• Journal of Welding and Joining
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• 제34권3호
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• pp.31-39
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• 2016

The joining technology of the metal and engineering plastic is rising lately as the important issue in concerning with the method of reducing the weight and air pollution of the transportation structure such as automotive and vehicles. The metal/ plastic joining technology has been developed in 2 types of adhesively bonding and direct joining without adhesives. Moreover, in the direct joining method, there are 2 kinds of mechanical joining and welding. This review paper presents the present world wide status and tendency of the development of metal/plastic joining technology. This article intends to offer the materials for development and raising of the domestic metal/plastic joining technology.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.127-131
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• 2006

There are being a lot of studies for achievement of high speed Dehydration, high-strength and Lightweight of washing machine in the latest washing machine business. It is essential that Press-joining Strength of Spin Drum Seaming division is improved .to attain that target. Generally, we are using Mechanical press-joining by Seaming and T.I.G (Tungsten Inert Gas) welding among part joint method. Mechanical press-joining method that is mainly using for Stainless Steel (STS430) Drum have lots of merit that consumption of energy is low more than welding and production costs cut down and generation of the corrosion is solved by removing weld zone defect and materials having different properties are enable to join without special equipment. But, it is difficult to realize joint strength required at high speed operation because joint strength of mechanical press-joining method is low remarkably in comparison with welding. Also, there are a lot of analysis difficulties and very limited research is under way due to the dynamic factor such as multistage plastic working, elastic recovery, residual stress etc. The results of this study show optimal joining condition for mechanical press-joining by performing lots of tensile joining strength test with various specimen under multi-change of important design factor such as seaming width, bead area and bead depth etc.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 춘계학술대회 논문집
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• pp.33-38
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• 2002

Nowdays, related with vehicle weight reduction, many automotive maker are trying to develop spaceframe. If aluminum member and steel member are applied together in constructing spaceframe, there will be many advantages in aspect of inclosing strength and saving weight of automotive. In this case, joining method of aluminum and steel members has to be proposed. For this method, electomagnetic joining has many advantages compared to welding. In this paper, joining of aluminum tube and steel tube using eletomagnetic pressure was studied and strength of joint was evaluated through commission test.

• 대한수학회논문집
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• 제34권3호
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• pp.1005-1014
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• 2019

A new simple method is proposed for reconstructing phylogenetic trees, which we call the spectral method. The most common distance based method is the neighbor-joining method which is based on the minimum evolution principle. The spectral method shows similar performance to the neighbor-joining method for simulated data generated by seq-gen. For real data, the spectral method shows much better performance than the neighbor-joining method. Hence it can be a complementary method for reconstructing phylogenetic trees.

• 소성∙가공
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• 제16권2호
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• pp.107-112
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• 2007

In this study, the mechanical joining process for double sheet metals was investigated by using physical modeling method. Process parameters of mechanical joining such as friction coefficient, drawing depth, pouch radius, die radius and material thickness are preliminarily analyzed by finite element method. Referring to the finite element analysis results mechanical joining system is designed on the basis of physical similarities. From the physical modeling test, the effect of process parameters on the deformation for the mechanical joining are experimentally investigated and optimized joining shape that can provide strong joining strength is obtained.

• Journal of Welding and Joining
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• 제33권5호
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Journal of Welding and Joining
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• 제32권3호
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• pp.19-26
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• 2014

Through Silicon Via (TSV) technology is the shortest interconnection technology which is compared with conventional wire bonding interconnection technology. Recently, this technology has been also noticed for the miniaturization of electronic devices, multi-functional and high performance. The short interconnection length of TSV achieve can implement a high density and power efficiency. Among the TSV technology, TSV filling process is important technology because the cost of TSV technology is depended on the filling process time and reliability. Various filling methods have been developed like as Cu electroplating method, molten solder insert method and Ti/W deposition method. In this paper, various TSV filling methods were introduced and each filling materials were discussed.

• Journal of Welding and Joining
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• 제29권6호
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• pp.49-55
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• 2011

With the development of pre-painted steel sheets for automotive body application, a new joining method is required such as hybrid joining with combination of adhesive bonding and mechanical joining. The objective of this study is to investigate the effect of pre- and post-baking of adhesive bonding on failure mode and strength of hybrid joining of automotive steel sheets. Experiments show that the hybrid joining exhibits better bonding strength and displacement than conventional adhesive joining and mechanical fastening each. Comparison of pre- and post-baked hybrid joining results suggested that baking at $160^{\circ}C$ after mechanical joining was found to have higher joining properties than pre-baking condition. The prebaking condition changed its fracture mode from interfacial to button fracture. The changes in fracture mode with post-baking of hybrid joining was attributed to variation in neck thickness and undercut of joint.

• 전자공학회논문지CI
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• 제48권4호
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• pp.68-76
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• 2011

본 논문에서는 무선 네트워크 환경에서 히스테리시스 특성을 이용한 이동 노드의 네트워크 가입 방법을 제안한다. 제안된 방법은 정적 히스테리시스 특성을 이용하여 이동 노드가 네트워크 전송 경계점에 위치했을 때 빈번히 가입과 탈퇴를 하게 되는 문제점을 해결한다. 그에 따라, 네트워크 가입 요청에 따른 주변 노드들의 응답 패킷을 줄여 에너지 소비를 효율적으로 관리 할 수 있다. 하지만 정적 히스테리시스 방법은 네트워크의 가입률을 감소시키게 된다. 이러한 문제점을 해결하기 위해 동적 히스테리시스 방법을 적용하여 가입률을 향상시킨다. 제안된 방법의 효용성을 증명하기 위해서 히스테리시스 모델들을 적용한 네트워크 가입 방법을 구현하여 이동 노드의 경로에 따라 효율적으로 네트워크 가입됨을 보였다.