the peers, in the ad hoc network are assigned a portion of the target file, and are responsible for downloading the portion using their 3G connection. Then, the peers exchange their downloaded portion with other participating peers using their cost-free ad hoc connection in order to reconstruct the whole content. According to the simulation results, large number of participating peers saves the telecommunication cost up to 90% with as few as 10 peers, although it slightly increase the overall content reconstruction time.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.2
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• pp.122-129
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• 2004

There is an increasing need for large flat panel display devices. PDP (Plasma Display Panel) is one of the most promising candidates for this need. Thermal shock failure of PDP glass during manufacturing process is a critical issue in PDP industry since it is closely related to the product yield and the production speed. In this study, thermal shock resistance of PDP glass is measured by water quenching test and an analysis scheme is described for estimating transient temperature and stress distributions during thermal shock. Based on the experimental data and the analysis results, a simple procedure for predicting the thermal shock failure of PDP glass is proposed. The fast cooling process for heated glass plates can accelerate the speed of PDP production, but often leads to thermal shock failure of the glass plates. Therefore, a design guideline for preventing the failure is presented from a viewpoint of high speed PDP manufacturing process. This design guideline can be used for PDP process design and thermal -shock failure prevention.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.213-216
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• 2008

The voltages for pixel electrodes on LCD panels are supplied with analog voltages from LCD Driver ICs (LDIs). The latest LDI developed for large LCD TV's has suffered from the degradation of analog output characteristics (target voltage: AVO and output voltage deviation: dVO). By the failure analysis, humps in $I_D-V_G$ curves have been observed in high voltage (HV) NMOS devices for input transistors in amplifiers. The hump is investigated to be the main cause of the deviation for the driving current in HV NMOS transistors. It also makes the matching between two input transistors worse and consequently aggravates the analog output characteristics. By simply modifying the active layout of HV NMOS transistors, this hump was removed and the analog characteristics (AVO &dVO) were improved significantly. In the help of the improved analog characteristics, it also became possible to reduce the size of the input transistors less than a half of conventional transistors and significantly improve the integration density of LDIs.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Journal of the Semiconductor & Display Technology
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• v.19 no.3
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• pp.118-123
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• 2020

In this paper, the design method of asynchronous nonvolatile memory module that can efficiently process and store large amounts of data without loss when the power turned off is proposed and implemented. PSRAM, which takes advantage of DRAM and SRAM, was used for data processing, and NAND flash memory was used for data storage and backup. The problem of a lot of signal interference due to the characteristics of memory devices was solved through PCB design using high-density integration technology. In addition, a boost circuit using the super capacitor of 0.47F was designed to supply sufficient power to the system during the time to back up data when the power is off. As a result, an asynchronous nonvolatile memory module was designed and implemented that guarantees reliability and stability and can semi-permanently store data for about 10 years. The proposed method solved the problem of frequent data loss in industrial sites and presented the possibility of commercialization by providing convenience to users and managers.

• Journal of the Semiconductor & Display Technology
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• v.18 no.2
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• pp.58-62
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• 2019

Diffractive Optical Elements(DOEs) diffracts incident light using the diffraction phenomenon of light to generate a desired diffraction image. In recent years, the use of diffraction optics, which can replace existing refractive optical elements with flat plates, has been increased by implementing various optical functions that could not be implemented in refractive optical devices and by becoming miniaturized and compacted optical elements. Direct laser lithography is typically used to effectively fabrication such a diffractive optical element in a large area with a low process cost. In this study, the process conditions for fabricating patterns of diffractive optical elements in various shapes were found using direct laser lithographic system, and optical performance evaluation was performed through fabrication.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.22-26
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• 2021

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al₂O₃ and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al₂O₃/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP₂ precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.142-147
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• 2022

After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

• Korean Journal of Optics and Photonics
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• v.28 no.6
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• pp.314-326
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• 2017

The display, which is closely related to modern life, is being developed as a window on a network connecting individuals, devices, and even other individuals from simple display devices, as the IT industry develops. To achieve a thinner, brighter unit with less consumption for backlighting, the LED light source has applied, and the study of complex light-guiding plates to improve luminance, uniformity, and viewing angle has been initiated. In this paper, we summarize the research results for the scatterers' pattern formation of the light-guiding plate and the arrangement and composition of the light source, which have enabled remarkable development of the LED backlight unit over the last 10 years. In addition, a large-area flat-screen illumination system, applying the light-guiding-plate technology to a currently noteworthy LED light-fixture design, is outlined. Finally, we discuss the direction and way to develop the current technology more progressively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.270-270
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• 2010

OLED device is one of the most attractive and alternative display components, which stems primarily from the self-emission, large intrinsic viewing angle, and fast switching speed. However, because of its relatively short history of development, much remains to be studied in terms of its basic device physics, manufacturing processes, and reliability etc. Especially among several issues, it should be noted that the device characteristics are very sensitive to the surface properties of transparent conducting oxide (TCO) electrode materials. In this study, we have investigated the performance of OLED devices as a function of sheet resistance and surface roughness of TCO thin films. For this purpose, ITO and IZO thin films were deposited by r. f. magnetron sputtering under various ambient gases (Ar, Ar+O2 and Ar+H2, respectively). The crystal structure and surface morphology were examined by using XRD and FESEM. Also, electrical and optical properties were Investigated.