• 제목/요약/키워드: J$_{}$ c/degradation

검색결과 244건 처리시간 0.039초

Integration Process and Reliability for $SrBi_2$ $Ta_2O_9$-based Ferroelectric Memories

  • Yang, B.;Lee, S.S.;Kang, Y.M.;Noh, K.H.;Hong, S.K.;Oh, S.H.;Kang, E.Y.;Lee, S.W.;Kim, J.G.;Shu, C.W.;Seong, J.W.;Lee, C.G.;Kang, N.S.;Park, Y.J.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권3호
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    • pp.141-157
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    • 2001
  • Highly reliable packaged 64kbit ferroelectric memories with $0.8{\;}\mu\textrm{m}$ CMOS ensuring ten-year retention and imprint at 125^{\circ}C$ have been successfully developed. These superior reliabilities have resulted from steady integration schemes free from the degradation, due to layer stress and attacks of process impurities. The resent results of research and development for ferroelectric memories at Hynix Semiconductor Inc. are summarized in this invited paper.

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후막 SmBCO/IBAD-MgO 초전도 박막선재의 제조 (Fabrication of Thick SmBCO/IBAD-MgO coated conductor)

  • 이정훈;강득균;하홍수;고락길;오상수;김호경;양주생;정승욱;문승현;염도준;김철진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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    • pp.9-9
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    • 2009
  • Coated conductor is required to have good critical current property for high efficiency of electric power applications. Until now, long coated conductor does not show high Jc over 3 MA/$cm^2$ in thick superconducting layer because of texture degradation by thick superconducting layer. In this study, in order to overcome this issue, thicker superconducting layer was deposited with optimized conditions to reduce the degradation of critical current density. SmBCO superconducting coated conductor was deposited with 1~3 um of thickness at $750\sim850^{\circ}C$ under 15~20 mTorr of oxygen partial pressure using batch type EDDC( evaporation using drum in dual chamber). The buffered substrate for superconducting layer deposition was used IBAD-MgO template with the architecture of $LaMnO_3/MgO/Y_2O_3/Al_2O_3$/Hastelloy. After fabrication of coated conductor, critical current was measured by 4-prove method under self-magnetic field and 77K. In addition, surface morphology and texture were analyzed by SEM and XRD, respectively. 3 um thick SmBCO coated conductor shows highest $I_C$ values of 638A/cm-w in 1 m long in the world.

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420J2 스테인리스강의 내식성에 미치는 저온 템퍼링의 영향 (Effect of Low Tempering Temperature on Corrosion Resistance of 420J2 Stainless Steel)

  • 정병호;김헌주;김무길;오이식;김동섭
    • 열처리공학회지
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    • 제17권1호
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    • pp.29-35
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    • 2004
  • The effect of low tempering in a temperature range of $150{\sim}400^{\circ}C$ on corrosion resistance in 420J2 stainless steel austenitized at $1000^{\circ}C$ was investigated by the application of salt spray test, electrochemical pitting test in 3.5% NaCl solution and DL-EPR test for intergranular corrosion in 0.5M $H_2SO_4$+0.01M KSCN solution. In salt spray test, good corrosion resistance was obtained in a tempering temperature range of $150{\sim}250^{\circ}C$. Pitting potential was increased to the tempering temperature of $250^{\circ}C$, but decreased with the increase of temperature up to $400^{\circ}C$ And it was thought that the degradation of pitting corrosion resistance showed at the tempering temperature of around $400^{\circ}C$ was due to the precipitation of $Cr_7C_3$ of $M_7C_3$ type. The degree of sensitization showed increasing tendency with the increase of tempering temperature, and also Cr depletion phenomena were observed in the vicinity of grain boundary.

Influence of pinching effect of exterior joints on the seismic behavior of RC frames

  • Favvata, Maria J.;Karayannis, Chris G.
    • Earthquakes and Structures
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    • 제6권1호
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    • pp.89-110
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    • 2014
  • Nonlinear dynamic analyses are carried out to investigate the influence of the pinching hysteretic response of the exterior RC beam-column joints on the seismic behavior of multistory RC frame structures. The effect of the pinching on the local and global mechanisms of an 8-storey bare frame and an 8-storey pilotis type frame structure is evaluated. Further, an experimental data bank extracted from literature is used to acquire experimental experience of the range of the real levels that have to be considered for the pinching effect on the hysteretic response of the joints. Thus, three different cases for the hysteretic response of the joints are considered: (a) joints with strength and stiffness degradation characteristics but without pinching effect, (b) joints with strength degradation, stiffness degradation and low pinching effect and (c) joints with strength degradation, stiffness degradation and high pinching effect. For the simulation of the beam-column joints a special-purpose rotational spring element that incorporates the examined hysteretic options developed by the authors and implemented in a well-known nonlinear dynamic analysis program is employed for the analysis of the structural systems. The results of this study indicate that the effect of pinching on the local and global responses of the examined cases is not really significant at early stages of the seismic loading and especially in the cases when strength degradation in the core of exterior joint has occurred. Nevertheless in the cases when strength degradation does not occur in the joints the pinching may increase the demands for ductility and become critical for the columns at the base floor of the frame structures. Finally, as it was expected the ability for energy absorption was reduced due to pinching effect.

등온 TGA 및 TMA를 이용한 NR고무소재의 내열수명 예측에 관한 연구 (A Study on the Thermal Life-Time Expectation of a NR Rubber Material using Isothermal TGA and TMA)

  • 안원술;박기호
    • Elastomers and Composites
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    • 제44권3호
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    • pp.269-273
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    • 2009
  • CR고무로 개질된 NR/CB 고무복합재료에 대하여 등온 TGA 및 TMA를 이용하여 열노화실험을 통하여 시험방법에 따른 재료의 화학적, 물리적 노화에 의한 재료의 수명예측에 대한 비교 연구를 진행하였다. 각각의 실험으로부터 얻은 데이터는 시간-온도 중첩 원리를 이용하여 이동인자 $a_T$를 구함으로서 $90^{\circ}C$의 기준온도에서의 마스터 곡선을 얻을 수 있었다. 또한 TGA 및 TMA실험에서의 노화활성화에너지는 실험적으로 결정된 이동인자의 Arrhenius plot에 의하여 결정될 수 있었으며 각각 $E_{a,TGA}$ = 41.2 및 $E_{a,TMA}$= 54.5 kJ/mol로서 TMA 실험에 의한 값이 약간 더 높게 계산되었다. 실험의 결과로부터 샘플의 중량감소를 가져오는 화학적인 노화는 치수변화 등의 물리적인 노화 현상과 밀접한 연관성을 가지는 것으로 생각되었다.

Cr-Mo강 용접열영향부에서의 고온 균열성장거동 연구 (HAZ Crack Growth Behavior of Cr-Mo Steel at Elevated Temperature)

  • 윤기봉;신규인;정용근;이해무
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 1997년도 특별강연 및 춘계학술발표 개요집
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    • pp.65-68
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    • 1997
  • Fracture behavior of ex-serviced 1Cr-0.5Mo steel was measured at room(24$^{\circ}C$) and elevated(538$^{\circ}C$) temperature and compared with that measured with virgin 1Cr-0.5Mo steel. Compact C(T) specimens were machined from the base and welded test materials. In case of the C(T) specimens of the weld, fatigue precrack was introduced along the fusion line so that a crack growth should occur along the region of heat affected zone. It was observed that the J-R curve of the serviced material was significantly lower than that of the virgin material at room temperature. Brittle fracture was observed in the serviced material. On the other hand at elevated temperature no noticeable difference was found between the J-R curves of the virgin and the serviced material. The measured J-R curves were also compared with those of the 1.25Cr-0.5Mo steel from other literatures. Optical microscopy and SEM examination of the serviced material reveal the carbide in/along the grain boundary which shows material degradation due to long-term usage.

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Physiological and Phylogenetic Analysis of Burkholderia sp. HY1 Capable of Aniline Degradation

  • Kahng, Hyung-Yeel;Jerome J. Kukor;Oh, Kye-Heon
    • Journal of Microbiology and Biotechnology
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    • 제10권5호
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    • pp.643-650
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    • 2000
  • A new aniline-utilizing microorganism, strain HY1 obtained from an orchard soil, was characterized by using the BIOLOG system, an analysis of the total cellular fatty acids, and a 16S rDNA sequence. Strain HY1 was identified as a Burkholderia species, and was designated Burkholderia sp. HY1. GC and HPLC analyses revealed that Burkholderia sp. HY1 was able to degrade aniline to produce catechol, which was subsequently converted to cis,cis-muconic acid through an ortho-ring fission pathway under aerobic conditions. Strain HY1 exhibited a drastic reduction in the rate of aniline degradation when glucose was added to the aniline media. However, the addition of peptone or nitrate to the aniline media dramatically accelerated the rate of aniline degradation. A fatty acid analysis showed that strain HY1 was able to produce lipids 16:0 2OH, and 11 methyl 18:1 ${\omega}7c$ approximately 3.7-, 2.2-, and 6-fold more, respectively, when grown on aniline media than when grown on TSA. An analysison the alignment of a 1,435 bp fragment. A phylogenetic analysis of the 16S rDNA sequence based on a 1,420 bp multi-alignment sowed of the 16s rDNA sequence revealed that strain HY1 was very closely related to Burkholderia graminis with 95% similarity based that strain HY1 was placed among three major clonal types of $\beta$-Proteobacteria, including Burkholderia graminis, Burkholderia phenazinium, and Burkholderia glathei. The sequence GAT(C or G)${\b{G}}$, which is highly conserved in several locations in the 16S rDNA gene among the major clonal type strains of $\beta$-Proteobacteria, was frequently replaced with GAT(C or G)${\b{A}}$ in the 16S rDNA sequence from strain HY1.

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자색고구마 품종별 안토시아닌 색소의 분해에 대한 속도론적 연구 (Degradation Kinetics of Anthocyanin Pigment Solutions from Purple-fleshed Sweet Potato Cultivars)

  • 박정섭;배재오;정봉우;정문웅;최동성
    • 한국식품영양학회지
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    • 제24권4호
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    • pp.559-566
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    • 2011
  • 국내에서 재배되는 목포 62호, 보라미, 자미, 신자미, 아야무라사키의 자색고구마 품종에 대해 안토시아닌 함량 및 pH에 따른 적색도, pH와 가열온도에 따른 안정성을 평가하였다. 그 결과, 안토시아닌 함량은 각 3.9, 3.8, 4.7, 4.1, 4.2 mg/g dry weight로 자미가 가장 높았으며, pH에 따른 a 값은 pH 3 에서 20.2, 59.3, 41.4, 37.7, 26.9로 보라미가 가장 높았다. pH에 따른 품종별 안토시아닌 색소의 반감기는 pH 3에서 22.2, 28.3, 26.3, 23.4, 22.7일로 보라미가 가장 안정하였다. 그리고 온도에 따른 품종별 안토시아닌 색소의 반감기는 온도가 낮을수록 증가하여 안정하였으며, 특히 자미는 $20^{\circ}C$에서 401일로 매우 높은 안정성을 나타냈다. 또한 가열온도에 따른 활성화에너지는 54.67, 60.93, 71.73, 59.35, 62.28 kJ/mol로 자미가 가장 높았다.

TFA-MOD법으로 제조된 다층 YBCO 박막의 미세구조 관찰 (Microstructural Observation of Multi-coated YBCO Films Prepared by TFA-MOD)

  • 장석헌;임준형;이창민;황수민;최준혁;심종현;주진호;김찬중
    • Progress in Superconductivity
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    • 제9권2호
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    • pp.167-172
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    • 2008
  • We fabricated $YBa_2Cu_3O_{7-x}$(YBCO) films on (00l) $LaAlO_3$ substrates prepared by metal organic deposition(MOD) method using trifluoroacetate(TFA) solution. The films with various thicknesses were prepared by repeating the dip-coating and calcining processes. The effects of film thickness on phase formation, microstructures, and critical properties were evaluated by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. The microstructure and resultant critical current($I_C$) and critical current density($J_C$) varied remarkably with film thickness: The ($I_C$) value increased from 39 to 160 A/cm-width as the number of coatings increased from one to four, while the corresponding $J_C$ was measured to be in the range of $0.84-1.21\;MA/cm^2$. Both the $I_C$ and $J_C$ decreased when an additional coating was applied due to microstructural degradation, indicating that the optimum thickness is in the range of $1.1-1.8\;{\mu}m$. The possible cause for the decrease in the $I_C$ and $J_C$ value for film thicker than $1.8\;{\mu}m$ include non-uniform thickness, increased surface roughness, and the poor formability of the YBCO phase and texture arising from the insufficient heat treatment time with respect to the increased thickness.

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Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Flip Chip on Flex Interconnections

  • Caers, J.F.J.M.;De Vries, J.W.C.;Zhao, X.J.;Wong, E.H.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제3권3호
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    • pp.122-131
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    • 2003
  • In this study, some characteristics of conductive and non-conductive adhesive inter-connections are derived, based on data from literature and own projects. Assembly of flip chip on flex is taken as a carrier. Potential failure mechanisms of adhesive interconnections reported in literature are reviewed. Some methods that can be used to evaluate the quality of adhesive interconnections and to evaluate their aging behavior are given. Possible finite element simulation approaches are introduced and the required critical materials properties are summarized. Response to temperature and moisture, resistance to reflow soldering and resistance to rapid change in temperature and humidity are elaborated. The effect of post cure during accelerated testing is discussed. This study shows that only a combined approach using finite element simulations, and use of appropriate experimental evaluation methods can result in revealing, understanding and quantifying the complex degradation mechanisms of adhesive interconnections during aging.