• Title/Summary/Keyword: LTCC(low temperature co-fired ceramic)

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Circuit Modeling of 3-D Parallel-plate Capacitors Fabricated by LTCC Process

  • Shin, Dong-Wook;Oh, Chang-Hoon;Yun, Il-Gu;Lee, Kyu-Bok;Kim, Jong-Kyu
    • Transactions on Electrical and Electronic Materials
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    • v.5 no.1
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    • pp.19-23
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    • 2004
  • A novel method of high speed, accurate circuit simulation in 3-dimensional (3-D) parallel-plate capacitors is investigated. The basic concept of the circuit simulation methods is partial element equivalent circuit model. The three test structures of 3-D parallel-plate capacitors are fabricated by using multi-layer low-temperature co-fired ceramic (LTCC) process and their S-parameters are measured between 50 MHz and 5 GHz. S-parameters are converted to Y-parameters, for comparing measured data with simulated data. The circuit model parameters of the each building block are optimized and extracted using HSPICE circuit simulator. This method is convenient and accurate so that circuit design applications can be easily manipulated.

Design and Implementation of Broadband Antenna and Diplexer for Dual- Band Handsets

  • Joung, Myoung-Sub;Park, Jun-Seok;Kim, Hyeong-Seok;Lim, Jae-Bong;Cho, Hong-Goo
    • KIEE International Transactions on Electrophysics and Applications
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    • v.4C no.6
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    • pp.288-294
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    • 2004
  • In this paper, a ceramic antenna and diplexer are designed for dual-band handset ap plications. Basically, the antenna is designed by using the meander line configuration. The diplexer presented in this paper is composed of both low- and high-pass filters. We have designed the low- and high-pass filters with attenuation poles to improve the attenuation performances of the diplexer. The attenuation poles are located at each rejection frequency region so as to improve the shrinkage characteristic of the diplexer. In order to accomplish the volume effectiveness, the antenna and the diplexer have been designed and fabricated in a multi-layer structure. The diplexer designed with a multi-layer structure has inductors and capacitors, which are implemented by LTCC (Low Temperature Co-fired Ceramics) process technique. Design of the multi-layer antenna and diplexer has been achieved by employing the full 3-D EM simulation. The designed antenna and diplexer offer excellent return loss and broadband performances with highly isolated rejection performance.

Lower Characteristic Impedance Based Compact f λ0/4 Short-Circuited Stub UWB Bandpass Filter with WLAN Stopband (저특성 임피던스의 λ0/4 단락 스터브 기술을 이용한 WLAN 저지 대역을 가지는 UWB BPF)

  • Hoa, Duong Thai;Joo, Hyo-Suk;Kim, Ihn-Seok
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.4
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    • pp.323-332
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    • 2009
  • In this paper, we introduce a modified short-circuited stub bandpass filter suitable for ultra-wideband(UWB) applications utilizing low temperature co-fired ceramic(LTCC) technology. By modifying the conventional short-circuited stub bandpass filter structure with stubs and connecting lines of lower characteristic impedances, the number of stubs has been reduced from 5 to 2 on a high dielectric constant substrate($\varepsilon_r$ = 40). A wireless local area network (WLAN) stopband in the frequency range of 5.15 to 5.825 GHz has been inserted into the filter characteristic using three short-circuited coupled lines. The filter has been measured with an insertion loss less than 1.0 dB and return loss better than 10 dB in the pass bands. A bandwidth ratio of 109.49 % has been achieved. Measurement results agree well with simulation results. The dimensions of the filter are $4{\times}8{\times}0.57\;mm^3$.

Microstructure and Thermal Insulation Properties of Ultra-Thin Thermal Insulating Substrate Containing 2-D Porous Layer (2차원 기공층을 포함하는 초박형 단열기판의 미세구조 및 단열 특성)

  • Yoo, Chang Min;Lee, Chang Hyun;Shin, Hyo Soon;Yeo, Dong Hun;Kim, Sung Hoon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.11
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    • pp.683-687
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    • 2017
  • We investigated the structure of an ultra-thin insulating board with low thermal conductivity along z-axis, which was based on the idea of void layers created during the glass infiltration process for the zero-shrinkage low-temperature co-fired ceramic (LTCC) technology. An alumina and four glass powders were chosen and prepared as green sheets by the tape casting method. After comparison of the four glass powders, bismuth glass was selected for the experiment. Since there is no notable reactivity between alumina and bismuth glass, alumina was selected as the supporting additive in glass layers. With 2.5 vol% of alumina powder, glass green sheets were prepared and stacked alternately with alumina green sheet to form the 'alumina/glass (including alumina additive)/alumina' structure. The stacked green sheets were sintered into an insulating substrate. Scanning electron microscopy revealed that the additive alumina formed supporting bridges in void layers. The depth and number of the stacking layers were varied to examine the insulating property. The lowest thermal conductivity obtained was 0.23 W/mK with a $500-{\mu}m-thick$ substrate.

Implementation of Active Monopole Antenna with Embedded Bandpass Filters for Antenna (대역통과 필터가 내장된 능동 모노폴 안테나 구현)

  • Jang, Jin-Woo;Lee, Won-Taek;Kim, Joon-Il;Jee, Yong
    • Proceedings of the IEEK Conference
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    • 2007.07a
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    • pp.81-82
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    • 2007
  • This paper presents a WLAN band active monopole antenna which is made of a CPW-fed monopole antenna and a low noise amplifier implemented on single-layer low-temperature co-fired ceramic (LTCC) substrate. Planar active antenna measure return loss and power test. (drain voltage = 4V, gate voltage = -0.6V). The bandwidth, is 540MHz, return loss is -38dB.

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New UWB 1:2 Power Divider with Flat In-Band Splitting and Bandpass Filtering Functions

  • Duong, Thai Hoa;Kim, Ihn-Seok
    • Journal of electromagnetic engineering and science
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    • v.10 no.1
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    • pp.28-34
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    • 2010
  • This paper introduces a new U.S. ultra-wideband(UWB: 3.1~10.6 GHz) 1:2 power divider based on a single section Wilkinson type configuration. The divider provides very flat in-band power splitting, high isolation, low insertion loss, sharp roll-off bandpass filtering, and DC blocking characteristics. The circuit consists of a $\lambda$/4 Y resonator, three capacitively coupled $\lambda$/2 short-circuited lines, and a resistor between the two output ports. The circuit structure was simulated with ADS and HFSS, and realized with low-temperature co-fired ceramic(LTCC) green tape, which has a dielectric constant of 7.8. $|S_{11}|$ better than 10 dB, $|S_{21}|$ and $|S_{31}|$ less than 3.2 dB, with both $|S_{22}|$ and $|S_{32}|$ measured as better than 12 dB for the whole UWB band. Measurement results agree closely with HFSS simulation results. The power divider has a compact size of $4\times9\times0.6mm^3$.

Compact Multi-harmonic Suppression LTCC Bandpass Filter Using Parallel Short-Ended Coupled-Line Structure

  • Wang, Xu-Guang;Yun, Young;Kang, In-Ho
    • ETRI Journal
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    • v.31 no.3
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    • pp.254-262
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    • 2009
  • This paper presents a novel simple filter design method based on a parallel short-ended coupled-line structure with capacitive loading for size reduction and ultra-broad rejection of spurious passbands. In addition, the introduction of a cross-coupling capacitor into the miniaturized coupled-line can create a transmission zero at the second harmonic frequency for better frequency selectivity and attenuation level. The aperture compensation technique is also applied to achieve a strong coupling in the coupled-line section. The influence of using the connecting transmission line to cascade two identical one-stage filters is studied for the first time. Specifically, such a two-stage bandpass filter operating at 2.3 GHz with a fractional bandwidth of 10% was designed and realized with low-temperature co-fired ceramic technology for application in base stations that need high power handling capability. It achieved attenuation in excess of -40 dB up to $4f_0$ and low insertion loss of -1.2 dB with the size of 10 mm ${\times}$ 7 mm ${\times}$ 2.2 mm. The measured and simulated results showed good agreement.

Parasitic Elements Analysis and Filter Design for LTCC Multi-Layer Filter (LTCC 적층 필터를 위한 기생 성분 해석 및 필터 설계)

  • Lee, Hye-Sun;Kim, Yu-Seon;Pyo, Hyun-Seong;An, Jae-Min;Lim, Yeong-Seog
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.8
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    • pp.730-738
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    • 2009
  • In this paper, we present a equivalent circuit considered parasitic elements about LTCC multi-layer BPF structure that was studied previously and a process of extraction of the element value using SOC technique. By applying extracted element values to equivalent circuit, 2th LTCC filter was designed and fabricated that was applied to satellite DMB. The filter was fabricated of Dupont951 substrate with relative permittivity of 7.8, the dimension of the fabricated filter is $2.4{\times}3.8{\times}0.378mm^3$. The measurement results indicate 1.4 dB of insertion loss and 32.3 dB of return loss, which are in good agreement with simulated ones.

Microwave Dielectric Properties of Low Temperature Fired (${Pb_{0.45}}{Ca_{0.55}}$) [(${Fe _{0.5}}{Nb_{0.5}}$)$_{0.9}{Sn_{0.1}}$]$O_3$Ceramics with Various Additives

  • Ha, Jong-Yoon;Park, Ji-Won;Yoon, Seok-Jin;Kim, Hyun-Jai;Yoon, Ki-Hyun
    • Journal of the Korean Ceramic Society
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    • v.38 no.7
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    • pp.597-601
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    • 2001
  • The effect of CuO, $B_2$ $O_3$, $V_2$ $O_{5}$ and CuO-B $i_2$ $O_3$additives on microwave dielectric properties of (P $b_{0.45}$C $a_{0.55}$) [(F $e_{0.5}$N $b_{0.5}$)$_{0.9}$S $n_{0.1}$] $O_3$(PCFNS) were investigated. The PCFNS ceramics were sintered at 11$65^{\circ}C$. To decrease the sintering temperature for using as a low-temperature co-firing ceramics (LTCC), CuO, $B_2$ $O_3$, $V_2$ $O_{5}$ and CuO-B $i_2$ $O_3$were added to the PCFNS. As the content of CuO increased, the sintered density and dielectric constant increased and the temperature coefficient of resonance frequency ($\tau$$_{f}$) shifted to the positive value. When the CuO-B $i_2$ $O_3$were added, dielectric properties were $\varepsilon$$_{r}$ of 83, Q. $f_{0}$ of 6085 GHz, and $\tau$$_{f}$ of 8ppm/$^{\circ}C$ at a sintering temperature of 100$0^{\circ}C$. The relationship between the microstructure and properties of ceramics was studied by X-ray diffraction and scanning electron microscopy.icroscopy.y.icroscopy.y.

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Improving Stability and Characteristic of Circuit and Structure with the Ceramic Process Variable of Dualband Antenna Switch Module (Dual band Antenna Switch Module의 LTCC 공정변수에 따른 안정성 및 특성 개선에 관한 연구)

  • Lee Joong-Keun;Yoo Joshua;Yoo Myung-Jae;Lee Woo-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.105-109
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    • 2005
  • A compact antenna switch module for GSM/DCS dual band applications based on multilayer low temperature co-fired ceramic (LTCC) substrate is presented. Its size is $4.5{\times}3.2{\times}0.8 mm^3$ and insertion loss is lower than 1.0 dB at Rx mode and 1.2 dB at Tx mode. To verify the stability of the developed module to the process window, each block that is diplexer, LPF's and bias circuit is measured by probing method in the variation with the thickness of ceramic layer and the correlation between each block is quantified by calculating the VSWR In the mean while, two types of bias circuits -lumped and distributed - are compared. The measurement of each block and the calculation of VSWR give good information on the behavior of full module. The reaction of diplexer to the thickness is similar to those of LPF's and bias circuit, which means good relative matching and low value of VSWR, so total insertion loss is maintained in quite wide range of the thickness of ceramic layer at both band. And lumped type bias circuit has smaller insertion itself and better correspondence with other circuit than distributed stripline structure. Evaluated ceramic module adopting lumped type bias circuit has low insertion loss and wider stability region of thickness over than 6um and this can be suitable for the mass production. Stability characterization by probing method can be applied widely to the development of ceramic modules with embedded passives in them.

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