• Clean Technology
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• v.18 no.1
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• pp.69-75
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• 2012

In this study, we executed an environmental impact assessment about recycling of ITO (Indium Tin Oxide), used for touch panel. ITO is mainly used to make transparent conductive coatings for touch and flat screen LCD (Liquid Crystal Display), ELD (Emitting Light Device), PDP (Plasma Display Panel). This demand is increasing little by little. but form current status, ITO is discarded than recycling. It is important to recycling ITO for national strategies about resource conservation, and reduce environmental burden. Also Landfill or incineration of ITO cloud be harmful to the human health in the long-term. Material Life Cycle Assessment method (MLCA) was conducted for comparison landfill and recycling of ITO. MLCA would provide more information for environmental issues and potential environmental impacts of ITO. The study includes two scenarios, the basic scenario is recycling of ITO (10, 20, 30%) and the other scenario is landfill of ITO. In addition, amount of carbon dioxide and energy were calculated.

• Journal of the Korean Vacuum Society
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• v.21 no.4
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• pp.199-204
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• 2012

$SF_6$ gas is widely used for dry etching process of semiconductor and display fabrication process. But $SF_6$ gas is considered for typical greenhouse gas for global warming. So it is necessary to research relating to $SF_6$ alternatives reducing greenhouse effect in semiconductor and display. $C_3F_6$ gas is one of the promising candidates for it. We studied about etch characteristics by performing Reactive Ion Etching process of dry etching and reduced gas element exhausted on etching process using absorbent Zeolite 5A. $Si_3N_4$ thin film was deposited to 500 nm with Plasma Enhanced Chemical Vapor Deposition and we performed Reactive Ion Etching process after patterning through photolithography process. It was observed that the etch rate and the etched surface of $Si_3N_4$ thin film with Scanning Electron Microscope pictures. And we measured and compared the exhausted gas before and after the absorbent using Gas Chromatograph-Mass Spectrophotometry.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.272-277
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• 2019

In this paper, a manufacturing method of an anti-glare cover glass on LCD for outdoor use is proposed. The main specification of cover glass is hardness and anti-glare. Hardness is achieved by using the tempered glass, and anti-glare(AG) film is laminated to meet anti-glare specification no the tempered glass. However, the AG film is difficult to maintain the AG performance continuously because the abrasion resistance of the PET film itself is as weak as about 3H. Therefore, a novel production procedure using screen printing method is proposed. The proposed coating is implemented by applying $ZnO-B_2O_3-SiO_2$ powder on glass surface and the glass is made with enhanced hardness through tempering process. In order to apply the ZBS powder uniformly on the glass surface, a screen printing process is used. The main parameters to be considered in screen printing are the oil concentration and mesh opening size. Because the amount of ZBS powder applied to the printing process is controlled by these two parameters, the correlativity is confirmed through the experiments. In order to evaluate the performance of the proposed method, the haze, surface roughness and transmittance are selected as the performance index and are compared with the AG film. As a result of comparison, it is verified that the transmittance of the proposed tempered glass is 83.1%, which is slightly lower than 89.5% of AG film, but the hardness is more than double to 7H.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.66.1-66.1
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• 2011

반도체를 비롯하여 LCD, OLED와 같은 디스플레이 (FPD: Flat Panel Display) 분야는 국가 선도 사업으로써 발전을 거듭해오고 있다. 하지만 기술의 성숙도가 높아짐에 따라 최근 중국과 대만 업체와의 경쟁이 심화되고 있으며, 더불어 환경문제가 큰 이슈로 떠오르고 있어 신기술 개발을 통한 생산 수율 향상 및 친환경 공정 개발의 중요성이 커지고 있다. 반도체, 디스플레이 공정에서 생산 수율 저하의 주요 원인으로써 공정 중 발생하는 미세 오염 입자를 들수 있다. 반도체 및 디스플레이 공정에서 세정 기술은 전체 기술의 30% 이상을 차지하며 생산 수율 및 제품의 품질에도 큰 영향을 주는 공정이다. 세정 공정은 일반적으로 습식 세정 공정이 낮은 공정비용을 바탕으로 널리 적용되어 왔으나, 기판의 대형화와 패턴의 미세화에 따라 정밀한 세정 스펙이 요구되며 더불어 막대한 양의 초순수와 화학액의 사용으로 인한 공정비용 증가와 환경 규제 강화에 따른 폐수 처리의 문제에 직면하고 있다. 이에 따라 폐수의 양을 줄이며 건조공정을 필요로 하지 않아 공정비용을 줄일 수 있는 건식 세정 공정에 대한 연구가 활발히 진행 되고 있다. $CO_2$ snow jet 세정 기술은 건식 공정으로써 $CO_2$ 가스를 특수하게 제작된 분사 노즐에서 고압으로 가스를 분사하여 이 때 발생되는 순간적인 감압에 의한 단열 팽창으로 생성된 $CO_2$ snow 입자가 기판 표면의 오염물과 물리적 충돌을 하어 세정이 이루어지는 기술이다. 특히 $CO_2$ 세정은 환경과 인체에 무해하며 공정 후 바로 승화하기 때문에 추가적인 폐수처리 공정 등이 필요하지 않고, 건식 공정으로써 수세(Rinse) 공정을 필요로 하지 않기 때문에, 공정비용을 크게 줄일 수 있으며 물반점 발생을 방지 할 수 있는 친환경 건식 공정으로써의 장점을 가지고 있다. 본 연구에서는 자체적으로 개발한 $CO_2$ snow jet을 바탕으로 하여 다양한 공정조건을 변화시켜 세정효율을 측정하는 한편, 최적화 하기 위한 연구를 진행하였으며 더불어 $CO_2$ snow의 세정력을 정량적으로 평가하기 위한 연구를 진행하였다. 실험을 통해 가장 효과적으로 $CO_2$ snow 입자를 배출 할 수 있는 공정 조건으로써 5 bar의 캐리어 가스 압력을 사용하여, 세정력에 가장 큰 영향을 줄 수 있는 분사 노즐과 기판 사이의 거리 및 분사 노즐의 각도 등을 변화시켜 각 조건에 따른 세정효율을 평가하였다. 세정 오염물은 Silica, PSL 표준 입자(Duke scientific, USA)를 정량적으로 웨이퍼에 오염 시킨 후, 파티클 스캐너(Surfscan 6500, KLA-Tencor, USA)를 이용하여 세정 전 후의 오염입자 개수 변화를 통해 정량적으로 세정효율을 평가하였다. 본 연구를 통하여 $CO_2$ snow jet를 이용한 친환경 고효율 건식 세정 공정 메커니즘을 분석하였으며, 노즐과 기판 사이의 간격 및 분사 노즐의 각도 등을 최적화 한 세정 공정을 얻을 수 있었다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.98-106
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• 2009

This work proposes a 1280-RGB $\times$ 800-Dot 70.78mW 0.l3um CMOS LCD driver IC (LDI) for high-performance 16M-color low temperature poly silicon (LTPS) thin film transistor liquid crystal display (TFT-LCD) systems such as ultra mobile PC (UMPC) and mobile applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed LDI optimizes power consumption and chip area at high resolution based on a resistor-string based architecture. The single column driver employing a 1:12 MUX architecture drives 12 channels simultaneously to minimize chip area. The implemented class-AB amplifier achieves a rail-to-rail operation with high gain and low power while minimizing the effect of offset and output deviations for high definition. The supply- and temperature-insensitive current reference is implemented on chip with a small number of MOS transistors. A slew enhancement technique applicable to next-generation source drivers, not implemented on this prototype chip, is proposed to reduce power consumption further. The prototype LDI implemented in a 0.13um CMOS technology demonstrates a measured settling time of source driver amplifiers within 1.016us and 1.072us during high-to-low and low-to-high transitions, respectively. The output voltage of source drivers shows a maximum deviation of 11mV. The LDI with an active die area of $12,203um{\times}1500um$ consumes 70.78mW at 1.5V/5.5V.

• Analytical Science and Technology
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• v.19 no.6
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• pp.535-543
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• 2006

Being used widely in semiconductor and display manufacturing, $NF_3$ is internationally considered as one of the regulated compounds in emission. Numerous companies have been continuously trying to reduce the emissions of $NF_3$ to comply with the global environmental regulation. This work is made to report the destruction and removal efficiency (DRE) of electrically heated scrubbers and the use rate in process chambers installed in three main LCD manufacturing companies in Korea. As the measurement techniques for $NF_3$ emission, mass flow controlled helium gas was continuously supplied into the equipment by which scrubber efficiency is being measured. The partial pressures of $NF_3$ and helium were accurately measured for each sample using a mass spectrometer, as it is emitted from inlet and outlet of the scrubber system. The results show that the DRE value for electrically heated scrubbers installed before 2004 is less than 52 %, while that for the new scrubbers modified based on measurement by scrubber manufacturer has been sigificentely improved upto more than 95 %. In additon, we have confirmed the efficiency depends on such variables as the inlet gas flow rate, water content, heater temperature, and preventative management period. The use rates of $NF_3$ in process chambers were also affected by the process type. The use rate of radio frequency source chambers, built in the $1^{st}$ and $2^{nd}$ generation process lines, was determined to be less than 75 %. In addition, that of remote plasma source chambers for the $3^{rd}$ generation was measured to be aboove 95 %. Therefore, the combined application of improved scrubber and the RPSC process chamber to the semiconductor and display process can reduce $NF_3$ emmision by 99.95 %. It is optimistic that the mission for the reduction of greenhouse gas emission can be realized in these LCD manufacturing companies in Korea.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.48 no.6
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• pp.68-76
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• 2011

We introduce a parallax barrier type autostereoscopic display in order to overcome the limited viewing angle of the conventional parallax barrier type displays. The proposed method adopts a special structure of double pairs of ITO that have a common TN-LC at the core of the conventional parallax barrier. Compared with the conventional parallax barrier type displays, the proposed display uses moving parallax barriers and eye tracking system to make stereoscopic view images adapted to the movement of viewer. We implemented a prototype of the proposed dual layer parallax barrier system, and verified that the proposed autostereoscopic display maintains seamless 3D views even when a viewer's head is moving.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.301-310
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• 2014

Recently, the fringe-field switching (FFS) mode in liquid crystal displays has been used mainly for high image quality and high-resolution liquid crystal displays (LCDs). In this review paper, the fundamental switching principle of the FFS mode, with its excellence over other LC modes in electro-optic performance, will be described. In addition, the development history, present technical issues, and future of the FFS LCD will be discussed.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.231-238
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• 2013

This paper describes a DC-DC converter IC for Flat Panel Displays. In case of operate LCD devices various type of DC supply voltage is needed. This device can convert DC voltage from 6~14[V] single supply to -5[V], 15[V], 23[V], and 3.3[V] DC supplies. In order to meet current and voltage specification considered different type of DC-DC converter circuits. In this work a negative charge pump DC-DC converter(-5V), a positive charge pump DC-DC converter(15V), a switching Type Boost DC-DC converter(23V) and a buck DC-DC converter(3.3V). And a oscillator, a thermal shut down circuit, level shift circuits, a bandgap reference circuits are designed. This device has been designed in a 0.35[${\mu}m$] triple-well, double poly, double metal 30[V] CMOS process. The designed circuit is simulated and this one chip product could be applicable for flat panel displays.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.913-918
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• 2005

It is expected that the inkjet technology offers prospect for reliable and low cost manufacturing of FPD (Flat Panel Display). This inkjet technology also offers a more simplified manufacturing process for various part of the FPD than conventional process. For example, recently the novel manufacturing processes of color filter (C/F) in LCD, or RGB patterning in OLED by inkjet printing method have been developed. This elaborates will be considered as the precious point of manufacturing process for the mass production of enlarged-display panel with a low price. On this point of view, we would like to review the status of inkjet technology in FPD, with some results on forming micro line by inkjet patterning of suspension type silver nano ink as below. We have studied the inkjet patterning of synthesized aqueous silver nano-sol on interface-controlled ITO glass substrate. Furthermore, we designed the conductive ink for direct inkjet patterning on bare ITO glass substrate. The first, the highly concentrated polymeric dispersant-assisted silver nano sol was prepared. The high concentration of batch-synthesized silver nano sol was possible to 40 wt%. At the same time the particle size of silver nanoparticles was below $10{\sim}20nm$. The second, the synthesized silver nano sol was inkjet - patterned on ITO glass substrate. The connectivity and width of fine line depended largely on the wettability of silver nano sol on ITO glass substrate, which was controlled by surfactant. The relationship was understood by wetting angle. The line of silver electrode as fine as $50{\sim}100\;{\mu}m$ was successfully formed on ITO glass substrate. The last, the direct inkjet-patternable silver nano sol on bare ITO glass substrate was designed also.