• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.29 no.4
• /
• pp.1-10
• /
• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.06a
• /
• pp.273-274
• /
• 2009

현재 가로등의 93.3[%]를 차지하고 있는 나트륨램프는 색상이 적황색이며, 시력에 장애와 피로감을 주어 인체에 해로우므로 고효율 램프로 교체되고 있으며 백열전구는 전력을 많이 소모하고 잦은 고장으로 빈번한 대체와 유지보수를 필요로 하므로 LED를 선택하면, 유지보수 비용과 안전성, 에너지 효율성면에서 큰 강점을 갖는다. 본 연구에서는 에너지 효율이 높은 LED 가로등 제작을 위한 모듈을 제작하여, 열적, 광학적 분석을 하였다. 동작 150분 후, LED Module의 PCB기판 6 Point에서 Thermal Grease와 Thermal Pad의 처리에 의한 열적 변화를 측정하였으며, Thermal Grease 처리는 Thermal Pad 보다 평균 3 $[^{\circ}C]$ 정도 낮은 35 $[^{\circ}C]$결과를 얻었으며, 제작된 LED Module의 광학적평가의 결과는 10 [m] 높이에서 $20\times20\;[m^2]$ 면적에 조사된 조도의 최대,최소값은 10.9~0.6 [lx]이고, 주로 10~5 [lx] 값이 조도의 면적을 차지하였으며, 곡선은 옆으로 넓게 펼쳐진 곡선을 나타내었다.

• KIEAE Journal
• /
• v.14 no.6
• /
• pp.81-86
• /
• 2014

In recent years, many researchers have considered the building energy consumption reduction accordingly to deal with abnormal climate changes and greenhouse gas reduction. However, the lighting energy use ratio has increased in spite of the development of the high efficiency lighting device. Therefore, the study aims to produce the LED lighting applications for the effective lighting heat removal by using the heat characteristics of LED lighting and analyzing the heat removal effect. In order to increase radiant heat efficiency, the heat pipe and heat sink was attached on PCB as LED lighting applications. Experiment was conducted to verify the temperature and air velocity of inside duct: thermocouples, anemometer. The heat removal effect of LED lighting applications was measured by observing the temperature of the lighting applications and the change of air velocity in duct. The experiment shows that the temperature change in the duct according to air velocity was $0.9{\sim}5.8^{\circ}C$. It is also concluded that heat removal was calculated from 33 to 81W.

• Journal of the Korean Society of Fisheries and Ocean Technology
• /
• v.51 no.2
• /
• pp.163-170
• /
• 2015

Recently LED fish-attracting lamps have been more widely used in fisheries as low-cost and high-efficiency fishing gear, and development of long-life high-efficiency lamps is required through the design of LED packages to optimize heat resistance. This study developed an improved LED fish-attracting lamp with excellent heat performance, which was verified using a numerical model. Heat-resistance design factors such as the heat-radiation fin shape, PCB type, and LED chip count were investigated and optimized. Comparison with a commercial 180-W LED fishing lamp showed that the increase in initial temperature was 40% higher than that of the surrounding LED chip because of design errors in contact thermal resistance. The 250-W LED lamp developed in this study has a characteristic with thermal rising in linearly stable according to the heat source. In addition, luminance efficiency was improved by 20-65% by using flow-visualization simulation. A decrease of 45% in total power consumption with a fuel-cost reduction of over 55% can be expected when using these optimized heat release design factors.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.29 no.2
• /
• pp.1-7
• /
• 2015

The Light Emitting Diode(LED) lighting control system proposed in this thesis is made up of a sensor module, a microcontroller, Bluetooth wireless communication, LED Driver, and LED downlight. The sensor module, comprised of an infrared sensor, an illumination sensor, and a temperature sensor, was designed to one Printed Circuit board(PCB). The system is able to identify the environment information collected by the sensor, and make it possible to control lighting automatically and manually through sensors. In addition, depending on users' conditions, a color temperature can be controlled. CS-1000, a spectroradiometer, was employed to measure the changing values of a color temperature in 8 steps. According to a test, it was found that it was possible to change a color temperature from 3187K of Warm White LED to 5598K of Cool White LED. The Bluetooth based wireless communication technique makes it possible to control more lighting devices than other wireless communication techniques does.

• Journal of the Korea Convergence Society
• /
• v.11 no.7
• /
• pp.105-112
• /
• 2020

This paper presents an investigation into the development of a fabric electronics based smart bag for festival users of the 2029 generation with customizable tech flaps (music media control/ LED animated graphic functions) based on the application of traditional Korean patterns and goblin patterns in an electric circuit. The investigator took into consideration functional and design strategies to enable custom service according to users' tastes and situations. Based on these considerations, a customizable smart bag platform was proposed in a detachable module based on a computer embroidery machine. The study is significant in that it developed a product that is different from the old PCB smart products in hard form and proposed a new business model.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.10 no.5
• /
• pp.615-622
• /
• 2015

As the development of high efficiency and high flux density LEDs, the trend of illumination lamp industry transfers from conventional-lamps to the LED-lamps. For energy efficiencies, LED lamps are superior to the conventional lamps, but they have heat problems. Especially, the heat problems are severe for the high luminance lamps. They degrade the soldering point of the metal PCB, and shorten the life cycle of LEDs. So, the solution of the heat sinking is very important to develop high luminance LED lamps. This study suggested a new method to solve the heat problems for high luminance LED lamps, and developed a LED lamp which has 1200W power. In this study, a water jacket is installed to the LED lamp, and the cooing water is circulated by a water pump.

• Korean Journal of Optics and Photonics
• /
• v.24 no.6
• /
• pp.342-346
• /
• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• Journal of Applied Reliability
• /
• v.16 no.4
• /
• pp.331-337
• /
• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.480-481
• /
• 2012

LED (Light Emitting Diode)는 친환경적이며 고수명 등의 여러 장점을 가지고 있어서 액정디스플레이의 광원으로 널리 사용되고 있다. 그러나 LED 제품을 제조하기 위해서는 칩, 패키지, 모듈, 시스템으로 구성된 4단계의 복잡한 제조공정을 거쳐야 하므로 가격이 높은 단점이 있다. 이를 개선하기 위해서 패키지, 모듈, 시스템의 3단계의 공정을 하나로 통합한 hybrid LED package(HLP) 개념이 제시되었다. HLP는 LED chip을 PCB에 직접 실장한 뒤 초정밀 가공 및 성형 기술을 활용하여 일체형 광학패턴을 인가함으로써 공정을 단순화하면서도 광효율을 향상시킬 수 있다. 이에 본 연구에서는 다구찌 실험계획법을 사용하여 디스플레이에서 중요시되는 휘도를 높일 수 있는 일체형광학패턴 형상 최적화를 실시하였으며, 최적화된 일체형 광학패턴을 제조하기 위한 초정밀 가공 및 성형기술을 개발하였다. 최적화 결과 높이 25um, 꼭지각 90도의 음각형태의 사각피라미드 패턴이 최적형상으로 결정되었으며, 패턴이 없을 때와 비교하여 휘도가 약 32.3% 높아지는 것으로 나타났다. 이러한 일체형 광학패턴을 제품으로 구현하기 위하여 초정밀 절삭기술을 활용하여 마스터 금형을 제작하였다. 최종적으로 사출성형을 통해 일체형 광학패턴을 제작하게 되는데 이때 사출기 내부 공기흐름 및 진공도를 최적화함으로써 패턴 내부에 불필요한 기포가 발생하지 않도록 하는데 성공하였다. 이를 통해 생산성이 높은 사출성형으로 HLP 제품을 양산할 수 있는 가능성을 확인하였고, 추후에는 실제 제품을 제작하는 연구를 수행할 예정이다.