• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.149-156
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• 2007

Non-contact transportation of the large-sized glass plate using air-cushion is considered for sputtering system of LCD panel. The Argon gas from second gas injection holes is injected to levitate and transport the glass plate. Low maximum pressure and uniform pressure distribution on the bottom surface of the glass plate must be maintained for stable levitation and transportation of the glass plate. Therefore, the analysis of fluid flow between the glass plate and the air-pad is numerically performed for varying space between the injection holes in this study. The pressure uniformity on the bottom surface of the glass plate is evaluated for overall glass plate. The distance between the injection holes must be designed below 90 mm for obtaining the low maximum pressure and uniform pressure distribution.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.269-272
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• 2006

Surface contacts between mold and target should be in parallel for the imprinting mechanism. However, the size of contacting area makes it difficult for both mating surfaces to be in all contact because of precision level of the imprinting machine and the waviness of mold and target. The gripping force for both mold and target with the vacuum chuck is also major effect to interrupt the full contact, which must be avoided in imprinting mechanism. In this study, the preliminary study for the causes of non-uniformity of contacting surfaces such as mold and target is performed with $470{\times}370mm^2$ LCD panel size.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.138-146
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• 2004

현재 반도체 및 LCD 제조분야에 적용되는 공정장비, 이송시스템에는 고성능, 고생산성이 요구되고 있는 추세이다 기존의 선형이송시스템은 구동원으로 서보모터(Servo Motor)를 사용하고 있으며, 기계적 동력전달장치를 사용하여 직선운동을 하는 구조로 되어있어 마찰소음, Position Error 등의 발생요인이 많은 단점을 가지고 있다. 반면에 선형전동기(Linear Motor)를 이송시스템의 구동원으로 사용하면 기계적 동력전달장치가 생략되어 기존의 선형이송시스템이 가지고 있는 단점들의 개선효과가 크며 유지보수면에서도 유리한 점이 많다. 본 연구에서는 2,500[N]급 영구자석 여자 횡자속 선형전동기를 설계, 개발하였으며, 이를 적용한 추진모듈을 개발하였다. 본 연구에서 개발된 횡자속 선형전동기 적용 추진모듈은 LCD 제조분야의 Stocker, RGV, Index, OHS, OHT 등을 비롯하여 타 산업분야의 선형이송시스템으로의 가능하다.

• Transactions on Electrical and Electronic Materials
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• v.17 no.1
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• pp.33-36
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• 2016

In the present work, a Ni-doped indium zinc oxide (NIZO) film and its multilayers with Ag layers were investigated as transparent conducting electrodes for liquid crystal display (LCD) applications, as a substitute for indium tin oxide (ITO) electrodes. By interposing the Ag layer between the NIZO layers, the loss of the optical transmittance occurred; however, the Ag layer brought enhancement of electrical sheet resistance to the NIZO/Ag/NIZO multilayer electrode. The twisted nematic cell based on the NIZO/Ag/NIZO multilayer electrode exhibited superior electro-optical characteristics than those based on single NIZO electrode and was competitive compared to those based on the conventional ITO electrode. An LCD-based NIZO/Ag/NIZO multilayer electrode may allow new approaches to conventional ITO electrodes in display technology.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.05a
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• pp.869-874
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• 2001

In order that precision equipment using high precision industrial operate normally. vibration criteria of expected area that equipment be set up is micrometer level. that method is a trust design for apply to in field, when there attend to quantifiable method. Hence, semi -empirical method that using on the basis of experimental data about undefined information (properities of vibration source, dynamic properities of structure, etc.,) for prediction of vibration response make the use of dynamic structure design of semiconductor ＆ TFT-LCD in the inside and outside country. Like this, for doing an optimal design of dynamic about structure, it is best important to get trust data that apply to semi-empirical method that is method of prediction vibration level. In this paper, on the basis of experimental data which was offered by a manufacturing company Of precisin equipment that plan to set up in semiconductor factory, we predicted vibration response on expected area that equipment be set up.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• Resources Recycling
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• v.23 no.2
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• pp.61-70
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• 2014

LCD televisions and monitors use cold cathode fluorescence lamps (CCFLs) to illuminate the screen. Most CCFLs contain mercury and they have to be carefully handled at the end of their lives as per minimum treatment standards under the Waste Electrical and Electronic Equipment (WEEE) and Restriction of Hazardous Substances (RoHS) directives. CCFLs were carefully separated from mold frames of waste LCD units for primary decontamination of mercury/fluorescent compound mixture using CCFL decontamination system designed and fabricated in the present research. Residual mercury was further removed by employing a pyro-process, where crushed CCFL tubes transferred from primary decontamination process were subject to heat treatment at $550^{\circ}C$ in a box furnace: more than 99% of mercury was removable from waste CCFLs.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2005.05a
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• pp.1047-1051
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• 2005

Many corporation invest in LCD industry because of The growth of it. Back Light Unit(BLU), LCDs' main part take 20% of its product costs. In this paper we proposed simulation model that is in the process of introducing an equipment, We try to apply a simulation model in the BLU Assembly line by using ARENA. We make BLU Assembly line with various part storage, product strorage. etc. We evaluate Logistics in Assembly Line, and forecast bottleneck and throughput

• Journal of Information Display
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• v.4 no.4
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• pp.1-3
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• 2003

For excimer laser annealing (ELA), energy density, number of pulses, beam uniformity, and condition of initial amorphous Si (a-Si) films are significant factors contributing to the final microstructure and the performance of low-temperature polycrystalline Si (LTPS) TFTs. Although the process and equipment have been significantly improved, the environmental factors associated with initial amorphous Si (a-Si) films and process conditions are yet to be optimized.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.533-536
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• 2006

VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.