• International Journal of Control, Automation, and Systems
• /
• v.6 no.5
• /
• pp.740-745
• /
• 2008

This paper presents a new non-contact 3D robotic inspection system to measure the precise positions of screw and punch holes on a car body frame. The newly developed sensor consists of a CCD camera, two laser line generators and LED light. This lightweight sensor can be mounted on an industrial robot hand. An inspection algorithm and system that work with this sensor is presented. In performance evaluation tests, the measurement accuracy of this inspection system was about 200 ${\mu}m$, which is a sufficient accuracy in the automotive industry.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.2
• /
• pp.81-86
• /
• 2023

Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.307-308
• /
• 2006

This paper is about the development of automatic inspection system of welded nuts on Support hinge using machine vision for the improvement of working condition. Until now, projection welding process was performed by operator. Also, inspection of welded nuts is performed manually and recorded by the operator's naked eye. So these processes caused the produce of poorly-made articles. To improve this manual operation, inspection system using machine vision is introduced. Test algorithm, lighting system and program showed good results to the designed inspection system and led to the increment of productivity.

• Journal of the Optical Society of Korea
• /
• v.19 no.6
• /
• pp.687-694
• /
• 2015

A photoluminescence (PL) imaging method using a vision camera was employed to inspect InGaN/GaN quantum-well light-emitting diode (LED) epi-wafers. The PL image revealed dark spot defective regions (DSDRs) as well as a spatial map of integrated PL intensity of the epi-wafer. The Shockley-Read-Hall (SRH) nonradiative recombination coefficient increased with the size of the DSDRs. The high nonradiative recombination rates of the DSDRs resulted in degradation of the optical properties of the LED chips fabricated at the defective regions. Abnormal current-voltage characteristics with large forward leakages were also observed for LED chips with DSDRs, which could be due to parallel resistances bypassing the junction and/or tunneling through defects in the active region. It was found that the SRH nonradiative recombination process was dominant in the voltage range where the forward leakage by tunneling was observed. The results indicated that the DSDRs observed by PL imaging of LED epi-wafers were high density SRH nonradiative recombination centers which could affect the optical and electrical properties of the LED chips, and PL imaging can be an inspection method for evaluation of the epi-wafers and estimation of properties of the LED chips before fabrication.

• Korean Journal of Computational Design and Engineering
• /
• v.22 no.1
• /
• pp.44-58
• /
• 2017

The inspection for building occupancy authorization has lacked objectivity due to manual measurement methods. This is why connivance of the illegal buildings has been rampant, which has led to so many incidents. Consequently, this law has lost its intent to protect people's lives and property. In this study, for the purpose of improvement of this law, the research was conducted by the utilization of unmanned aerial vehicle for automated inspection for building occupancy authorization. Theoretical considerations about building occupancy authorization and the trend of UAV technology were accomplished. Secondly, a series of reverse engineering was conducted including digital photography, network RTK-VRS surveying and post-processing data. Thirdly, the resultant spatial information was used for building occupancy inspection authorization in a BIM platform and the effectiveness and applicability of UAV-based inspection was analyzed. As a result, methodology for UAV-based automated building occupancy inspection authorization was derived. And it was found that eleven items would be possible to be automated among thirty total items for building occupancy authorization. Also it was found that UAV-based automated inspection could be valid in inspecting building occupancy authorization due to authentic accuracy, effectiveness and applicability with government policy.

• Journal of the Korean Society of Radiology
• /
• v.4 no.3
• /
• pp.5-11
• /
• 2010

In this paper, we are suggested development of dual-mode detector for dual-energy digital radiography. Design of dual-energy radiography module for commercial BIS (Baggage Inspection System) is used in the spectrum of the X-ray generator and detector for dual-mode features and radiological characteristics were analyzed. BIS suggestl on the image detector module being used to target X-ray tube to simulate X-ray spectrum and simulated spectrum to offer through the new radiographic characteristics of the detector modules were investigated. Using X-ray experiments with an increase in the thickness of the copper filter low energy detector (LED) and high-energy detector (HED) as the difference between the output signal increases. HED, especially in the size of the output signal decreases with increasing thickness of the copper filter was found.

• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.8 s.185
• /
• pp.80-88
• /
• 2006

This paper proposes a new steel strip surface inspection system. The system acquires bright and dark field images of defects by using a stroboscopic IR LED illuminator and area camera system and the defect images are preprocessed and segmented in real time for feature extraction. 4113 defect samples of hot rolled steel strip are used to develop KNN (k- Nearest Neighbor) classifier which classifies the defects into 8 different types. The developed KNN classifier demonstrates about 85% classifying performance which is considered very plausible result.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.10a
• /
• pp.379-383
• /
• 2005

This paper proposes a new steel strip surface inspection system. The system acquires bright and dark field images of defects by using a stroboscopic IR LED light and area camera system and the defect images are preprocessed and segmented in real time for feature extraction. 4113 defect samples of cold roll steel strips are used to develop KNN (k-Nearest Neighbor) classifier which classifies the defects into 8 different types. The developed KNN classifier demonstrates about 85% classifying performance which is considered very plausible result.

• Journal of the Korean Institute of Intelligent Systems
• /
• v.19 no.2
• /
• pp.259-264
• /
• 2009

High level quality control is required for mobile TFT-LCD modules which are frequently used for fine observation. However, quantitative quality control is difficult. Defect inspection using naked eyes makes irregular inspection results. This paper developed desk type defect inspection equipment for mobile TFT-LCD modules using the same inspection criterion with that of naked eyes. From experiments using this equipments, possibilities of standardization in defect inspection equipment for mobile TFT-LCD modules are presented.

• 제어로봇시스템학회:학술대회논문집
• /
• 1996.10b
• /
• pp.605-608
• /
• 1996

The aim of this thesis is to develop a SMT-components placement inspection system equipped with a visual sensor. The visual sensor, which consists of a camera and 2-layer LED illuminator, developed to inspect the component placement state such as missing, shift, flipping, polarity and tomb-stone. on PCB in the reflow-process. In practical applications, however, it is too hard to classify component from images mixed pad on PCB, cream solder paste and component. To overcome the problem, this thesis proposes the 2-layer illumination method and the heuristic image processing algorithms according to inspection type. To show the effectiveness of the proposed approach, a series of experiments on the inspection were conducted. The results show that the proposed method is robust to visual noise and variations in component conditions.