• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.1264_1265
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• 2009

Cadmium Telluride (CdTe)를 이용한 박막형 태양전지 제작과 실용화에 있어 가장 큰 이슈는 대면적화에 따른 에너지 변환효율의 저하를 줄임으로써 고효율의 대면적 태양전지를 대량으로 생산하는 것이다. 따라서 본 연구에서는 태양전지 박막의 대면적 증착시 문제점 중에 하나인 불균일한 CdTe 박막의 증착을 방지하기 위한 선행연구를 진행하였다. 실험 방법으로는 Sputtering 법을 적용하여 박막 증착시 출력과 진공도에 따른 박막 두께의 표준편차와 RMS 표면 거칠기($R_{rms}$), 최고-최저점간 표면 거칠기($R_{p-v}$) 등의 거동을 고찰하였다. 이를 통해 Sputtering 공정 변수 중에 박막 두께의 표준 편차에 더 큰 영향을 미치는 변수를 조사하고, 후행 연구로 진행될 Sputtering 법을 이용하여 대면적에 균일하게 증착하는 방법에 적용하고자 한다.

• 한국전기전자재료학회논문지
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• 제24권11호
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• pp.905-910
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• 2011

To study encapsulation method for large-area organic light emitting diodes (OLEDs), red emitting OLEDs were fabricated, on which LiF and Al were deposited as inorganic protective films. And then the OLED was attached to flat glass by printing method using epoxy. In case of direct coating of epoxy onto OLED by printing method, luminance and current efficiency were remarkably decreased because of the damage to the OLED by epoxy. In case of depositing LiF and Al as inorganic protective films and then coating of epoxy onto OLED, luminance and current efficiency were not changed. OLED lifetime was more increased through inorganic protective films between OLED and flat glass than that without any encapsulation (8.8 h), i.e., 47 (LiF/Al/epoxy/glass), 62 (LiF/Al/LiF/epoxy/glass), and 84 h (LiF/Al/Al/epoxy/glass). The characteristics of OLED encapsulated with inorganic protective films (attached to flat glass) showed the possibility of application of protective films.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1364-1366
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• 1998

An active-matrix LCD using thin film transistors (TFT) has been widely recognized as having potential for high-quality color flat-panel displays. Pixel-Design Array Simulation Tool (PDAST) was used to profoundly understand the gate signal distortion and pixel charging capability, which are the most critical limiting factors for high-quality TFT-LCDs. Since PDAST can simulate the gate, data and pixel voltages of a certain pixel on TFT array at any time and at any location on an array, the effect of the resistivity of gate line material on the pixel operations can be effectively analyzed. The gate signal delay. pixel charging ratio, level-shift of the pixel voltage were simulated with varying the parameters. The information obtained from this study could be utilized to design the larger area and finer image quality panel.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1491-1498
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• 2003

Droplet evaporation can be used to transfer large amounts of energy since heat is transferred across a thin liquid film. Spreading the drop over a larger area can enhance this heat transfer. One method of accomplishing this is to dissolve gas into the liquid. When the drop strikes the surface, a gas bubble nucleates and can grow and merge within the liquid, resulting in an increase in the droplet diameter. In this study, time and space resolved heat transfer characteristics for a single droplet striking a heated surface were experimentally investigated. The local wall heat flux and temperature measurements were provided by a novel experimental technique in which 96 individually controlled heaters were used to map the heat transfer coefficient contour on the surface. A high-speed digital video camera was used to simultaneously record images of the drop from below. The measurements to date indicate that significantly smaller droplet evaporation times can be achieved. The splat diameter was observed to increase with time just after the initial transient dies out due to the growth of the bubble, in contrast to a monotonically decreasing splat diameter for the case of no bubbles. Bursting of the bubble corresponded to a sudden decrease in droplet heat transfer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• 한국태양에너지학회 논문집
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• 제31권1호
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• pp.93-99
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• 2011

To guarantee more exact maximum power of solar cell module, it is absolutely required to have performance characteristics of various solar cells. Today, there are many types of solar simulator for large area measurement. But it is very opaque how to select the best one for various solar cell module like crystalline silicon solar cell, high efficiency solar cell, amorphous silicon thin film solar cell, CdTe and CIGS solar cell module. So, in this paper 4 types of photovoltaic module were selected to compare the electrical characteristics by changing light pulse duration time and voltage scan direction. Light pulse duration time was varied from 10msec to 800msec. And two types of voltage scan directions, Voc->Isc and Isc->Voc were selected. From this results, optimum measuring condition was suggested and electrical variation was analysed for each types of solar cell module. The detail description is specified as the following paper.

• ETRI Journal
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• 제31권6호
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• pp.647-652
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• 2009

Solution-processable organic semiconductors have been investigated not only for flexible and large-area electronics but also in the field of biotechnology. In this paper, we report the design and fabrication of biosensors based on completely organic thin-film transistors (OTFTs). The active material of the OTFTs is poly(9,9-dioctylfluorene-co-bithiophene) (F8T2) polymer functionalized with biotin hydrazide. The relationship between the chemoresistive change and the binding of avidin-biotin moieties in the polymer is observed in the output and on/off characteristics of the OTFTs. The exposure of the OTFTs to avidin causes a lowering of ID at $V_D$ = -40 V and $V_G$ = -40 V of nearly five orders of magnitude.

• Journal of Information Display
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• 제2권4호
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• pp.1-7
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• 2001

This paper investigates the characteristics of a newly developed high density hollow cathode plasma(HCP) system and its application for the etching of silicon wafers. We used $SF_6$ and $O_2$ gases in the HCP dry etch process. This paper demonstrates very high plasma density of $2{\times}10^{12}cm^{-3}$ at a discharge current of 20 rna, Silicon etch rate of 1.3 ${\mu}m$/min was achieved with $SF_6/O_2$ plasma conditions of total gas pressure of 50 mTorr, gas flow rate of 40 seem, and RF power of200W. This paper presents surface etching characteristics on a crystalline silicon wafer and large area cast type multicrystlline silicon wafer. We obtained field emitter tips size of less than 0.1 ${\mu}m$ without any photomask step as well as with a conventional photolithography. Our experimental results can be applied to various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications. In this research, we studied silicon etching properties by using the hollow cathode plasma system.

• Transactions on Electrical and Electronic Materials
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• 제7권4호
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• pp.163-166
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• 2006

The dishing and the erosion were evaluated on the tungsten CMP process with conventional and new developed slurry. The tungsten thin film was polished by orbital polishing equipment. Commercial pattern wafer was used for the evaluation. Both slurries were pre tested on the oxide region on the wafer surface and the removal rate was not different very much. At the pattern density examination, the erosion performance was increased at all processing condition due to the reduction of thickness loss in new slurry. However, the dishing thickness was not remarkably changed at high pattern density despite of the improvement at low pattern density. At the large pad area, the reduction of dishing thickness was clearly found at new tungsten slurry.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.76.1-76.1
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• 2013

Atomic Layer Deposition (ALD) has remarkably developed in semiconductor and nano-structure applications since early 1990. Now, the advantages of ALD process are well-known as controlling atomic-level-thickness, manipulating atomic-level-composition control, and depositing impurity-free films uniformly. These unique properties may accelerate ALD related industries and applications in various functional thin film markets. On the other hand, one of big markets, Display industry, just starts to look at the potential to adopt ALD functional films in emerging display applications, such as transparent and flexible displays. Unlike conventional ALD process strategies (good quality films and stable precursors at high deposition processes), recently major display industries have suggested the following requirements: large area equipment, reasonable throughput, low temperature process, and cost-effective functional precursors. In this talk, it will be mentioned some demands of display industries for applying ALD processes and/or functional films, in terms of emerging display technologies. In fact, the AMOLED (active matrix organic light emitting diode) Television markets are just starting at early 2013. There are a few possibilities and needs to be developing for AMOLED, Flexible and transparent Display markets. Moreover, some basic results will be shown to specify ALD display applications, including transparent conduction oxide, oxide semiconductor, passivation and barrier films.