• Title/Summary/Keyword: LTCC material

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A Study about the Application of Rogowski Coil on the LTCC (LTCC기판상에 구현한 로고스키코일의 적용에 관한 연구)

  • Kim, Eun-Sup;Son, Won-Keun;Moon, Hyung-Shin;Park, Sung-Hyun;Shin, Byung-Chul
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.28-28
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    • 2008
  • Generally speaking, Rogowskii coil for magnetic flux change detection according to electric current is used for digital addition watt-hour meter, because it is not saturated at electromagnetic that not Current Transformer working by magnetic material but non-magnetic material. In this paper, we described sensitive quality an electric current coil sensor followed by the principal of Rogowskii coil on the low dielectric loss LTCC, change different line width, gap, line length at sensing parts and extinction parts.

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Design of T/R Switch Using LTCC Technology

  • Sim, Sung-Hun;Kang, Chong-Yun;Park, Ji-Won;Yoon, Young-Joong;Kim, hyun-Jai;Park, Hyung-Wook;Yoon, Seok-Jin
    • Journal of the Korean Ceramic Society
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    • v.40 no.4
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    • pp.375-379
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    • 2003
  • In this paper, a novel design of multilayer ceramic-based Transmit/Receive (T/R) switch using Low Temperature Co-fired Ceramic (LTCC) technology have been presented. Compact T/R switch has been designed by transforming quarter-wave transmission line to its lumped equivalent circuit. Especially, high-Q three dimensional inductors with double strip have been proposed and incorporated. The proposed inductor has been modeled by multi-conductor coupled lines. A measured inductor quality factor (Q) of 80 and a Self-Resonance Frequency (SRF) of 6.6 GHz have been demonstrated. The inductor library has been incorporated into the design of WCDMA T/R switch.

Analysis of Stripline Structure(Resonator) in LTCC System (LTCC System 에서의 Stripline 구조 특성 연구)

  • 유찬세;이우성;강남기;박종철
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.13-17
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    • 2002
  • In ceramic systems, many components including embedded passives and TRL(transmission line) are used for composition of 3-dimensional circuit. So the exact analysis on this components must be performed. As for the TRL's, material properties including electrical conductivity of metal, loss factor and effective dielectric constant of dielectric material and geometrical factors like roughness of surface, vias, dimension of stripline structure have a large effect on the charactersistics of transmission lines. In this research, effect of material and geometrical factors on the characteristics of stripline structure is analyzed and quantified by simulation and measurement.

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Sensing properties of ZnO thin films fabricated by RF sputtering method for toxic gas (RF sputtering 방법을 이용하여 제작한 ZnO 박막의 유독성 가스에 대한 반응 특성 연구)

  • Hwang, Hyun-Suk;Kang, Hyun-Il;Song, Joon-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.247-247
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    • 2009
  • In this work, Ga-doped ZnO (GZO) thin films for toxic gas sensor application were deposited on low temperature co-fired ceramic (LTCC) substrates, by RF magnetron sputtering method. LTCC is one of promising materials for integration with heater, low cost production and high manufacturing yields than silicon substrate. The LTCC substrates with thickness of $400\;{\mu}m$ were fabricated by laminating 12 greentapes which consist of alumina and glass particle in an organic binder. The GZO thin films deposited on the substrates and were analyzed by X-ray diffraction method (XRD) and field emission scanning electron microscope (FESEM). The films are well crystallized in the hexagonal (wurzite) structure with increasing thickness. The fabricated sensors showed good sensitivity and fast response time to common types of toxic gases (NOx, COx).

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A study on the micro inductor using LTCC technology (LTCC기술을 이용한 마이크로 인덕터에 관한 연구)

  • Choi, Dong-Chan;Kim, Chan-Young;Kim, Hee-Jun
    • Proceedings of the KIEE Conference
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    • 2003.04a
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    • pp.289-291
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    • 2003
  • This paper deals with the design of a spiral micro inductor using LTCC(Low Temperature Cofired Ceramics) technology. The inductors using the LTCC technology have some prominent properties of high integration of circuits, high confidence and low cost comparing with previously fabricated thick-film inductors. In this paper, we designed a new spiral-type micro inductor comprising a magnetic material to improve the inductance and leakage flux. we, in addition, presented the simulation results for various shapes of the magnetic material in the micro inductor, Finally application of the micro inductor to the boost DC-DC converter is investigated.

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Fabrication of LTCC Multi-layer Circuit Board made of Glass-Al2O3 Composites (Glass-Al2O3 복합소재를 원료로 한 LTCC 다층회로 기판의 제조)

  • Kwak, Hun;Jeon, Hyung-Do;Kim, Hwan;Lee, Won-Jae;Shin, Byoung-Chul;Kim, Il-Soo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.6
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    • pp.509-516
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    • 2008
  • Multi-layer circuit card for semiconductor inspection was fabricated by LTCC technology. After a proper impedance design without electrical interference, ceramic tapes with the composition of $CaO-Al_2O_3-SiO_2-B_2O_3$ glass and $Al_2O_3$ were prepared. The electrode with silver paste printed on the tape. Printed ceramic sheets were then laminated and sintered. Densities and dielectric properties were measured. The microstructure, fracture surface of the region of via and matching state of substrate-electrode were observed. The durability of plated outside electrode were examined by hardness and scratch test.

Study on Reduction of Via hole Pore by Composition variation of Via paste during LTCC Constrained Sintering Process (무수축 LTCC 공정 중 Via Paste의 조성에 따른 Via 주변의 기공감소에 관한 연구)

  • Cho, Hyun-Min;Kim, Jong-Gyu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.233-234
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    • 2006
  • In this paper, Via hole pore were investigated during PLAS (PessureLess Assisted Constrained Sintering) process of LTCC. Ag and Ag-Pd paste mixture were tested for via paste. Ag paste with 10~25% Ag-Pd paste showed no via hole pore, but further increase of Ag-Pd contents in via paste increased via pore. From shrinkage curve, 10~25% Ag-Pd paste showed expansion behaviors before shrink and this phenomena result in the reduction of via hole pore during PLAS process.

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Effect of Binder Content on Physical Properties of LTCC Green Tapes (바인더 함량 변화가 LTCC 그린 테이프의 물리적 특성에 미치는 영향)

  • You, Jung-Hoon;Yeo, Dong-Hun;Lee, Joo-Sung;Shin, Hyo-Soon;Yoon, Ho-Gyu;Kim, Jong-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.12
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    • pp.1112-1117
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    • 2006
  • The properties of LTCC green tape with addition of binder were investigated in order to understand an effects of binder on multilayer processing. A green sheet form was fabricated through tape casting method with the MLS-22 powder. The lamination density increased with increasing amount of binder and lamination pressure. With increasing amount of binder, the elongation of ceramic sheets increased but the tensile stress and air-permeability decreased. The addition of excessive binder is caused defects in the green sheet during via hole punching. The optimum condition of the via hole without defects was observed from amount of the binder 10 wt%.

고강도 LTCC 소재에서 glass 조성의 영향

  • Gu, Sin-Il;Sin, Hyo-Sun;Yeo, Dong-Hun;Kim, Jong-Hui;Park, Eun-Tae;Nam, San
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.61-61
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    • 2008
  • 이동 통신의 급격한 발전에 따라 이동통신 기기의 부품들이 소형화되고 다양한 기능이 요구되어지고 있다. 이동 통신용 부품은 패턴의 미세화와 비아 수의 증가 등 고집적화로 인한 강도 요구로 LTCC 소재의 사용이 증가되고 있다. 또한 glass의 조성이 결정상 생성 및 복합체의 미세 구조에 영향을 미칠 것으로 기대되지만 유리의 조성에 관한 연구는 아직 미비하다. 본 연구에서는, anorthite를 생성시키는 LTCC composite용 glass에서 융점 및 Tg에 영향을 주는 것으로 알려진 B와 Zn의 양을 변화시키고 2가 금속(Mg, Sr, Ba)원소를 첨가함에 따라 compostite에서 아노사이트 상을 비롯한 결정상의 생성과 이에 따른 미세구조의 변화를 살펴 보았다. 조성변화에 따라 제조된 glass는 Tg를 측정하고, 제조된 glass를 $Al_2O_3$ filler와 혼합하여 tape casting 공정으로 시트를 제작하였다. 제조된 시트를 소결한 후에, 강도, 유전 특성, 밀도를 측정하였다. 소결체는 미세구조와 상분석을 통해 LTCC 소재와 글래스 조성과의 상관관계를 확인하고자 하였다.

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Simulation for a microfabricated transformer on the LTCC substrate (LTCC 기판 위에 제작된 마이크로 트랜스포머의 시뮬레이션)

  • Kim, Sung-Tae;Cha, Doo-Yeol;Kang, Min-Suck;Cho, Se-Jun;Jang, Sung-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.166-167
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    • 2008
  • 현재 Passive component 중의 하나인 트랜스포머의 소형화가 큰 이슈로 대두되고 있다. 본 논문에서는 기판의 와전류 효과의 영향을 줄이기 위해 LTCC기판을 이용하여 트랜스포머를 설계하고, 1:1 및 1:n의 권선 수를 갖는 두 코일의 인덕턴스 및 상호 인덕턴스를 시뮬레이션 하였다. 트랜스포머의 최대 크기는 2.55mm $\times$ 1.1 mm 이고 선폭은 50um 선간 간격은 50um이고, 기둥의 높이는 40um이다. MEMS 기술을 사용하여 기판 커플링과 저항손을 줄임으로서 8.5GHz 에서 0.33dB의 낮은 삽입 손실을 나타냈다.

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