• Title/Summary/Keyword: J-lead

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Path planning of the J-lead inspection using hopfield model (홉필드 모델을 이용한 J-리드 검사 경로 생성)

  • 이중호;차영엽
    • 제어로봇시스템학회:학술대회논문집
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    • 1997.10a
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    • pp.1774-1777
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    • 1997
  • As factory automation is required, using the vision system is also essential. Especially, the pateh planning of parts with J-lead on PCB plays a import role of whole automation. Path planning is required because J-lead is scatteed compaed to L-lead on PCB. Therefore, in this paper, we propose path planning of part inspection with J-lead to use Hopfield Model(TSP : Traveling Salesman Problem). Then optical system suited to J-lead inspection is designed and the algorithm of J-lead solder joint and part inspection is proposed.

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A Study on J-lead Solder Joint Inspection of PCB Using Vision System (시각센서를 이용한 인쇄회로기판의 J-리드 납땜 검사에 관한 연구)

  • 유창목;차영엽;김철우;권대갑;윤한종
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.5
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    • pp.9-18
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    • 1998
  • The components with J-lead. which are more integrated and smaller than ones with Gull-wing. are rapidly being used in electronic board such as the PCB, for they have the advantage of occupying a small space compared to the other components. However, the development of inspection system for these new components is not so rapid as component development. Component-inspection with J-lead using vision system is difficult because they are hidden from camera optical axis. X-ray inspection, which has the advantage of inspecting the inside of solder state, is used to J-lead inspection. However. it is high cost and dangerous by leaking out X-ray compared to vision system. Therefore, in this paper, we design vision system suited to J-lead inspection and then propose algorithm which have flexibility in mount and rand error.

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A classification techiniques of J-lead solder joint using neural network (신경 회로망을 이용한 J-리드 납땜 상태 분류)

  • Yu, Chang-Mok;Lee, Joong-Ho;Cha, Young-Yeup
    • Journal of Institute of Control, Robotics and Systems
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    • v.5 no.8
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    • pp.995-1000
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    • 1999
  • This paper presents a optic system and a visual inspection algorithm looking for solder joint defects of J-lead chip which are more integrate and smaller than ones with Gull-wing on PCBs(Printed Circuit Boards). The visual inspection system is composed of three sections : host PC, imaging and driving parts. The host PC part controls the inspection devices and executes the inspection algorithm. The imaging part acquires and processes image data. And the driving part controls XY-table for automatic inspection. In this paper, the most important five features are extracted from input images to categorize four classes of solder joint defects in the case of J-lead chip and utilized to a back-propagation network for classification. Consequently, good accuracy of classification performance and effectiveness of chosen five features are examined by experiment using proposed inspection algorithm.

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The Effect of Relatively Low Lead Contents on the Phase Formation and Jc values of Bi-2223/Ag Tapes

  • Jiang, C.H.;Yoo, J.M.;Ko, J.W.;Kim, H.D.;Chung, H.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.04a
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    • pp.17-20
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    • 2002
  • The effects of relatively low lead content (0.2~0.3) on the 2223 phase formation and transport property of Bi-2223/Ag tapes have been investigated. The results show that lead contents have great impact on the phase assemblage of precursors, subsequently, on the phase formation and transport property of silver sheathed BSCCO-2223 tapes. Powders containing Pb=0.25 and Pb=0.3 resulted in the nearly identical $J_c$ values in fully processed tapes, but leaded to significant difference on the phase formation process. For the case of Pb=0.2, both low conversion fraction of 2212 to 2223 and low $J_c$ value were obtained in final reacted tape, which was probably due to lack of enough liquid phase to facilitate the phase transformation.

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Behaviour of lead-rubber bearings

  • Mori, Atsushi;Moss, P.J.;Carr, A.J.;Cooke, N.
    • Structural Engineering and Mechanics
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    • v.6 no.1
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    • pp.1-15
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    • 1998
  • Experimental work undertaken to investigate the behaviour of lead-rubber bearings under compression and a combination of compression and shear or rotation has been reported on elsewhere. However, it is difficult to determine the state of stress within the bearings in terms of the applied forces and the interaction between the lead plug and the steel shims and elastomeric layers. In order to supply some of the missing information about the stress-strain state within the bearings, an analytical study using the finite element method was carried out. The available experimental results were used to validate the model and although agreement was not as good as expected (on account of difficulties in modelling the lead plug), the analyses did provide some information about the state of the stress within the bearing.

Conceptual design of cooling anchor for current lead on HTS field coils

  • Hyeon, C.J.;Kim, J.H.;Quach, H.L.;Chae, S.H.;Yoon, Y.S.;Lee, J.;Han, S.H.;Jeon, H.;Choi, Y.H.;Lee, H.G.;Kim, H.M.
    • Progress in Superconductivity and Cryogenics
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    • v.19 no.2
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    • pp.38-43
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    • 2017
  • The role of current lead in high-temperature superconducting synchronous machine (HTSSM) is to function as a power supply by connecting the power supply unit at room temperature with the HTS field coils at cryogenic temperature. Such physical and electrical connection causes conduction and Joule-heating losses, which are major thermal losses of HTSSM rotors. To ensure definite stability and economic feasibility of HTS field coils, quickly and smoothly cooling down the current lead is a key design technology. Therefore, in this paper, we introduce a novel concept of a cooling anchor to enhance the cooling performance of a metal current lead. The technical concept of this technology is the simultaneously chilling and supporting the current lead. First, the structure of the current lead and cooling anchor were conceptually designed for field coils for a 1.5 MW-class HTSSM. Then, the effect of this installation on the thermal characteristics of HTS coils was investigated by 3D finite element analysis.

Simultaneous uptake of arsenic and lead using Chinese brake ferns (Pteris vittata) with EDTA and electrodics

  • Butcher, David J.;Lim, Jae-Min
    • Analytical Science and Technology
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    • v.32 no.1
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    • pp.1-6
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    • 2019
  • Chinese brake fern (Pteris vittata) has potential for application in the phytoremediation of arsenic introduced by lead arsenate-based pesticides. In this study, Chinese brake ferns were used to extract arsenic, mainly in field and greenhouse experiments, and to assess the performance of simultaneous phytoaccumulation of arsenic and lead from homogenized soil in the greenhouse, with the application of EDTA and electric potential. The ferns have been shown to be effective in accumulating high concentrations of arsenic, and extracting both arsenic and lead from the contaminated soil, with the addition of a chelating agent, EDTA. The maximum increase in lead accumulation in the ferns was 9.2 fold, with a 10 mmol/kg addition of EDTA. In addition, the application of EDTA in combination with electric potential increased the lead accumulation in ferns by 10.6 fold at 5 mmol/kg of EDTA and 40 V (dc), compared to controls. Therefore, under application of EDTA and electric potential, Chinese brake fern is able to extract arsenic and lead simultaneously from soil contaminated by lead arsenate.