• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.798-802
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• 2002

Metallurgical studies on the bonded interlayer of directionally solidified Ni-base superalloy GTD111 joints were carried out during transient liquid phase bonding. The formation mechanism of solid during solidification process was also investigated. Microstructures at the bonded interlayer of joints were characterized with bonding temperature. In the bonding process held at 1403K, liquid insert metal was eliminated by well known mechanism of isothermal solidification process and formation of the solid from the liquid at the bonded interlayer were achieved by epitaxial growth. In addition, grain boundary formed at bonded interlayer is consistent with those of base metal. However, in the bonding process held at 1453K, extensive formation of the liquid phase was found to have taken place along dendrite boundaries and grain boundaries adjacent to bonded interlayer. Liquid phases were also observed at grain boundaries far from the bonding interface. This phenomenon results in liquation of grain boundaries. With prolonged holding, liquid phases decreased gradually and changed to isolated granules, but did not disappeared after holding for 7.2ks at 1473K. This isothermal solidification occurs by diffusion of Ti to be result in liquation. In addition, grain boundaries formed at bonded interlayer were corresponded with those of base metal. In the GTD-ll1 alloy, bonding mechanism differs with bonding temperature.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 1997년도 춘계학술강연 및 발표대회 강연 및 발표논문 초록집
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• pp.20-20
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• 1997

• Korean Chemical Engineering Research
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• 제52권2호
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• pp.199-204
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• 2014

2성분 응고계에서 다공성 mush 층에서의 조성 대류는 생성되는 제품의 질에 영향을 준다. 본 연구에서는 일정한 속도로 응고되는 mush 층을 고려하였다. 선형 안정성 이론을 사용하여 mush 층에 대한 교란방정식을 유도하였고, 기본상태 온도장과 mush 층에서 기공률의 분포를 수치해법으로 조사하였다. 과열량이 클 때 mush 층의 두께는 열경계층의 두께에 비해 상대적으로 작았다. 과열량이 감소함에 따라 mush 층의 두께를 기준으로 한 Rayleigh 수는 증가하였고, mush 층은 조성 대류에 대해 안정해졌다. mush 층의 윗면에 등온조건을 적용한 경우보다 온도 및 열속의 연속조건을 액체-mush 계면에 적용한 경우에 임계 Rayleigh 수가 더 작게 얻어졌다.

• 한국분말재료학회지
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• 제9권3호
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• pp.189-198
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• 2002

In this work, transient liquid phase (TLP) bonding of Ni-Cr heat resisted cast alloy (HP) was investigated. And also the behaviors of the solid particles distributed in the interlayer during TLP bonding were investigated. The MBF-60 and solid particles (Ni, Fe, and $Al_2O_3$ powders respectively) added MBF-60 which will be a liquid phase coexisting with solid particles at the bonding temperature were used as insert metal. The effective and sound bonding was possible by spark plasma sinter-bonding due to the differences of electric resistance between base metal and liquid insert layer which creates high temperature region. During the isothermal solidification, $Al_2O_3$ particles and solid particles of liquid phase sintered insert metal have shown no growth, while Ni and Fe particles grow rapidly. In this TLP bonding using the MBF-60 and distributed Fe, Ni particles as insert materials, the whole isothermal solidification process was dominated by the growth rate of the solid particles distributed in the interlayer.

• Corrosion Science and Technology
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• 제23권2호
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• pp.93-103
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• 2024

In the present work, a phase-field model for dendritic solidification is applied to hot-dip ZnAlMg coatings to elucidate the morphology of zinc dendrites and the solute segregation leading to the formation of eutectics. These aspects define the microstructure that conditions the corrosion resistance and the mechanical behaviour of the coating. Along with modelling phase transformation and solute diffusion, the implemented model is partially coupled with the tracking of crystal orientation in solid grains, thus allowing the effects of surface tension anisotropy to be considered in multi-dendrite simulations. For this purpose, the composition of a hot-dip ZnAlMg coating is assimilated to a dilute pseudo-binary system. 1D and 2D simulations of isothermal solidification are performed in a finite element solver by introducing nuclei as initial conditions. The results are qualitatively consistent with existing analytical solutions for growth velocity and concentration profiles, but the spatial domain of the simulations is limited by the required mesh refinement.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2001년도 학술대회 논문집
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• pp.9-12
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• 2001

The microstructure evolution and the peritectic solidification of Sm$Ba_{2}$$Cu_{3}$ $O_{7-\delta}$ superconducting materials during the isothermal annealing were studied over the temperature range 1030-$1060^{\circ}C$ The faceted growth of the peritectic phase and its dependence upon Sm-diffusion in the liquid phase are discussed. A growth model is proposed to explain the growth shape of Sm123 crystals.

• 대한기계학회논문집B
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• 제24권11호
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• pp.1437-1446
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• 2000

A numerical analysis on the freeze coating process of a non-isothermal finite dimensional plate with a binary alloy is performed to investigate the growth and decay behavior of the solid and the mushy layer of the freeze coat and a complete procedure to calculate the process is obtained in this study. The continuously varying solid and mushy layers are immobilized by a coordinate transform and the resulting governing differential equations are solved by a finite difference technique. To account for the latent heat release and property change during solidification, proper phase change models are adopted. And the convection in the liquid melt is modeled as an appropriate heat transfer boundary condition at the liquid/mushy interface. The present results are compared with analytic solutions derived for the freeze coating of infinite dimensional plates and the discrepancy is found to be less than 0.5 percent in relative magnitude for all simulation cases. In addition the conservation of thermal energy is checked. The results show that the freeze coat grows proportional to the 1.2 square of axial position as predicted by analytic solutions ar first. But after the short period of initial growth, the growth rate of the freeze coat gradually decreases and finally the freeze coat starts to decay. The effects of various non-dimensional processing parameters on the behavior of freeze coat are also investigated.

• 한국재료학회지
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• 제7권2호
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• pp.145-151
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• 1997

AI-xSi/ySiC( x:6~18wt%, y: 3~9wt%, SiC 입자크기: $10~28{\mu}m$) 복합재료를 재용해한 후 항온 유지하고 응고 시킬때 SiC 입자가 몰드의 하부로 침강하는 현상을 계통적으로 조사하였다. AI-Si/SiC 복합재료 용탕을 항온으로 유지하면 입자가 없는 지역은 유지시간이 약 처음 30분 동안 빠르게 증가한다. SiC 입자가 크기가 클수록 SiC입자의 크기가 클수록 SiC입자의 침강속도가 빠르다. 또한 복합재료중 철가한 SiC 입자의 부피분율이 증가하면 입자의 침강속도는 감소한다.

• 한국분말재료학회지
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• 제2권1호
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• pp.53-62
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• 1995

TLP(Transient-Liquid-Phase) bonding of Fe-base MA956 ODS alloy was performed. As insert metal a commercially available Ni-base alloy(MBF50) and an MA956 alloy with additive elements of 7wt% Si and 1wt% B were used. To confirm the idea that a concurrent use of MA956 powder with Insert metals can enhance the homogenization of constituent elements and thereby reduce the thickness of joint interface, MA956 powder was also inserted In a form of sheet. SEM observation and EDS analysis revealed that Cr-rich phase was formed in the bonded interface in initial stage of isothermal solidification during the bonding process, irrespective of kind of insert metals. Measurement of hardeness in the region of bonded interface and EDS analysis showed that a complete homogenization of composition could not be obtained especially in case of MBF50. Joints using either BSi insert metals only or BSi insert together with MA956 powder interlayer showed, however, a remarkable improvement in a compositional homogenization, even though a rapid grain growth in the bonded interface could not be hindered.

• Journal of Welding and Joining
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• 제35권3호
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• pp.52-61
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• 2017

Transient liquid phase (TLP) bonding is essential technology to repair micro-cracking on the airfoil of blades and vanes for gas turbines. Understanding of the characteristics of TLP bonding of the superalloys is necessary in the application of the technology for repairing these components. In this study, the focus was on investigating TLP bonding characteristics of ${\gamma}^{\prime}$ precipitation strengthened Ni based superalloy. TLP bonding was carried out with an amorphous filler metal in various bonding conditions, and the microstructural characterization was investigated through optical microscopy (OM) and electron probe micro-analysis (EPMA). The experimantal results explained clearly that bonding temperatures had critical effects on the TLP bonding behaviors, and that isothermal solidication of the joints made at higher temperatures than $1170^{\circ}C$ was controlled by Ti diffusion instead of B.