• 소성∙가공
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• 제14권3호
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.507-511
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• 2008

LTCC (Low Temperature Co-fired Ceramic) has been successfully applied to ceramic substrates for circuits and micro-fluidic systems and has proven its superior performance in a variety of applications. The prediction of shrinkage in LTCC process is an important for dimensional control of micro LTCC products which has influences on electronic characteristics. For avoiding the unpredictable shrinkage of LTCC during the sintering which makes accurate placement of the circuit devices difficult, pre-processes such as WIP (Warm Isostatic Pressing) and lamination must be modified. The objective of the present investigation is to establish a proper WIP conditions for near net shape fabrication of LTCC products. This paper discusses the influence of WIP conditions on the dimensional change of LTCC sheet. In the investigation, it is shown that the shrinkage values of sheets depend on WIP conditions and sheet directions. This work is a quantitative evaluation of the effect of WIP pressure on shrinkage of LTCC sheet. Additionally, the results show anisotropic shrinkage behaviour of sheet during LTCC process.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.57-57
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• 2000

본 논문에서는 MCM 및 패키지의 Lid로 사용되는 합금인 Kovar (Fe-Ni-Co alloy) 와 LTCC (Low Temperature Co-fired Ceramics) 간의 Brazing 특성을 연구하였다. 기존에 사용되고 있는 알루미나 패키지의 경우, 주로 80$0^{\circ}C$ 이상의 온도에서 Brazing을 실시하고 있으며, 조성은 Ag-Cu 계열을 사용하고 있다. 하지만, LTCC 의 경우, 소결온도가 85$0^{\circ}C$ 내외로서 기존의 방법을 그대로 적용하기는 어려움이 있다. 또한 Brazing 특성에 따른 접착 강도는 Brazing Alloy 의 영향뿐만 아니라 LTCC 와 전도체 전극사이의 Metallization 에 크게 영향을 받는다. 따라서, 본 논문에서는 Brazing Alloy의 종류 (Ag-Cu, Au-Sn) 및 Brazing 조건에 따른 Brazing 특성뿐만 아니라, 전도체 전극내 유리질 함량에 따른 Brazing 특성을 평가하여 LTCC/Kovar 간의 최적의 Brazing 조건을 구현하고자 하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 제3회 금형가공 심포지엄
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• 소성∙가공
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• 제16권5호통권95호
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.341-347
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• 2008

Laminated LTCC components of high integrity, fabricated by thick film process, are applied to industrial field of IT technology along with miniaturization trend of electronic devices. Dispersion states were examined by several evaluation methods with MLS-22, which is one of commercial LTCC powders, to achieve optimal dispersion as basis for stable LTCC fabrication process. Slurry viscosity, surface roughness of dip-coated slide glass, sedimentaion of slurry, and SEM observation of dried surface were utilized with respective amount change of various commercial dispersants. Among these commercial dispersants, optimal dispersion state was obtained with 0.4 wt% of BYK-111, from the results of various evaluation methods.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2006년도 하계학술대회
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• pp.215-218
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• 2006

In this paper, a small size, $7{\times}6mm^2$, Low Noise Amplifier(LNA) using LTCC process was fabricated with multi-layer structure for 2.4GHz wireless LAN. The measured results demonstrate that the bandwidth is 130 MHz, and the operating frequency is from 2.39GHz to 2.52GHz. The power gain is above 7.3 dB in the operating frequency range and the gain flatness is 0.5 dB. The maximum S11 is -4 dB and the maximum S22 is -7.5 dB. The noise figure is less than 1.83 dB. The measured power gain, S11 and S22 were had poorer performance than the simulation results. The reason for this discrepancy is that the input and output matching was not performed exactly. However, the noise figure of the LTCC low noise amplifier is better than simulation result. It is found that it is possible to fabricate a LTCC low noise amplifier in a small size.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.45-48
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• 2002

LTCC 시스템은 가격이 저렴하고 공정이 안정적이고 전기적 특성에서도 손실값이 작은점등의 많은 장점을 가지고 있다. 그러나 일단 제작된 소자들에 대해서는 튜닝 작업이 어려운 단점이 있다. 이때문에 수 GHz이상의 고주파수 대역에서 내장형 소자에 대한 정확한 평가 및 특성 예측을 필요로 하게 된다. 본 연구에서는 고주파수 대역에서 내장형 소자들을 정확하게 측정할 수 있는 방법을 고찰하였는데 이 과정에서 여러 형태의 측정 지그를 비교 검토하여 최적화하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.225-229
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• 2005

We have designed micro-fuel processor system, which consists of a steam reforming area and a PROX(preferential oxidation) area. Micro-fuel processor system generates $H_2$ rich gas from a methanol. In our experiment, we have integrated micro-fuel processor system using low temperature cofired ceramics (LTCC) process because LTCC is superior to other materials principally due to their high thermal and chemical stability, simpler fabrication processes, and lower materials cost. Therefore, we have studied and integrated micro-fuel processor system containing embedded heaters, cavities, and 3D structures of micro-channel with LTCC. Also we have optimized the LTCC process.