• Journal of Welding and Joining
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• v.21 no.4
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• pp.69-74
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• 2003

The mechanical properties of STD11 Joints by using TLP (Transient Liquid Phase Diffusion) bonding method employing MBF-30 and MBF-80 insert metals were investigated with concerning to the microstructural change. TLP bonding of STD 11 was carried out at 1323∼1423K for 0.6ks∼3.6ks in vacuum. The microstructure and the element distribution of the interlayer between tool steels and insert metals showed specific feature with bonding conditions. It was found that the width of the interlayer increased at initial bonding stage. However, the width of interlayer showed nearly constant value during the isothermal solidification. After isothermal solidification was completed, the joint showed homogeneous element distribution and similar microstructure with base metal because of the grain boundary migration to the bonded interlayer. The bonding strength measured by a tensile test has been varied with the bonding conditions. The maximum joint strength, 760MPa, was obtained with the condition of 1423K for 1.2ks using MBF30 insert metal in this experiment.

• Macromolecular Research
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• v.15 no.1
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• pp.65-73
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• 2007

Chitosan, fibroin, and hydroxyapatite are natural biopolymers and bioceramics that are biocompatible, biodegradable, and resorb able for biomedical applications. The highly porous, chitosan-based, bioceramic hybrid composite, chitosanlfibroin-hydroxyapatite composite, was prepared by a novel method using thermally induced phase separation. The composite had a porosity of more than 94% and exhibited two continuous and different morphologies: an irregularly isotropic pore structure on the surface and a regularly anisotropic multilayered structure in the interior. In addition, the composite was composed of an interconnected open pore structure with a pore size below a few hundred microns. The chemical composition, pore morphology, microstructure, fluid absorptivity, protein permeability, and mechanical strength were investigated according to the composition rate of bioceramics to biopolymers for use in tissue engineering. The incorporation of hydroxyapatite improved the fluid absorptivity, protein permeability, and tenacity of the composite while maintaining high porosity and a suitable microstructure.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.87-92
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• 2008

The interface microstructure of Sn-3.5Ag/Cu joint was modified by electroplating varying amount of Zn on Cu UBM. As the amount of Zn dissolved in Sn-3.5Ag solder increased with the electroplating Zn thickness, Cu-Sn IMCs such as $Cu_6Sn_5$ and $Cu_3Sn$ were replaced by Zn-containing IMCs such as $Cu_5Zn_8$ and $Ag_5Zn_8$, which increased the drop reliability of solder joints significantly. When the amount of Zn dissolved in solder was about 3.8wt%, drop resistance was best due to the effective suppression of Cu-Sn IMC and voids at the interface.

• Journal of Korea Foundry Society
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• v.20 no.2
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• pp.116-121
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• 2000

Interfacial reaction and mechanical properties between Sn-Zn-X ternary alloys(X : 3wt.%In, 4wt.%Bi) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 50days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3 mm $min^{-1}$ to measure tensile strength. According to the results of the solderability test, additions of In and Bi in the Sn-9wt.%Zn solder improve the wetting characteristics of the alloy and lower the melting temperature. Through the EDS and XRD analysis of Cu/Sn-9wt.%Zn solder joint, it was concluded that the intermetallic compound was the ${\gamma}-Cu_5Zn_8$ phase. Cu-Zn intermetallics at Cu/solder interfaces played an important role in both the microstructure evolution and failure of solder joints. Cu/solder joint strength was decreased by aging treatment, and those phenomenon was closely related to the thickening of intermetallic layer at Cu/solder joints.

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.281-283
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• 2000

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.296-297
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• 2000

• Proceedings of the KWS Conference
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• 1994.05a
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• pp.51-53
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• 1994

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.110-113
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.89-98
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shock teal. $(Cu,Ni)_6Sn_5$-type intermetallic compound of which thickness is about 5 micron was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was found at the solder joint and the newly developed product was superior to conventions; one in terms of productivity and reliability.

• Transactions of Materials Processing
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• v.23 no.4
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• pp.244-249
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• 2014

The thixoforming process has been applied to forming of a joint node for the aluminum frame of a low speed electric vehicle. A joint node should connect three aluminum extruded chassis showing different profiles. The MHS(magnetohydrodynamic stirring) A357 billet was selected because homogeneous globular grains are necessary as the billet materials for thixoforming. A careful design of joint node has been performed by the considerations of structural demands and the simulation results for the thixoforming process using the MAGMAsoft. Optimum heating temperature for the A357 billet was between 580 and $585^{\circ}C$ corresponding to the semi-solid temperatures showing 20-30% of liquid fraction. An injection speed of around 100mm/s and preheating of die at temperatures of $200^{\circ}C$ were also necessary conditions to obtain reasonable thixoformed parts.