1 |
A. Christensen and S. Graham, "Thermal Effects in Packaging High Power Light Emitting Diode Arrays," Applied Thermal Engineering, Vol. 29, pp. 364-371, 2009.
DOI
ScienceOn
|
2 |
X. Lu, T. Hua, M. Liu, and Y. Cheng, "Thermal Analysis of Loop Heat Pipe Used for High-power LED," Thermochimica Acta, Vol. 493, pp. 25-29, 2009.
DOI
ScienceOn
|
3 |
S. Liu, J. Yang, Z Gan and X. Luo, "Structural Optimization of a Microjet Based Cooling System for High Power LEDs," International Journal of Thermal Sciences, Vol. 47, pp. 1086-095, 2008.
DOI
|
4 |
어익수, "COMSOL을 이용한 20W급 LED램프의 방열 해석," 한국산학기술학회논문지, 제10권, 제7호, pp.1484-1488, 7월, 2009.
과학기술학회마을
DOI
|
5 |
이영림, 황순호, 전의식, "대용량 알루미늄 브레이징 히트싱크 개발에 관한 연구," 산학기술학회논문지, 제10권, 제7호, pp. 1459-1464, 7월, 2009.
과학기술학회마을
DOI
|
6 |
Catia, V5R17, Dassault Systems, 2006.
|
7 |
Fluent, Version 6.1, Fluent, Inc., Lebanon, NH 2005.
|
8 |
Cree, Inc, http://www.cree.com.
|
9 |
J. Hu, L. Yang and M. W. Shin, "Electrical, Optical, and Thermal Degradation of High Power GaN/InGaN Light-Emitting Diodes", Journal of Physics D: Applied Physics, Vol. 41, no.3, 035107, 2008.
DOI
|
10 |
N. Narendran and Y. Gu, "Life of LED-based White Light Sources, Journal of Display Technology, Vol. 1, No. 1, pp. 167-70, 2005.
DOI
|