• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.9 no.6
• /
• pp.1565-1568
• /
• 2008

This thesis is about the design of heat sink which is the obstacle in commercializing LED light fixture. It suggests a way of solving the problem by the analysis on heat radiation of LED light fixture using CF-design. As a result of the analysis, the difference of simulation value and the measured temperature of proto-type was derived as less than 6[$^{\circ}C$]. Even the results approaching the target value of actual product could be obtained with the given factors well applied.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.11 no.4
• /
• pp.1203-1209
• /
• 2010

LED lights as a newly-growing industry are highly energy-efficient and have drawn lots of attention due to higher illuminance and longer life compared to other light sources. In this study, MR16 lights with one high-power LED were considered for the replacement of the previous halogen lights or LED lamps with many LEDs. Thus, fundamental experiments of LED on a MCPCB, 3-dimensional numerical analysis for heatsink design and performance tests of the prototype lights have been done and the MR16 LED lights have been successfully developed.

• Proceedings of the KIEE Conference
• /
• 2009.07a
• /
• pp.1605_1606
• /
• 2009

본 논문은 LED조명기구 방열설계의 열해석에 관한 것으로서 메탈 PCB에 Chip LED를 배치하여 COMSOL Multiphysics로 시뮬레이션한 결과 LED와 PCB의 경계면 온도는 약 $80^{\circ}C$이며, PCB의 바닥면까지는 약 $50^{\circ}C$까지 변화함을 검증 하였으며, 결과적으로 실 제작의 근사치에 가까운 방열설계가 가능함이 확인되었다.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.13 no.1
• /
• pp.27-32
• /
• 2012

Since LED lights have advantages of long life, low-carbon and high efficiency, they have been widely used as household lamps, automotive lighting, traffic lights etc. In this study, MCPCB LED lamps for automotive LED headlights were manufactured and the performance of heat release was optimized. The developed LED headlight satisfied the target thermal performance with heat pipes and fans, and it was also shown that fan life can be prolonged three times by fan on-off control.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
• /
• 2018.11a
• /
• pp.133-135
• /
• 2018

LED 기술의 발달은 LED를 광원으로 하는 기존의 등명기의 광달거리를 현저히 증가 시키게 되었다. 물론 이를 위해서는 발달된 LED광원 뿐만 아니라 이를 집광 시킬 수 있는 렌즈의 개발, 열에 취약한 LED의 방열을 해결 할 수 있는 방열 구조의 개발 등, 전체적인 기술 개발을 동반해야한 한다. 이를 적용한 고광도 등명기는 기존의 배후광이 심한 지역 및 육지초인 표지에 사용할 수 있으며, 이러한 제품의 개발은 국내 제품의 기술력 및 성능을 향상 시키고 이를 바탕으로 해외 시장에 진출할 수 있는 계기를 마련 할 수 있다.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.14 no.6
• /
• pp.129-135
• /
• 2015

This paper shows significant methods that improve the lifespan of LED modules as well as efficiently using an aluminum heat-sink for LED module in high power. It proposes a method that raises stability and lifespan to protect LED modules and the power unit when the LED module has been used for a long hours at high temperatures. During the research, we applied a method of pulse-width modulation (PWM) in order to prevent the phenomenon that the entire power of a system is turned off and the lifespan is reduced when the LED nodule reacts to the high temperatures. To protect the LED module and SMPS based on high efficiency, a temperature sensor is attached underneath the circuit board and the sensor measures the temperature of circuit board when the LED module is powered on. The electrical power connected to SMPS is controlled by PWM when the temperature of the LED module reaches a particular temperature.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.165.1-165.1
• /
• 2016

표면활성화 접합은 이종 소재의 표면을 제어하여 직접 접합하는 기술이다. 본 연구에서는 표면활성화 접합을 이용하여 고 방열특성의 LED용 히트스프레더(heat spreader)를 제작하기 위하여 $Al-Al_2O_3$ 복합소재를 제조하였다. LED 제품의 히트스프레더는 LED에서 발생하는 열을 한 곳으로 집중하는 것을 막아 열을 분산하는 금속판을 의미한다. 최근의 LED 제품은 고출력화에 의한 발열량의 급증으로 MCL(Metal Clad Laminate)를 이용하여 LED 칩에서 발생된 열을 외부로 배출하는 모듈구조를 나타내는 경우가 대다수이다. LED에서 열이 증가하게 되면 LED의 효율이 감소하고, 수명이 줄어드는 현상을 보이기 때문에 방열특성은 매우 중요하다. 따라서 고출력화되어 LED 칩에서 발생되는 열을 제어하는 기술이 이슈화 되고 있다. 기존의 히트스프레더 구조는 통상적으로 Al/절연층(폴리머)/Al으로 폴리머의 열전도율이 1W/mk로 고출력화에 의해 급증하는 LED의 발열량을 충분히 해소시키기 어렵다. 본 연구에서는 급증하는 LED의 방열량을 해소시키기 위해서 기존의 Al/폴리머/Al의 구조를 $Al/Al_2O_3/Al$의 구조로 개발하기 위해서 HV-SCDB 기술을 이용한 $Al-Al_2O_3$ 복합소재 제조 및 접합특성에 관하여 연구하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.4
• /
• pp.149-154
• /
• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.38C no.8
• /
• pp.725-732
• /
• 2013

Recently, various applications for LED lightings are growing continuously due to their better performances such as low power consumption, longer life time, operation speed, controllability, high quality color rendering, and sustainability. However, in developing the high-powered LEDs illumination system, heat-sink problem is one of the important obstacle. In this paper, a heat-sink design with multi-layered structure for high-powered LEDs is proposed, which is composed of metal core PCB, heat-pipes, heat-sink plates, and fans. And also, in this paper, a design for LED controls using DMX512 protocols through RS-485 communications is proposed, which is considered as de facto international standard in LEDs illumination control and is widely used in landscape lighting and stage lighting. In this paper, LED control and its application techniques are introduced and the method of wireless remote control for main controller is proposed.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.9 no.12
• /
• pp.1435-1440
• /
• 2014

This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.