• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.05a
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• pp.202-205
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• 2006

Recently, high vacuum pumps are widely used in the semi-conduction and liquid-crystal display ( LCD ) process. The composite-type high vacuum pumps are widely used in the various processes. In this study, the pumping performance of composite-type molecular pumps has been investigated experimentally. The experimented pumps are a compound molecular pump ( CMP ) and hybrid molecular pump ( HMP ). The CMP consists with helical-type drag pump, at lower part, and with turbomolecular pump ( TMP ), at upper part. The HMP consists with disk-type drag pump, at lower part, and with TMP, at upper part. The experiments are performed in the outlet pressure of $0.2\;{\sim}\;533\;Pa$. We have measured the ultimate pressure, compression ratio, and pumping speed

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.219-223
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• 2005

Nowadays laser cutting is the most promising method of cutting FPD(Flat Panel Display) glass in mass-production line. And this method can also be used to cut other brittle materials such as quartz, sapphire, ceramic and semiconductor The concept of this method is shown in picture 1. Laser beam heats glass up to strain point, not to melting point and cooling system chills glass to induce maximun thermal stress in glass surface and then the thermal stress generates micro thermal crack, in other words blind depth of crack, along laser beam and cooling line.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.05a
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• pp.79-83
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• 2005

IT 기술, 반도체 산업 등의 급격한 발전에 힘입어 최근의 첨단 전자, 통신제품은 초경량 초소형화와 동시에 고기능 복합화의 발전 추세를 보이고 있다. 이런 추세에 발맞추어 전자제품, 통신제품의 핵심적인 부품인 IC chip도 소형화되고 있다. IC chip 패키징 기술의 하나인 Filp Chip Package는 Module Substrate 위에 Chip Surface를 Bumping 시킴으로서 최단의 접속길이와 저열저항, 저유전율의 특성도 가지면서 초소형에 높은 수율의 저 원가생산성을 갖는 첨단의 패키징 기술이다. 이런 패키징 기술은 수요증가와 더불어 폭발적으로 늘어나고 있으나 까다로운 공정기술에 의해 아직 여러 회사에서 장비가 출시되고 있지 못한 상태이다. 이에 본 연구에서는 최근 수요가 증가하는 LCD Driver IC용 COF 장비를 위한 Flip chip Bonding 장비 및 시스템을 설계, 제작하였다.

• Journal of Power Electronics
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• v.13 no.3
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• pp.362-368
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• 2013

Commercial home appliances using remotely controlled systems consume electric power while in standby mode to prepare for receiving a remote turn-on signal. The proposed power system can significantly reduce standby power consumption without increasing cost. Furthermore, since a Electronic Double Layer Capacitor (EDLC) is used as an auxiliary power storage element, the life cycle is longer and system reliability can be better than with existing approaches. When the energy of the EDLC is not sufficient for turning on the appliance, the power system charges the EDLC without affecting the main system. The proposed power system is verified with a commercial LCD TV and a 3.93mW standby consumption is obtained. This standby consumption can be regarded as zero standby equipment according to the IEC-62031 standard.

• Journal of the Korean institute of surface engineering
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• v.53 no.5
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• pp.249-256
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• 2020

As the size of manufacturing equipment for LCD and OLED displays increases, replacement of existing heavy stainless steel components with light metals, such as aluminum alloys, is being more important in semiconducting and display manufacturing industries. To use aluminum alloys for components in semiconducting and display industries, it is important to develop a new anodization method for improved performance of anodic oxide films than conventional anodization method based on sulfuric acid. In this work, optimum applied current density and the best sealing methods for anodic oxide films in 3% oxalic acid were explored. Experimental results showed 2.5 A/dm2 is the best applied current density for improved hardness and dielectric breakdown voltage. Sealing of the anodic oxide films further improved their hardness, dielectric breakdown voltage and resistance to HCl, by which application of anodic oxide films become applicable for components in semiconducting and display industries.

• IE interfaces
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• v.24 no.1
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• pp.71-77
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• 2011

Design works consist of essential works and subsidiary works. Essential design works means designing creative ideas and productive ideas, while subsidiary design works means helping essential works those are making data tables and specification sheets, checking CAD data's integrity. Subsidiary design works forms the bulk of the whole design process and affects the time limit of delivery. Therefore we propose the automatic data matching system for CAD data's integrity. Proposed system is automatic system supporting subsidiary design works. The data matching system consists of three parts; 1) automatic generation of data tables 2) supporting module for checking CAD data's integrity between Drawings 3) automatic generation of spec. sheets. Developed system was tested in LCD equipment manufacture company and was found to be useful system.

• Proceedings of the KAIS Fall Conference
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• 2004.06a
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• pp.221-223
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• 2004

본 논문에서는 RF 플라즈마를 사용하는 공정장비의 임피던스 정합 특성 개선을 위해 RF Match 제어단의 제어 알고리즘과 하드웨어의 디지털화 방안에 대한 연구를 수행하였다. 개발된 제어단은 최적의 동작성능을 위하여 멀티 프리셋, 이득제어 기능 등 부가기능을 갖도록 설계/제작하였고, 또한 LCD 모듈의 설치를 통하여 RF Match의 실시간 상태 파악이 가능하도록 하였다. 개발된 제어단에 대한 실험결과로부터 RF 전력의 over/under shoot, 플라즈마 플리커 등의 현상이 제거되었고, 정합시간이 크게 단축되었음을 알 수 있었다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2005.11a
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• pp.231-235
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• 2005

Recently, some semiconductor and LCD manufacturers require equipment suppliers to serve the data of composite noise for clean room. In this study, we evaluate the composite noise of clean room by numerically and experimentally. The value of experimental result is more higher than calculated one as much as 1$\sim$2dB(A).

• Journal of the Korea Safety Management & Science
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• v.14 no.4
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• pp.219-227
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• 2012

The trend is going to obtain the accurate and fast information to the development of information technology and electronic technology as an important part of corporate management. Press equipment to produce products that target is small and medium businesses. Became so economical real-time production information system(R-PIS) model has been implemented. R-PIS configure the embedded hardware and PC application software. This system is easy maintenance and upgrade that general-purpose PC and a modular hardware devices. Consists of modules such as wireless communication, LCD, Key-pad, memory control, and sensor signal. R-PIS is efficient materials and product management to maximize the productivity of the enterprise.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.1-3
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• 2003

평판형 안테나를 채택한 TCP (Transformer Coupled Plasma) 형태의 CVD 장비를 이용하여 비정질의 실리콘 박막을 증착 하였다. 비정질 실리콘 박막은 태양전지 및 TFT-LCD 등의 디스플레이 제품 등에 다양하게 적용되고 있는데, 일반적으로 CCP(Capacitor Coupled Plasma) 형태의 CVD 장비에서 증착되어 왔다. TCP-CVD 장비는 CCP-CVD에 비해 플라즈마 내의 높은 이온밀도 및 저압, 저온에서 공정이 가능할 뿐만 아니라, 기판 바이어스 전압을 독립적으로 조절할 수 있어 이은에 의한 증착막의 결함을 낮출 수 있는 장점이 있다. 본 발표에서는 자체 기술로 제작된 TCP-CVD의 소개와 증착된 비정질 실리콘 박막의 특성평가를 위한 라만 분석 및 dark conductivity 데이타를 다루었다. 또한 비정질 실리콘 박막의 반도체 소자의 응용성을 보기 위하여 3족 및 5족의 불순물을 도핑하여 전기전도도의 변화를 측정하였다.