• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.277-281
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• 2005

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet, ceramic sheet and punch-to- die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor $\kappa$ is introduced to express effect of the process variables.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.507-511
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• 2008

LTCC (Low Temperature Co-fired Ceramic) has been successfully applied to ceramic substrates for circuits and micro-fluidic systems and has proven its superior performance in a variety of applications. The prediction of shrinkage in LTCC process is an important for dimensional control of micro LTCC products which has influences on electronic characteristics. For avoiding the unpredictable shrinkage of LTCC during the sintering which makes accurate placement of the circuit devices difficult, pre-processes such as WIP (Warm Isostatic Pressing) and lamination must be modified. The objective of the present investigation is to establish a proper WIP conditions for near net shape fabrication of LTCC products. This paper discusses the influence of WIP conditions on the dimensional change of LTCC sheet. In the investigation, it is shown that the shrinkage values of sheets depend on WIP conditions and sheet directions. This work is a quantitative evaluation of the effect of WIP pressure on shrinkage of LTCC sheet. Additionally, the results show anisotropic shrinkage behaviour of sheet during LTCC process.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.57-57
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• 2000

Brazing characteristics of the LTCC(Low Temperature Co-fired Ceramics)/ Kovar(Fe-Ni-Co alloy) was investigated. Kovar is one of the typical material for the lid of MCM and packages. In case of alumina package, Brazing process is done by higher temperature profile than 800 $^{\circ}C$ and Ag-Cu alloy. But, LTCC has sintering temperature near 850 $^{\circ}C$. So, it is difficult to use the same process as alumina brazing. The adhesion strength of the brazed part is affected by brazing alloy and metallization properties between conductor pattern and LTCC material. We investigated brazing characteristics of the LTCC/Kovar using various brazing alloys(Ag-Cu, Au-Sn) and process conditions. And, we examined the influence of the glass contents in conductor on the brazing characteristics of the LTCC/Kovar.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.260-265
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• 2004

LTCC(Low temperature co-fired ceramic) is being recognized as a significant packaging material of electrical devices for the advantages such as relatively low temperature being needed for process, low conductor resistance and high printing resolution. In the process of LTCC electrical devices, the punched via-hole quality is one of the most important factors on the performance of the device. However, its mechanism is very complicated and optimization of the process seems difficult. In this paper, to clarify the process, via-hole punching experiments were carried out and the punched holes were examined in terms of their burr formation. The effects of thickness of PET sheet and ceramic sheet and punch-to-die clearance on via-hole quality were also discussed. Optimum process conditions are proposed and a factor k is introduced to express effect of the process variables.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.

• Transactions of Materials Processing
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• v.16 no.5 s.95
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• pp.396-400
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• 2007

LTCC(Low Temperature Co-fired Ceramic) which offers a good performance to produce multilayer structures with electronic circuits and components has emerged as an attractive technology in the electronic packaging industry. In LTCC module fabrication process, the lamination and the sintering are very important processes and affect the electrical characteristics of the final products because the processes change the permittivity of ceramics and the dimension of the circuit patterns which have influences on electronic properties. This paper discusses the influence of lamination pressure and sintering temperature on the permittivity and the dimensional change of LTCC products. In the present investigation, it is shown that the permittivity increases along with increasing of the lamination pressure and the sintering temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.341-347
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• 2008

Laminated LTCC components of high integrity, fabricated by thick film process, are applied to industrial field of IT technology along with miniaturization trend of electronic devices. Dispersion states were examined by several evaluation methods with MLS-22, which is one of commercial LTCC powders, to achieve optimal dispersion as basis for stable LTCC fabrication process. Slurry viscosity, surface roughness of dip-coated slide glass, sedimentaion of slurry, and SEM observation of dried surface were utilized with respective amount change of various commercial dispersants. Among these commercial dispersants, optimal dispersion state was obtained with 0.4 wt% of BYK-111, from the results of various evaluation methods.

• 한국정보통신설비학회:학술대회논문집
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• 2006.08a
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• pp.215-218
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• 2006

In this paper, a small size, $7{\times}6mm^2$, Low Noise Amplifier(LNA) using LTCC process was fabricated with multi-layer structure for 2.4GHz wireless LAN. The measured results demonstrate that the bandwidth is 130 MHz, and the operating frequency is from 2.39GHz to 2.52GHz. The power gain is above 7.3 dB in the operating frequency range and the gain flatness is 0.5 dB. The maximum S11 is -4 dB and the maximum S22 is -7.5 dB. The noise figure is less than 1.83 dB. The measured power gain, S11 and S22 were had poorer performance than the simulation results. The reason for this discrepancy is that the input and output matching was not performed exactly. However, the noise figure of the LTCC low noise amplifier is better than simulation result. It is found that it is possible to fabricate a LTCC low noise amplifier in a small size.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.45-48
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• 2002

LTCC system has many kinds of advantages, like low loss, low cost of process, stability of process etc. But it is so hard to adjust the characteristics of passives in ceramic module after fabrication. So the exact prediction of behavior of components in high frequency region upper than GHz must be made. In this procedure, the exact measurement is need. In this study, many kinds of measurement Jigs are compared and optimized, and measurement methods of each parameter are designed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.225-229
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• 2005

We have designed micro-fuel processor system, which consists of a steam reforming area and a PROX(preferential oxidation) area. Micro-fuel processor system generates $H_2$ rich gas from a methanol. In our experiment, we have integrated micro-fuel processor system using low temperature cofired ceramics (LTCC) process because LTCC is superior to other materials principally due to their high thermal and chemical stability, simpler fabrication processes, and lower materials cost. Therefore, we have studied and integrated micro-fuel processor system containing embedded heaters, cavities, and 3D structures of micro-channel with LTCC. Also we have optimized the LTCC process.