• Journal of the Optical Society of Korea
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• 제18권4호
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• pp.370-376
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• 2014

We optimized the design of the flat encapsulant of a light-emitting diode (LED) package to obtain higher light output power (LOP), both by experiment and simulation using three-dimensional ray-tracing software. In the experiment, the refractive index of the encapsulant was varied (1.41 and 1.53). In addition, double-layer structures with these refractive indices (1.41/1.53) were investigated by varying the shape of the interface between the two among flat, concave, and convex. The experiments showed that the LOP of the double-layer encapsulant with convex interface increased by 13.4% compared to the single-layer encapsulant with a refractive index 1.41, which was explained by the increase of the light extraction efficiency (LEE) in connection with the increase of the critical angle (${\theta}_c$) and the decrease of the Fresnel reflection.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.917-918
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• 2010

• 한국정밀공학회지
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• 제28권2호
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.31-35
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• 2014

본 연구에서는 $TiO_2$ 나노입자를 LED패키지의 봉지재인 실리콘에 분산시키고, 이에 따른 굴절률, 투과율 및 광효율 변화를 평가하였다. $TiO_2$ 나노입자는 LED 봉지재의 굴절율을 증가시켜 LED 패키지의 광추출 효율을 향상시키기 위해 봉지재에 적용되었다. $TiO_2$는 수열합성법을 통해 합성되었고, 합성된 $TiO_2$ 입자에 긴 체인구조의 vinyl silane을 코팅하여 분산시켰다. 분산 처리를 실시한 후에는 대부분의 $TiO_2$ 나노입자가 10~40 nm 이하로 분산되었으나, 100 nm 이상의 긴 입자도 관찰되었다. 실리콘 봉지재에 $TiO_2$ 나노입자 양이 증가할수록 굴절율은 증가하였으나, 투과율은 감소하였다. $TiO_2$ 나노입자가 포함된 실리콘 봉지재로 LED 패키지를 제조하였고, $TiO_2$ 나노입자가 분산된 LED가 $TiO_2$ 나노입자가 없는 LED패키지에 비해 약 13% 이상 광효율이 향상되었다.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.844-848
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• 2012

Encapsulant curing in terms of convection oven leads to thermal induced stress due to nonuniform thermal conductivity in LED package. We have adopted infrared (IR) light for silicone curing in order to release the stress. The light uniformity irradiated on an encapsulant surface is confirmed to be uniform by optical simulation. Shear strength of die paste using IR compared to convection oven is increased 19.2% at the same curing time, which indicates curing time can be shortened. The indentation depth difference between center and edge of silicone encapsulant in terms of convection oven and IR are 14.8% and 3.4%, respectively. Curing by IR also shows 2.3% better radiant flux persistency rate of LED at $85^{\circ}C$ after 1,000 h reliability test compared to convection curing.

• 조명전기설비학회논문지
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• 제27권4호
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• pp.1-7
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• 2013

Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

• 조명전기설비학회논문지
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• 제26권7호
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• pp.1-8
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• 2012

In this paper, we improved the light extraction efficiency by structural change of LEDs on conventional LEDs. We simulated the LEDs light emission as functions of LED side wall angle, various refractive indices the geometrical structures and analyzed the condition improved the light efficiency. We present the results of experimerns and simulations for light output power from LEDs for various refractive indices and the geometrical structures of the LED encapsulants. When the side wall angle range was from 40[$^{\circ}$] to 30[$^{\circ}$], the LED emission increased. LED side wall angle onto LED using the simulation system with a fine tuning of the structure of the LEDs side wall angle is fabricated. Additionally, we changed the side wall angle of LED package with spherical structure and flat structure. The result of spherical structure ray tracting is higher compared with flat structure about 14[%].

• 조명전기설비학회논문지
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• 제29권6호
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• pp.27-34
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• 2015

There has been a critical issue in optical simulation of phosphors in LEDs due to their light-reabsorption properties. To improve the accuracy of optical modeling for a white LED package, we utilized the spectrum data of the phosphor-dispersed encapsulant film instead of the phosphor powder. By measuring white LED packages with green and red phosphors, the maximum difference between simulation and experimental results of a color temperature, a color rendition index number and a color coordinate corresponds to ${\Delta}T=95K$, ${\Delta}Ra=1.7$ and ${\Delta}xy=0.007$, respectively. Based on those results, the proposed method can well explain the change of emission spectra of white LEDs with more than two phosphors which introduce the complex optical phenomena such as absorption, reabsorption, light emission, reflection and scattering, etc.

• Design & Manufacturing
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• 제6권1호
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• pp.84-89
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• 2012

Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state. In addition, birefringence experiment was carried out in order to observe residual stress distribution. Experimental results showed that cooling-induced birefringence was larger than curing-induced birefringence.

• 폴리머
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• 제39권2호
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• pp.311-316
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• 2015

고경도의 LED 봉지재로 치밀한 구조를 가지는 polyhedral oligomeric silsesquioxane(POSS)를 첨가제로 사용한 실리콘 젤을 제조하였다. 실록산 수지와의 상용성을 증가시키기 위하여 알킬기와 올리고실록산기를 가지로 갖는 POSS를 합성하였다. Hydrosilylation 반응을 통하여 가지와 POSS를 연결하였고, 1-decanol과 9-decen-1-ol의 반응에는 $H_2PtCl_6$을, 말단에 비닐기를 가지는 올리고실록산의 반응에는 1,3-divinyl tetramethyldisiloxane[Pt(dvs)]을 촉매로 사용하였다. 알킬기를 가지는 POSS(Decyl-POSS, Decenyl-POSS)를 사용한 실리콘 젤의 경우 실록산 수지와의 혼화성이 낮아서, 가시광선 영역의 투과도가 낮았으며 경도값도 낮았다. 이에 비해 올리고실록산기를 가지로 가지는 POSS(Siloxy-POSS)를 적용하였을 경우에는 실록산 수지와 혼화성이 우수하여 높은 투명도를 보였으나, POSS의 첨가로 인한 경도 증가는 뚜렷하게 나타나지 않았다.