• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.147-147
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• 2011

High crystalline nonpolar a-plane (11-20) nitride light emitting diodes (LEDs) have been fabricated on r-plane (1-102) sapphire substrates by metalorganic chemical-vapor deposition (MOCVD). The multi-quantum wells (MQWs) active region is consists of 4 periods the nonpolar a-plane InGaN/GaN(a-InGaN/GaN) on a high quality a-plane GaN (a-GaN) template grown by using the multibuffer layer technique. The full widths at half maximum (FWHMs) of x-ray rocking curve (XRC) obtained from phiscan of the specimen that was grown up to nonpolar a-plane GaN LED layers with double crystal x-ray diffraction. The FWHM values were decreased down to 477 arc sec for $0^{\circ}$ and 505 arc sec for $-90^{\circ}$, respectively. After fabricating a conventional lateral LED chip which size was $300{\times}600{\mu}m^2$, we measured the optical output power by on-wafer measurements. N-electrode was made with Cr/Au contact, and ITO on p-GaN was formed with Ohmic contact using Ni/Au followed by inductively coupled plasma etching for mesa isolation. The optical output power of 1.08 mW was obtained at drive current of 20 mA with the peak emission wavelength of 502 nm.

• 한국세라믹학회지
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• 제50권6호
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• pp.454-459
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• 2013

Recently, remote phosphors have been reported for application to white LEDs to provide enhanced phosphor efficiency compared with conventional phosphor-based white LEDs. In this study, a remote phosphor was produced by coating via screen printing on a glass substrate with different numbers of phosphor coating. The paste consists of phosphor, lowest softening glass frits, and organic binders. The remote phosphor could be well controlled by varying the phosphor content rated paste. After mounting the remote phosphor on top of a blue LED chip, CCT, CRI, and luminance efficiency were measured and values of 5300 K, 62, and 117 lm/W were respectively obtained in the 80 wt% phosphor with 3 coating layers sintered at $800^{\circ}C$.

• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• 한국산학기술학회논문지
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• 제10권7호
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• pp.1514-1519
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• 2009

400nm 파장을 방출하는 GaN LED를 제조하여, n-GaN층과 p-GaN층의 위에 있는 ITO층 표면에 패턴을 만들어 광 추출 효율을 향상시켰다. 추가적으로, n과 p패드 아래와 칩의 바닥면에 각각 광반사 금속을 설치하였다. 광 추출 효율은 20mA에서 n-GaN의 텍스쳐링에 의해 20% 증가되었고 ITO의 텍스쳐링에 의해 18% 증가되었다. 표면 처리가 않된 LED와 비교해서 n-GaN와 ITO를 함께 표면 텍스쳐링 했을때의 광 추출 효율은 20mA에서 32% 증가되었다.

• 대한화학회지
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• 제50권3호
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• pp.237-242
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• 2006

LED는 고휘도 청색 칩의 개발로 인해 단순표시소자로만 이용되던 것이 다양한 분야의 발광소자로 적용되기 시작하였다. 특히, 최근에 InGaN 칩과 황색 형광체(YAG:Ce3+)를 이용한 방법이 많이 연구되어지고 있다. 하지만 이 방법은 2 파장을 이용한 것으로 색연지수가 낮은 단점을 지니며, 황색의 YAG:Ce3+ 형광체 이외에 450~470 nm의 여기 영역에서 효율적으로 발광하는 형광체가 거의 없다. 따라서 본 연구에서는 장파장 영역의 여기 특징을 지닌 thiogallate 형광체의 합성을 시도하였다. 그 중에 가장 잘 알려진 SrGa2S4:Eu2+ 형광체의 모체를 변화시켜 Sr2Ga2S5:Eu2+ 형광체를 합성하였으며, 발광특성을 조사하였다. 그리고 무해성과 제조 공정의 단순화를 위하여, 황화물질과 5 % H2/95 % N2 혼합 기체를 CS2와 H2S 가스 대신에 사용하였다. 이렇게 합성되어진 형광체는 550 nm의 발광 중심을 가지는 황색 형광체로서 300~500 nm에 이르는 넓은 여기원을 통한 발광이 가능하다. 그리고 YAG:Ce3+ 형광체와 비교해 볼 때 강도 면에서 110 % 이상을 보이며, UV 영역의 여기적 특성을 이용해 UV LED에도 응용이 가능하다.

• 한국결정성장학회지
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• 제22권5호
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• pp.233-240
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• 2012

백색 발광다이오드(white light-emitting diodes)를 이용한 광소자는 소비전력이 상대적으로 작고, 안정적이며, 수은과 같은 유해 중금속을 포함하지 않기 때문에, 에너지 절약 및 친환경 산업측면에서 유망한 산업으로 급속히 발전하고 있다. 국내의 경우 LED 조명의 효율, 신뢰성, 연색성을 향상시키는데 필수 소재인 형광체의 기술 확보에 대한 관심이 높아지고 있다. 이러한 관점에서 기존의 YAG, TAG, silicate 계열 산화물 형광체 뿐만 아니라 고온특성이 우수한 산/질화물계 형광체 개발에 대한 관심이 높아지고 있다. 특히 산/질화물계 형광체 조성에서 $M_2Si_5N_8$ : $Eu^{2+}$, $MAlSiN_3$ : $Eu^{2+}$ M-SiON(M = Ca, Sr, Ba), ${\alpha}/{\beta}$-SiAlON : $Eu^{2+}$과 같은 재료는 440~460 nm 영역에서의 넓은 여기파장과 우수한 발광효율로 청색 LED 칩을 이용한 백색 LED에 넓게 사용되고 있다. 이 논문에서는 이러한 산/질화물계 형광체 조성의 결정학적, 광학적 특성 및 응용에 대해서 정리하였다. 또한 최근에 주목받고 있는 양자점(quantum dots) 형광체를 응용한 white LEDs의 개발동향에 대해서도 알아보도록 한다.

• 전기학회논문지
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• 제56권9호
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• pp.1638-1642
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• 2007

This paper investigated the destruction effect of the semiconductors by impact of high power electromagnetic wave. The experiments is employed as an open-ended waveguide to study the destruction effects on semiconductor using a 2.45 GHz 600 W Magnetron as a high power electromagnetic wave. The semiconductors are located at a distance of $31cm\sim40cm$ from the open-ended waveguide and are composed of a LED drive circuit for visual discernment. Also the chip condition of semiconductor is observed by SEM(Scanning Electron Microscope) analysis. The semiconductor are damaged by high power electromagnetic wave at about 860 V/m. The SEM analysis of the destructed devices showed onchipwire and bondwire destructions. Based on the result, semiconductor devices should have plan to protect the semiconductor devices form high power electromagnetic wave. And the database from this experiment provides the basis for future investigation.

• 한국정밀공학회지
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• 제16권2호통권95호
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• pp.74-81
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• 1999

The integrated chip of optical micro-encoder was fabricated and the feasibility as displacement measurement device was confirmed. The geometry of micro-encoder was designed to utilize the optical interference effect on the second order of diffracted beams. The hybrid-type micro-encoder consisted with light emitting diode, photodiode, polyimide wave-guide and micro-lens provides stable micro-encoding results for high speed displacements. The measurement shows the resolution of displacement of 1.00 +/- 0.02 ${\mu}m$ for the grating with scale pitch of 2.0${\mu}m$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.328-331
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• 2001

Color simulation on a portable colorimeter was performed to distinguish quantitatively a chromaticity coordinates on a color guide of a urine strips by using the spectral power distribution of chip LED, the spectral reflectance of printed objects, and the spectral sensitivity of photodiode. The CIE tristimulus values and chromaticity coordinates realized by a colorimeter were modified to be conformable with real color reactions. Experimental results showed a real color in comparison with those obtained by Colorimeter CM2C(Color Savvy).

• 분석과학
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• 제30권1호
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• pp.49-56
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• 2017

Here, we demonstrate surface functionalization of Au chips with 4-(carboxymethyl)aniline (CMA) and amine-terminated polyamidoamine (PAMAM) dendrimers for immobilization of antibodies on the Au surfaces. Use of the functionalization strategy led to high surface density of the immobilized antibodies on the Au chips. Specifically, we found that the functionalization of Au chips with CMA and amine-terminated $6^{th}$ generation PAMAM dendrimers allowed immobilization of immunoglobulin (IgG) antibodies with high surface density, which is 5 times higher than that obtained with Au surfaces functionalized with CMA and ethylenediamine.