• Title/Summary/Keyword: Joint module

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A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules (자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구)

  • Yu, Dong-Yurl;Ko, Yong-Ho;Bang, Junghwan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.33 no.3
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    • pp.19-24
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    • 2015
  • Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

Development of Multi-Body Dynamics Simulator for Bio-Mimetic Motion in Lizard Robot Design (도마뱀 로봇 설계를 위한 생체운동 모사 다물체 동역학 시뮬레이터 개발)

  • Park, Yong-Ik;Seo, Bong Cheol;Kim, Sung-Soo;Shin, Hocheol
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.6
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    • pp.585-592
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    • 2014
  • In this study, a multibody simulator was developed to analyze the bio-mimetic motion of a lizard robot design. A RecurDyn multibody dynamics model of a lizard was created using a micro-computerized tomography scan and motion capture data. The bio-mimetic motion simulator consisted of a trajectory generator, an inverse kinematics module, and an inverse dynamics module, which were used for various walking motion analyses of the developed lizard model. The trajectory generation module produces spinal movements and gait trajectories based on the lizard's speed. Using the joint angle history from an inverse kinematic analysis, an inverse dynamic analysis can be carried out, and the required joint torques can be obtained for the lizard robot design. In order to investigate the effectiveness of the developed simulator, the required joint torques of the model were calculated using the simulator.

Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module (자동차 전장모듈용 Sn-Cu-Cr(Ca) 중온 솔더의 접합특성 연구)

  • Bang, Junghwan;Yu, Dong-Yurl;Ko, Yong-Ho;Kim, Jeonghan;Lee, Chang-Woo
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.54-58
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    • 2013
  • Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

Thermo-Mechanical Fatigue Analysis of Ribbon Wire/Ag Electrode Interfaces for PV Module

  • Park, No-Chang;Hong, Won-Sik;Han, Chang-Un;Kim, Dong-Hwan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2011.05a
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    • pp.48.1-48.1
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    • 2011
  • In this presentation, We monitored weather data, such as global irradiance, ambient temperature, temperature of PV module, relative humidity and windspeed for 2 years, for determining accelerated test condition. then, we determined the temperature limit of accelerated test through weather data and FEM analysis. Detailed procedures will be summarized in this work. After analysing outdoor stress such as thermal stress, we decided main failure modes and mechanisms of PV module, especially solder joint of ribbon wire. we carried out the measurement of material properties such as thermal expansion coefficient for planning of accelerated test. we designed accelerated test based on FEM analysis results. we carried out thermal cycling test with 1 cell mini module for 3 months. We monitored the change of electrical performance every 1 week such as Voc, Isc, Pmax, etc. and then, we analized the ribbon wire/electrode intefaces. Detailed results will be summarized in this work.

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TLP and Wire Bonding for Power Module (파워모듈의 TLP 접합 및 와이어 본딩)

  • Kang, Hyejun;Jung, Jaepil
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.7-13
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    • 2019
  • Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

Combine Method of Small Unit Modules for Urban Regeneration Projects (도시재생을 위한 소형 유닛모듈 결합방법)

  • Kim, Kyoon-Tai;Jun, Young-Hun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.05a
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    • pp.243-244
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    • 2018
  • This study focused on the fact that there are a lot of alleys in some areas of the Urban Renewal New Deal project. In this study, we proposed a method to construct a spatial module by combining small modules. It is expected that the combination of small modules developed in this way will help revitalize the New Deal of Urban Regeneration. In the future, additional joint details will be developed, structure review will be conducted.

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Considerations in implant crestal module to preserve peri-implant tissue (임플란트 주위 조직 보존을 위한 임플란트 경부의 디자인에 관한 고찰)

  • Kim, Hong-Jun;Kim, Jee-Hwan;Kim, Sung-Tae;Lee, Jae-Hoon;Park, Young-Bum
    • The Journal of Korean Academy of Prosthodontics
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    • v.49 no.4
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    • pp.346-353
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    • 2011
  • Purpose: The peri-implant soft tissue is remodeled by the initial marginal bone resorption affecting the prognosis and esthetic result of treatment. Thus various designs on implant neck design are studied to preserve peri-implant bone. The purpose of this study is to review on the causes of initial marginal bone resorption, the configuration of peri-implant soft tissue, and the implant crestal module favorable in preserving peri-implant tissue. Materials and methods: The studies on the causes of initial marginal bone resorption and the implant crestal modules are researched and reviewed using Pubmed database. The implant crestal modules including one piece and two-piece implant, internal and external hex abutment, taper and butt joint connection, scalloped design abutment, and platform switching concept are reviewed. Results: A number of clinical and experimental studies preferred one piece implant to two-piece in preserving initial peri-implant tissue. For two piece implants, internal hex abutment and taper joint connection appear more favorable than external hex abutment and butt joint connection relatively. Controversial issues still exist on scalloped design requiring more studies on it. Although the rationale is not certain, the concept of platform switching seems favorable in preserving initial peri-implant tissue based on clinical and experimental studies. Conclusion: Each implant crestal module contains its own advantages and disadvantages with various controversial issues. In the aspect of preservation of initial peri-implant tissue, however, one-piece implant seems beneficial. In cases when two-piece implant is more appropriate due to prosthodontic concerns or any other problems, the application of platform switching concept, internal connection abutment, and taper joint connection may be favorable for the preservation of peri-implant tissues.

Development of POSTEC HAND-V Index Finger Module

  • Lee, Ju-Hyoung;Youm, Youn-Gil;Chung, Wan-Kyun
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.2022-2026
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    • 2003
  • We define that the end effector is the device which interact environment or objects with contact to execute tasks. Up to now, many researchers developed anthropomorphic robotic hands as end effectors. In this paper, we will discuss a problem on the development of a human-scale and motor-driven anthropomorphic robot hand. In this paper, design concept, actuator and transmission, kinematic design and sensing device are presented. By imitating the physiology of human hands, we devised new metacarpalphalangeal joint and interphalangeal joint suitable for human-size robot hands

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Fabrication and characterization of XPM based wavelength converter module with monolithically integrated SOA's (SOA 집적 XPM형 파장변환기 모듈 제작 및 특성)

  • 김종회;김현수;심은덕;백용순;김강호;권오기;엄용성;윤호경;오광룡
    • Korean Journal of Optics and Photonics
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    • v.14 no.5
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    • pp.509-514
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    • 2003
  • Mach-Zehnder interferometric wavelength converters with monolithically integrated semiconductor optical amplifiers (SOA's) have been fabricated and characteristics of wavelength conversion at 10 Gb/s have been investigated for wavelength span of 40 nm. The devices have been achieved by using a butt-joint combination of buried ridge structure type SOA's and passive waveguides. In the integration, a new method has been applied that removes p+InP cladding layer leading to high propagation loss and forms simultaneously the current blocking and the cladding layer using undoped InP. The module packaging has been achieved by using a titled fiber array for effective coupling into the tilted waveguide in the wavelength converter. Using the module, wavelength conversion with power penalty lower than 1 ㏈ at 10 Gb/s has been demonstrated for wavelength span of 40 nm. In addition, it is show that the module can provide 2R (re-amplification, re-shaping) operation by demonstrating the conversion with the negative penalty.

An Experimental Study on Flexural Properties of SC(Steel Plate Concrete) Beam Structure with Reinforced Concrete Joint (철근 콘크리트 구조와 강판 콘크리트 구조(Steel Plate Concrete) 이질접합부를 가진 보의 휨 하중 특성에 관한 실험연구)

  • Lee, Kyung-Jin;Hahm, Kyung-Won;Park, Dong-Soo;Kim, Woo-Bum
    • Journal of Korean Society of Steel Construction
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    • v.22 no.5
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    • pp.455-463
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    • 2010
  • This paper describes the experimental study on the mechanical characteristics of a steel plate-reinforced concrete joint. As an alternative reinforced concrete structure, the SC modular construction method is widely used and studied in the field ofindustrial facility field. However, the structure characteristics of RC and SC joint are not yet studied completely. In this paper, the beam-type construction joint of RC and SC walls was made to simulate the application of SC module to the large RC structure. Also, an out-of-plane loading was applied to the test specimen in order to evaluate flexural strength and structural properties of the beam-type RC-SC joint.