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http://dx.doi.org/10.4313/JKEM.2008.21.6.509

Fabrication of LTCC Multi-layer Circuit Board made of Glass-Al2O3 Composites  

Kwak, Hun (동의대학교 나노공학과)
Jeon, Hyung-Do (동의대학교 나노공학과)
Kim, Hwan (동의대학교 나노공학과)
Lee, Won-Jae (동의대학교 나노공학과)
Shin, Byoung-Chul (동의대학교 나노공학과)
Kim, Il-Soo (동의대학교 나노공학과)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.21, no.6, 2008 , pp. 509-516 More about this Journal
Abstract
Multi-layer circuit card for semiconductor inspection was fabricated by LTCC technology. After a proper impedance design without electrical interference, ceramic tapes with the composition of $CaO-Al_2O_3-SiO_2-B_2O_3$ glass and $Al_2O_3$ were prepared. The electrode with silver paste printed on the tape. Printed ceramic sheets were then laminated and sintered. Densities and dielectric properties were measured. The microstructure, fracture surface of the region of via and matching state of substrate-electrode were observed. The durability of plated outside electrode were examined by hardness and scratch test.
Keywords
LTCC; Multi-layer circuit board; Glass/$Al_2O_3$ composites;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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