• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1447-1450
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• 2006

The high speed and sensitivity array test system has been developed and utilized for massproduction of advanced LTPS displays including SOG and OLED. It realizes fast enough TACT enabling 100% inspection with better than 1fF sensitivity. The result of actual measurement shows its superior TACT and sensitivity, and also shows MURA detection of OLED panel.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.1353-1356
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• 2004

In recent year, OLED(organic light emitted display) is used as the next generation device of FPD. OLED have been replacing the flat panel display device such as LCD, STN-LCD and TFT because this device is more efficient, economic and simple than those FPD devices, and this need not backlight system for visualization. The performance and efficiency of OLED is related with surface defect of ITO coated glass substrate. The typical surface defect of glass substrate is nonuniformity and bad surface roughness. ITO coated glass substrate is destroied for inspection about surface roughness and non-uniformity. Generally detection of the defects in the surface for ITO coated glass substrate is dependent on operator's experience. In this research, relationship between working parameter and surface non-uniformity is studied using regression analysis.

• Journal of Korea Multimedia Society
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• v.13 no.8
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• pp.1115-1127
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• 2010

In order to increase the productivity in manufacturing TFT-LCD(thin film transistor-liquid crystal display), it is essential to classify defects that occur during the production and make an appropriate decision on whether the product with defects is scrapped or not. The decision mainly depends on classifying the defects accurately. In this paper, we present an effective classification method for film defects acquired in the panel production line by analyzing the intensity distribution and shape feature of the defects. We first generate a binary image for each defect by separating defect regions from background (non-defect) regions. Then, we extract various features from the defect regions such as the linearity of the defect, the intensity distribution, and the shape characteristics considering intensity, and construct a referential image database that stores those feature values. Finally, we determine the type of a defect by matching a defect image with a referential image in the database through the matching cost function between the two images. To verify the effectiveness of our method, we conducted a classification experiment using defect images acquired from real TFT-LCD production lines. Experimental results show that our method has achieved highly effective classification enough to be used in the production line.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.8
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• pp.761-771
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• 2009

Detecting defects on FPD (Flat Panel Display) color filter before the full panel is made is important to reduce the manufacturing cost. Among many types of defects, the low contrast blemish such as Suzi Mura is difficult to detect using standard CCD cameras. Even skilled inspectors in the inspection line can hardly identify such defects using bare eyes. To overcome this difficulty, point spectrometer has been used to analyze the spectrum to differentiate such defects from normal color filters. However, scanning ever increasing-size color filters by a point spectrometer takes too long time to be used in real production line. We propose a system using a spectral camera which can be viewed as a line scan camera composed of an array of point spectrometers. Three types of lighting system that exhibit different illumination spectrums are devised together with a calibration method of the proposed spectral camera system. To visualize the defect areas, various processing algorithms to identify and to enhance the small differences in spectrum between defective and normal areas are developed. Experiments shows 85% successful visualization. of real samples using the proposed system.

• Journal of Korea Society of Industrial Information Systems
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• v.12 no.3
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• pp.116-123
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• 2007

Despite the number of backlight manufacturer is increased as the market of flat panel display equipments and related development devices is enlarged, the inspection based on the human eye is still used in many backlight production lines. The defects such as particle, spot and scratch on the light emitting surface of the backlight prevent the LCD device from displaying the colors correctly. From that manual inspection it is difficult to maintain the quality of backlight consistently because the accuracy and the speed of the inspection may change with the physical condition of the operater. In this paper we studied on the development of automatic backlight surface defect inspection system. For this, we made up of the computer vision system and we developed the main program with various user interfaces to operate the inspection system effectively. And we developed the image processing module to extract the defect information. Furthermore, we presented the labeling process to reconstruct defect regions using the labeling table and the defect index. From the experimental results, we found that our system can detect all defect regions identified from human eye and it is sufficient to substitute for the conventional surface inspection.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.336-341
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• 2008

Recently, research on a flat panel display(FPD) has focused on organic light-emitting display(OLED) which has wide angle of view, high contrast ratio and low power consumption. ITO(Indium-Tin-Oxide) films are the most widely used material as a transparent electrode of OLED and also in many other display devices like LCD or PDP. The performance and efficiency of OLED is related to the surface condition of ITO coated glass substrate. The typical surface defect of glass substrate is measured for electric characteristics and physical condition for transmittance and roughness. Since ITO coated glass substrate can be destroyed for inspection about surface roughness, sheet resistance, film thickness and transmittance, precise fabrication condition should be made based on the estimated relationship. In this paper, ITO films were prepared on the commercial glass substrate by the Ion-Plating method changing the partial pressure of gas(Ar, 02) and the chamber temperature between $200^{\circ}C$ and $300^{\circ}C$. The characteristics of films were examined by the 4-point probe, supersonic thickness measurement, transmittance measurement and AFM. We estimated the relationship between processing parameters(Ar gas, O2 gas, Temperature) and properties of ITO films (Sheet Resistance, Film Thickness, Transmittance, Surface Roughness).

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.519-522
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• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.