Transactions on Electrical and Electronic Materials

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Circuit Modeling of 3-D Parallel-plate Capacitors Fabricated by LTCC Process

  • Shin, Dong-Wook (Center for Information Technology of Yonsei University, Semiconductor Engineering Laboratory, Department of Electrical and Electronic Engineering, Yonsei University) ;
  • Oh, Chang-Hoon (Center for Information Technology of Yonsei University, Semiconductor Engineering Laboratory, Department of Electrical and Electronic Engineering, Yonsei University) ;
  • Yun, Il-Gu (Center for Information Technology of Yonsei University, Semiconductor Engineering Laboratory, Department of Electrical and Electronic Engineering, Yonsei University) ;
  • Lee, Kyu-Bok (Wireless Communication Research Center, Korea Electronics Technology Institute) ;
  • Kim, Jong-Kyu (Wireless Communication Research Center, Korea Electronics Technology Institute)
  • Published : 2004.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

A novel method of high speed, accurate circuit simulation in 3-dimensional (3-D) parallel-plate capacitors is investigated. The basic concept of the circuit simulation methods is partial element equivalent circuit model. The three test structures of 3-D parallel-plate capacitors are fabricated by using multi-layer low-temperature co-fired ceramic (LTCC) process and their S-parameters are measured between 50 MHz and 5 GHz. S-parameters are converted to Y-parameters, for comparing measured data with simulated data. The circuit model parameters of the each building block are optimized and extracted using HSPICE circuit simulator. This method is convenient and accurate so that circuit design applications can be easily manipulated.

Keywords

References

  1. R. Poddar and M. Brooke, 'Accurate high speed empirically based predictive modeling of deeply embedded gridded parallel plate capacitors fabricated in a multilayer LTCC process', IEEE Trans. Advanced Packaging, Vol. 22, p. 26, Feb. 1999 https://doi.org/10.1109/6040.746539
  2. Y. Rao, J. Qu, and C. Wong, 'RF electrical simulation of embedded capacitor', Proc. Int. Symp. Advanced Packaging Materials, p. 286, 2001
  3. C. Scrantom and J. Lawson, 'LTCC technology: where we are and where we're going. II', Digest. IEEE MTT-S Symp. Technologies for Wireless Applications, p. 193, 1999
  4. H. Ochi, Y. Baba, and S. Segawa, 'Internal capacitor of low temperature co-fired multilayer ceramic substrate', Proc. Int. Symp. Electronic Manufacturing Technology, p. 304, 1995
  5. H. Ochi, Y. Baba, and S. Segawa, 'High reliability internal capacitor of LTCC', IEEE Trans. Components, Packaging, and Manufacturing Technology, Vol. 18, p. 170, 1995
  6. A. Ruehli, 'Equivalent circuit models for three dimensional multiconductor systems', IEEE Trans. Microw. Theory tech., Vol. MTT-22, p. 216, 1974
  7. D. Shin, C. Oh, K. Lee, J. Kim, and I. Yun, 'Statistical Analysis of Three-dimensional Embedded Passive Devices', Proc. Annual Summer Conference of KIEEME, Vol. 1, No.2, p. 593, 2002
  8. D. Shin, C. Oh, K. Lee, J. Kim, and I. Yun, 'Characteristic Prediction and Analysis of 3-D Embedded Passive Devices', Proc. Annual Summer Conference of KIEEME, Vol. 1, No.2, p. 607, 2003
  9. D. Pozar, 'Microwave Engineering', John Wiley & Sons, INS., 1998
  10. D. Shin, C. Oh, K. Lee, J. Kim, and I. Yun, 'Statistical Analysis of Three-dimensional Embedded Passive Devices', J. KIEEME, Vol. 16, No.5, p. 404, 2003