• Title/Summary/Keyword: LCD module

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Biaxial integrated optical film for VA mode LCD's made from in-situ photopolymerised reactive mesogens.

  • Kim, Kyeong-Hyeon;Lyu, Jae-Jin;Chung, Dong-Hoon;Verrall, M.;Slaney, K.;Perrett, T.;Parri, O.;Lee, Seung-Eun;Lee, Hee-Kyu
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.773-775
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    • 2004
  • For high end, large area displays, all current LC modes require some degree of optical compensation to improve the front of screen viewing experience. Currently most optical films are laminated to the outside of the LCD cell, between the glass and polariser. In this paper we wish to show how it is possible to integrate the compensating optical film within a VA mode LCD cell. The paper will describe the process of making the biaxial film through the process of in-situ photopolymerisation of an aligned film of reactive mesogens in the cholesteric phase using polarised UV light. The film can be made on the colour filter array side of the LCD panel. In addition the process of fabricating a VA mode LCD containing this film will be described and the performance of this module will be presented

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TFT LCD 용 Power Inductor Full Automation Winding/Welding System 개발

  • 이우영;진경복;김경수
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2004.05a
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    • pp.154-158
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    • 2004
  • Power inductor is usually used in the field of the power circuit of a cellular phone, TFT LCD module etc.. This paper presents the development process of Power Inductor Full Automation Winding/Welding System for TFT LCD. This process, the process algorithm, high precision welding current control, design of welding head, high speed, high precision feeding mechanism, and user interface process control program technologies are included.

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A TFT-LCD Module Assembly Scheduler (TFT-LCD 모듈 조립 공정 스케줄러)

  • 김시원;정봉주
    • Proceedings of the Korean Operations and Management Science Society Conference
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    • 2000.04a
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    • pp.94-98
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    • 2000
  • 본 논문은 TFT-LCD 모듈 조립 공정에서의 스케줄링 시스템을 제안한다. TFT-LCD 모듈 조립 공정은 선행 공정인 액정 공정에서 넘어오는 LCD 판넬과 기타 부품들을 조립하여 최종 완제품을 만드는 공정이다. 본 연구에서 다루고 있는 문제는 주문량으로부터 구해지는 일일 생산 계획량이 주어졌을 때 각 라인에서 생산되어질 제품을 배정하는 문제이다. 본 논문의 목적은 주어진 실제 공정 환경에서 일일 생산 계획량을 최대로 만족하기 위한 스케줄링 휴리스틱을 개발하는 것이다. 이를 위해 relaxed LP 모형을 제시하였고 제시된 LP 모형을 이용한 알고리즘을 개발하였다. 제안된 알고리즘은 제품 우선 배정 조건, 현 보유 자재량과 대략적인 라인의 생산 능력을 고려한 LP 프로시져 부분과 제품 간 셋업 시간을 고려한 설비 배정 휴리스틱의 두 부분으로 구분된다. 알고리즘의 성능 검사를 위해 실제 TFT-LCD 모듈 공정에서의 데이터를 이용하여 과거에 실제 이루어진 생산 결과와 비교를 하였으며 제안된 알고리즘의 효율성을 실험 결과를 통해 보였다.

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A Study on the Spot Inspection for LCD Modules (LCD모듈의 얼룩검사에 관한 연구)

  • Lee, Jae-Hyeok
    • Proceedings of the KIEE Conference
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    • 2006.10c
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    • pp.422-424
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    • 2006
  • This paper suggests an automatic spot-inspection algorithm for LCD modules. Usually, LCD module testing is classified by two categories. One is for uniform pattern testing and the other is Non-uniform testing. The uniform pattern testing is well defined and also fully automated in the factory. However non-uniform pattern testing is not defined well yet, so non-uniform testing is conducted by human operators. In this paper a spot-pattern, which is one of non-uniform pattern, inspection algorithms are proposed. The performance of the proposed algorithm is tested by extensive simulations using artificial slot-patterns and real ones in the LCD modules.

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The Influence of Dry Etching Process by Charged Static Electricity on LCD Glass

  • Kim, Song-Kwan;Yun, Hae-Sang;Hong, Mun-Pyo;Park, Sun-Woo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.77-78
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    • 2000
  • We verified the charged static electricity on LCD glass influences upon the etching uniformity of dry etching process by plasma. In the TFT-LCD manufacturing process, we mainly paid attention to eliminate the static electricity for TFT reliability. The static electricity caused the serious ununiformity of etching surface profile and etching rate in the dry etch process. Through our experiment on the made static electricity from -200V to -1000V, it was confirmed that the static electricity on LCD glass caused the etching rate variation of $1.5%{\sim}15%$. We recommend the etching process equipment for LCD manufacturing have to establish the soft X-ray exposure module system for eliminating the static electricity inside the loading and unloading chamber.

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Emulated Vision Tester for Automatic Functional Inspection of LCD Drive Module PCB (LCD 구동 모듈 PCB의 자동 기능 검사를 위한 Emulated Vision Tester)

  • Joo, Young-Bok;Han, Chan-Ho;Park, Kil-Houm;Huh, Kyung-Moo
    • Proceedings of the KIEE Conference
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    • 2008.10b
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    • pp.211-212
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    • 2008
  • 본 논문에서는 LCD 구동 모들 PCB의 기능 검사를 위한 자동 검사시스템인 EVT(Emulated Vision Tester)를 제안하고 구현하였다. 기존의 대표적인 자동검사 방법으로는 전기적 검사나 영상기반 검사방식이 있으나 전기적 검사만으로는 Timing이 주요한 변수가 되는 LED 장비에서는 검출할 수 없는 구동불량이 존재하며 영상기반 검사는 영상획득에 일관성이 결여되거나 Gray Scale의 구분이 불명확하며 검출결과의 재현성이 떨어진다. EVT 시스템은 Pattern Generator에서 인가된 입력 패턴 신호라 구동모듈을 통한 후 출력되는 디지털 신호를 직접 비교하여 패턴을 검사하고 아날로그 신호 (전압, 저항, 파형)의 이상 여부도 신속 정확하게 검사할 수 있는 H/W적인 방법이다. 높은 검출 신뢰도와 빠른 처리 속도 뿐만 아니라 간결한 시스템 구성으로 원가절감 실현 등 많은 장점을 가진다.

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LCD Driver IC Assembly Technologies & Status

  • Shen, Geng-shin
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.09a
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    • pp.21-30
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    • 2002
  • According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

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Fast Response Driving of TFT LCD for Motion Picture

  • Choi, Yu-Jin;Mo, Soon-Hee;Bae, Young-Min;Lim, Young-Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.449-451
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    • 2002
  • We reported the algorithm of driving scheme that enhances moving picture property by improving gray-to-gray response time. Here, we report result of simulation for estimation of driving voltage to reduce response time, and experimental result. We investigated optimization of algorithm so that minimum size of LUT can support to reducing the gray-to-gray response time within 1 frame period, and with single algorithm it is possible to apply the algorithm to various kinds of LC material. So in our system there is no external EEPROM.

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Optimized Inspection Strategies for Cell and Module Inspection

  • Pye, Tom
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.328-332
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    • 2006
  • Inspection in the back end of the LCD is moving from human based to automated. This is driven by the desire to eliminate human operators and the need to have repeatable, reliable data for fab optimization. The number of systems required varies by the fab module location, product mix, and repair capability.

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Implementation of High Speed Serial interface for testing LCD module by using the MDDI (MDDI방식 LCD모듈의 테스트하기 위한 고속직렬통신 인터페이스 구현)

  • Kim, Sang-Mok;Kang, Chang-Hun;Park, Jong-Sik
    • Proceedings of the KIEE Conference
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    • 2005.05a
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    • pp.212-214
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    • 2005
  • The MDDI(Mobile Digital Display Interface) standard is an optimized high-speed serial interconnection technology developed by Qualcomm and supports the VESA(Video Electronics Standard Association). It increases reliability and reduces power consumption in clamshell phones by decreasing the number of wires to interconnect with the LCD display. In this paper, the MDDI host is designed using VHDL and implemented on FPGA. We demonstrates that the MDDI host is connected with S3CA460 LCD controller is designed by Samsung Electronics Co. and display a steal image to the LCD.

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