• Journal of Welding and Joining
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• v.20 no.5
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of Welding and Joining
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• v.12 no.1
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• pp.80-93
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• 1994

The microstructure and fractography of the friction welded joint of Al to Cu have been investigated in order to understand the formation of intermetallic compounds and their effects on the failure in tensile test of the joint. The variation of welding pressure did not affect significantly the tensile strength of joint. However, the tensile strength of joint decreaed as welding time increased. The thickness of reaction layers of welded joints was several micro-meters and mainly composed of intermetallic compounds of $CuAl_2$, $Cu_9Al_4$ and Al+$CuAl_2$. The thickness of $CuAl_2$, $Cu_9Al_4$ was increased with welding time. However, $CuAl_2$ was gradually changed to $Cu_9Al_4$ which caused the decrease of tensile strength . Even though the morphology of fractured surfaces depended upon the welding time, the failure occurred along $CuAl_2$ intermetallic compound itself or between $CuAl_2$ and $Cu_9Al_4$ in most cases.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.66-70
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• 2014

In Ti active brazing of YSZ to STS 430 using Ag-Cu Filler Metal, the effect of Ti contents on the shear bonding strength were investigated together with the effect of brazing temperature and holding time. The addition of Ti in Ag-Cu Filler Metal increased the bonding strength up to 4.68% Ti, followed by the decrease with further addition. This seems to be caused by formation of TixOy at the reaction layer. Brazing temperature was optimized at $960^{\circ}C$ among a given temperature ranges. The addion of Sn to Ag-Cu filler metal brought the decrease of its melting temperature its melting temperature without a significant decrease of bonging strength.

• Journal of Welding and Joining
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• v.1 no.2
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• pp.61-68
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• 1983

Austenitic stainless steel has been investigated widely for creep strength of heat resistant material and effects of grain sizes due to various solution treatment time under constant temperature. It was studied that effects of grain sizes subject to solution treatment temperature 1100.deg. C, 1125.deg. C, 1175.deg. C, 1250.deg C, and 1300.deg. C respectively on the creep strength, fracture behaviour and fractography of SUS 316 stainless steel. The experimental results obtained were as follows. 1. The optimum grain size for the maximum creep strength did not vary with creep testing temperatures and stress levels. 2. Among various grain sizes due to different solution treatment temperature, the optimum grain size for the creep strength was found 0.044mm. Also the size showed the minimum initial strain regardless creep temperature. 3. Garofalo's equation of creep rupture life was applied well to SUS 316 stainless steel. 4. The fractography of optimum size was ductile intergranular fracture of dimple type and showed along with the increase of grain size intergranular fracture of w type.

• Journal of Welding and Joining
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• v.7 no.3
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• pp.36-43
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• 1989

The furnace brazing in a Ar of copper to martensitic stainless steel(13.5Cr) using Cu-(5~8%)P-(0~8%)Sn powders was investigated. Shear strength, wettability, reacted layer, defect ratio at the stainless steel interface was evaluated. As Sn was added to the Cu-P powders, defect ratio and P content at the stainless steel interface decreased. And also as Sn was added, defect form at the stainless steel interface changed from the continuous layer to the discrete type, and shear strength of the brazed joint increased.

• Journal of Welding and Joining
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• v.25 no.4
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• pp.65-71
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• 2007

Laser weldability of the aluminized steel for the full penetration welding will be described in this paper. We focused on the effect of Al coating conditions on weld strength. For these objectives, aluminized steel sheets that have various thickness and coating weight were prepared for laser welding. And then, tensile-shear and hardness test were carried out. At the same time, Al contents in weld after laser welding were analyzed and their correlations with mechanical properties were investigated. Besides, as removing partially coating layer, weldability has been investigated according to the position of coating layer. As a result of this study, tensile-shear strength was decreased with increasing Al contents in weld, and Al of coating layer caused grain growth.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.35-41
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• 1999

In this study we investigated the effects of process variables on the bond strength, and its dependency upon the interfacial chemistry when the joined $ZrO_2$ toughened $Na\beta$"-alumina to $\alpha$-alumina using B$_2$$O_3$-$SiO_2$-Al$_2$$O_3$-CaO glass sealant. We observed that bond strength is mainly determined by the strength of the glass, which, in turn, depends on the glass composition established after joining reaction. Joining at $950^{\circ}C$ for 15min yielded the highest average bond strength of 66MPa. Different types of interfacial reaction seem to occur at each interface. After joining at $950^{\circ}C$ for 15min we found that Ca and Si diffuse much deeper(~15$\mu\textrm{m}$) into the $\beta$"-alumina composite than into the $\alpha$-alumina(<1$\mu\textrm{m}$) as a result of ion exchange reaction and more effective grain boundary diffusion. Thermal expansion coefficient of the glass was found to have changed more closely to those of the $\beta$"-alumina composite and $\alpha$-alumina, which put the glass under a slight compressive stress.ressive stress.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.66-75
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• 2013

In this study, the effect of coating thickness($20{\mu}m$ and $30{\mu}m$) on microstructure and tensile properties in Yb:YAG disk laser welds of Al-Si-coated boron steel (1.2mmt) was investigated. In the case of as welds, the quantity of ferrite was found to be higher in base metal than that in HAZ (Heat Affected Zone) and fusion zone, indicating, fracture occurrs in base metal, and the fracture position is unrelated to the coating thickness. Furthermore, yield strength, tensile strength of base metal and welded specimens showed similar behavior whereas elongation was decreased. On the other hand, base metal and HAZ showed existence of martensite after heat treatment, the fusion zone indicated the presence of full ferrite or austenite and ferrite during heat treatment ($900^{\circ}C$, 5min), After water cooling, austenite was transformed to martensite, and the quantity of ferrite in fusion zone was higher as compared with in base metal, resulting in sharply decrease of yield strength, tensile strength and elongation, which leads to fracture occured at fusion zone. In particular, results showed that because the concentration of Al was higher in 30um coating layer specimen than that of 20um coating specimen, after heat treatment, producing a higher quantity of ferrite was higher after heat treatment in the fusion zone; howevers, it leads to a lower tensile property.

• Journal of the Korean Society of Safety
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• v.29 no.4
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• pp.9-14
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• 2014

Self-piercing riveting(SPR) is a mechanical fastening technique which is put pressure on the rivet for joining the sheets. Unlike a spot welding, SPR joining does not make the harmful gas and $CO_2$ and needs less energy consumption. In this study, static and fatigue tests were conducted using tensile-shear specimens with Al-5052 plates for evaluation of fatigue strength of the SPR joints. During SPR joining process for the specimen, using the current sheet thickness and a rivet, the optimal applied punching force was found to be 21 kN. And, the maximum static strength of the specimen produced at the optimal punching force was 3430 N. During the fatigue tests for the specimens, interface failure mode occurred on the top substrate close to the rivet head in the most high-loading range region, but on the bottom substrate close to the rivet tail in the low -loading range region. There was a relationship between applied load amplitude $P_{amp}$ and lifetime of cycle N for the tensile-shear, $P_{amp}=3395.5{\times}N^{-0.078}$. Using the stress-strain curve of the Al-5052 from tensile test, the simulations for fatigue specimens have been carried out using the implicit finite element code ABAQUS. The relation between von-Mises equivalent stress amplitude and number of cycles was found to be ${\sigma}_{eq}=514.7{\times}N^{-0.033}$.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.