• Title/Summary/Keyword: LCD Fabrication

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Characteristics of Amorphous Si Films Fabricated by Mesh-type PECVD and Their Crystallization Behavior Using Excimer Laser (Mesh-type PECVD 방법으로 제조된 비정질 Si박막의 특성 및 레이저 결정화)

  • Han Sang-Yong;Choi Jae-Sik;Kim Yong-Su;Park Sung-Gye;Ro Jae-Sang;Kim Hyoung-June
    • Journal of the Korean Electrochemical Society
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    • v.3 no.1
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    • pp.19-24
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    • 2000
  • It is increasingly necessary to use poly-Si n's as high resolution and integration of Tn for LCD. Excimer Laser Crystallization (ELC) of a-Si is mainly used as a low temperature process. But the ELC method for the fabrication of poly-Si has the eruption problems associated with hydrogen in the a-Si film. So we need a dehydro-genation process additionally. Hydrogen in a-Si film can degrade the quality of poly-Si film and electrical properties of device due to the hydrogen eruption and voids which occur during the excimer laser annealing. In this study, we propose mesh-type PECVD as the a-Si film deposition method for achieving the low concentration hydrogen. Mesh-type PECVD was found to reduce the hydrogen content substantially. We could obtain a as-deposited a-Si film with hydrogen contents less than $1\%$ at $300^{\circ}C$. We also investigated the behavior by XeCl excimer laser annealing of a-Si fabricated by mesh-type PECVB. As a result, we were able to confirm the broad process window in contrast to the narrow process range typically obtained in ELC. Hydrogen eruption was not observed in poly-Si films after ELC These results suggests that mesh-type PECVD is a viable method to achieve the low hydrogen content a-Si and improve the process windows for ELC.

Fabrication and Characterization of Portable Electronic Nose System for Identification of CO/HC Gases (CO/HC 가스 인식을 위한 소형 전자코 시스템의 제작 및 특성)

  • Hong, Hyung-Ki;Kwon, Chul-Han;Yun, Dong-Hyun;Kim, Seung-Ryeol;Lee, Kyu-Chung;Kim, In-Soo;Sung, Yung-Kwon
    • Journal of Sensor Science and Technology
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    • v.6 no.6
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    • pp.476-482
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    • 1997
  • A portable electronic nose system has been fabricated and characterized using an oxide semiconductor gas sensor array and pattern recognition techniques such as principal component analysis and back-propagation artificial neural network. The sensor array consists of six thick-film gas sensors whose sensing layers are Pd-doped $WO_{3}$, Pt-doped $SnO_{2}$, $TiO_{2}-Sb_{2}O_{5}-Pd$-doped $SnO_{2}$, $TiO_{2}-Sb_{2}O_{5}-Pd$-doped $SnO_{2}$ + Pd coated layer, $Al_{2}O_{3}$-doped ZnO and $PdCl_{2}$-doped $SnO_{2}$. The portable electronic nose system consists of an 16bit Intel 80c196kc as CPU, an EPROM for storing system main program, an EEPROM for containing optimized connection weights of artificial neural network, an LCD for displaying gas concentrations. As an application the system has been used to identify 26 carbon monoxide/hydrocarbon (CO/HC) car exhausting gases in the concentration range of CO 0%/HC 0 ppm to CO 7.6%/HC 400 ppm and the identification has been successfully demonstrated.

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A Study on Etching of Si3N4 Thin Film and the Exhausted Gas Using C3F6 Gas for LCD Process (LCD 공정용 C3F6 가스를 이용한 Si3N4 박막 식각공정 및 배출가스에 관한 연구)

  • Jeon, S.C.;Kong, D.Y.;Pyo, D.S.;Choi, H.Y.;Cho, C.S.;Kim, B.H.;Lee, J.H.
    • Journal of the Korean Vacuum Society
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    • v.21 no.4
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    • pp.199-204
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    • 2012
  • $SF_6$ gas is widely used for dry etching process of semiconductor and display fabrication process. But $SF_6$ gas is considered for typical greenhouse gas for global warming. So it is necessary to research relating to $SF_6$ alternatives reducing greenhouse effect in semiconductor and display. $C_3F_6$ gas is one of the promising candidates for it. We studied about etch characteristics by performing Reactive Ion Etching process of dry etching and reduced gas element exhausted on etching process using absorbent Zeolite 5A. $Si_3N_4$ thin film was deposited to 500 nm with Plasma Enhanced Chemical Vapor Deposition and we performed Reactive Ion Etching process after patterning through photolithography process. It was observed that the etch rate and the etched surface of $Si_3N_4$ thin film with Scanning Electron Microscope pictures. And we measured and compared the exhausted gas before and after the absorbent using Gas Chromatograph-Mass Spectrophotometry.

Self-aligned Offset Gated Poly-Si TFTs by Employing a Photo Resistor Reflow Process (Photo Resistor Reflow 방법을 이용한 오프셋 마스크를 이용하지 않는 새로운 자기 정합 폴리 실리콘 박막 트랜지스터)

  • Park, Cheol-Min;Min, Byung-Hyuk;Han, Min-Koo
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1085-1087
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    • 1995
  • A large leakage current may be one of the critical issues for poly-silicon thin film transistors(poly-Si TFTs) for LCD applications. In order to reduce the leakage current of poly-Si TFTs, several offset gated structures have been reported. However, those devices, where the offset length in the source region is not same as that in the drain region, exhibit the asymmetric electrical performances such as the threshold voltage shift and the variation of the subthreshold slope. The different offset length is caused by the additional mask step for the conventional offset structures. Also the self-aligned implantation may not be applicable due to the mis-alignment problem. In this paper, we propose a new fabrication method for poly-Si TFTs with a self-aligned offset gated structure by employing a photo resistor reflow process. Compared with the conventional poly-Si TFTs, the device is consist of two gate electrodes, of which one is the entitled main gate where the gate bias is employed and the other is the entitled subgate which is separate from both sides of the main gate. The poly-Si channel layer below the offset oxide is protected from the injected ion impurities for the source/drain implantation and acts as an offset region of the proposed device. The key feature of our new device is the offset lesion due to the offset oxide. Our experimental results show that the offset region, due to the photo resistor reflow process, has been successfully obtained in order to fabricate the offset gated poly-Si TFTs. The advantages of the proposed device are that the offset length in the source region is the same as that in the drain region because of the self-aligned implantation and the proposed device does not require any additional mask process step.

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Fabrication of ITO Thin Film by Sol-Gel Method (Sol-Gel 법을 이용한 ITO박막의 제조)

  • Kim Gie-Hong;Lee Jae-Ho;Kim Young-Hwan
    • Journal of the Korean Electrochemical Society
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    • v.3 no.1
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    • pp.11-14
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    • 2000
  • Transparent conducting ITO thin films have been studied and developed for the solar cell substrate or LCD substrate. ITO thin film has been mostly fabricated by high cost sputtering method. In this research, sol-gel method is applied to fabricate ITO thin film at lower cost. The research is focused on the establishment of process condition and development of precursor. Organic sol was made of indium tri-isopropoxide dissolved in ethylene glycol monoethyl ether. The hydrolysis was controled by addition of acetyl acetone. Tin(IV) chloride was added as dopant. Inorganic sol was made of indium acetate dissolve din normal propanol. Spin coating technique was applied to coat ITO on borosilicate glass. The resistivity of ITO thin film was approximately $0.01\Omega{\cdot}cm$ and the transmittance is higher than $90\%$ in a visible range.

Mechanism of Micro-V Grooving with Single Crystal Diamond Tool (단결정 다이어몬드 공구를 이용한 Micro-V 홈 가공기구)

  • Park D.S.;Seo T.I.;Kim J.K.;Seong E.J.;Han J.Y.;Lee E.S.;Cho M.W.;Choi D.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.1223-1227
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    • 2005
  • Fine microgroove is the key component to fabricate micro-grating, micro-grating lens and so on. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. This study deals with the creation of ultra-precision micro grooves using non-rotational diamond tool and CNC machining center. The shaping type machining method proposed in the study allows to produce V-shaped grooves of $40\mu{m}$ in depth with enough dimensional accuracy and surface. For the analysis of machining characteristics in micro V-grooving, three components of cutting forces and AE signal are measured and processed. Experimental results showed that large amplitude of cutting forces and AE appeared at the beginning of every cutting path, and cutting forces had a linear relation with the cross-sectional area of uncut chip thickness. From the results of this study, proposed micro V-grooving technique could be successfully applied to forming the precise optical parts like prism patterns on light guide panel of TFT-LCD.

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Effect of Ion Mass Doping on Metal-Induced Lateral Crystallization (이온 질량 주입이 금속 유도 측면 결정화에 미치는 영향)

  • Kim, Tae-Gyeong;Kim, Gi-Beom;Yun, Yeo-Geon;Kim, Chang-Hun;Lee, Byeong-Il;Ju, Seung-Gi
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.37 no.4
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    • pp.25-30
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    • 2000
  • Ion mass doping method has been implemented for the fabrication of large area electronic devices such as TFT-LCD. In this work, the effect of ion mass doping on the velocity and the behavior of MILC was investigated. When amorphous silicon was either doped or bombarded by accelerated ions, MILC velocity was reduced by over 50% and the front edge of MILC became coarse. In order to analyze the dependence of silicon film's properties on ion mass doping, ultraviolet reflectance and sulfate roughness were investigated. Both the velocity and the behavior of MILC were found to be related with the increase of surface roughness by ion bombardment.

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Selective Removal of Thin Film on Glass Using Femtosecond Laser (펨토초 레이저 응용 선택적 어블레이션 연구)

  • Yu, J.Y.;Cho, S.H.;Park, J.K.;Yoon, J.W.;Whang, K.R.;Sugioka, K.;Hong, J.W.;Heo, W.R.;Boehme, D.;Park, J.H.;Zander, S.
    • Laser Solutions
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    • v.14 no.2
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    • pp.17-23
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    • 2011
  • Active thin films are ubiquitous in the manufacture of all forms of flat panel display (FPD). One of the most widely employed thin films is indium tin oxide (ITO) and metal films used electrically conductive materials in display industries. ITO is widely used for fabrication of LCD, OLED device, and many kinds of optical applications because of transparency in visible range and its high conductivity and metal films are also widely employed as electrodes in various electric and display industries. It is important that removing specific area of layer, such as ITO or metal film on substrate, to fabricate and repair electrode in display industries. In this work, we demonstrate efficient selective ablation process to ITO and aluminum film on glass using a femtosecond laser (${\lambda}p=1025nm$) respectively. The femtosecond laser with wavelength of 1025nm, pulse duration of 400fs, and the repetition rate of 100kHz was used for selectively removing ITO and Al on glass in the air. We can successfully remove the ITO and Al films with various pulse energies using a femtosecond laser.

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Fabrication and Test of a $HgI_2$ Gamma Ray Detector (감마선 검출용 $HgI_2$ 소자 제작 및 특성 평가)

  • Choi, Myung-Jin;Lee, Hong-Kyu;Kang, Young-Il;Lim, Ho-Jin;Choi, Seung-Ki
    • Journal of Radiation Protection and Research
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    • v.16 no.2
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    • pp.1-6
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    • 1991
  • The $HgI_2$ single crystal which can be used for the ${\gamma}-ray$ detector at room temperature was grown by Temperature Oscillation Method. The low temperature photoluminescence, specific resistivity and trap concentration of $HgI_2$ single crystal were investigated. Three main luminescence bands were observed at 2.30eV, 2.20eV and 2.00eV at 20K, related to the excitons, I-vacancies and impurities, respectively. The specific resistivity and trap concentration of $HgI_2$ single crystal were $10^{11}{\Omega}\;cm\;and\;1.8{\times}10^{14}/cm^3$ at room temperature, respectively. Also the radiation detecting system was deviced by $HgI_2$ ${\gamma}-ray$ detector, one chip microprocessor, LCD module and personal computer. The prepared $HgI_2$ ${\gamma}-ray$ detector showed a good linearity of ${\gamma}-radiation$ dose for standard ${\gamma}-ray$.

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Fabrication of porous titanium oxide-manganese oxide ceramics with enhanced anti-static and mechanical properties (우수한 대전방지 및 기계적 성질을 가지는 다공성 산화티탄-산화망간 세라믹스 제조)

  • Yu, Dongsu;Hwang, Kwang-Taek;Kim, Jong-Young;Jung, Jong-Yeol;Baik, Seung-Woo;Shim, Wooyoung
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.28 no.6
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    • pp.263-270
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    • 2018
  • Recently, porous ceramic materials with anti-static performance are urgently needed for semiconductor and OLED/LCD display manufacturing industry. In this work, we fabricated porous titanium manganese oxide ceramics having the surface resistivity of $10^8-10^{10}$ ohm and enhanced mechanical strength by partial sintering method using nanosized titanium oxide. By addition of nano-sized titanium oxide in the matrix, neck formation between grains was strengthened, which remarkably increased flexural strength up to 170 MPa (@porosity: 15 %), 110 MPa (@porosity: 31 %), compared to 80 MPa (@porosity: 26 %) for pristine titanium manganese oxide ceramics. We evaluated the performances of our ceramics as air-floating module for OLED flexible display manufacturing devices.